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UID:DABABD92-79CD-423C-8669-C2037AB3484B
DTSTART;TZID=America/New_York:20250206T180000
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DESCRIPTION:Distinguished Lecturer Seminar\n\n· When: Thursday\, Feb 6th @
  6:00 PM\n\n· Where: LOW 3051\n\nTalk Highlights\n\n· Fundamentals of fl
 ip chip and Cu-pillar technology.\n\n· Evolution from wire bonding to Cu-
 pillar for fine pitch interconnects.\n\n· Use of advanced laminates\, fan
 -out wafer-level packaging (FO-WLP)\, Si-bridges\, interposers\, and hybri
 d bonding.\n\nAbout the Speaker\n\n· Dr. Eric Perfecto is a leading exper
 t with over 42 years of industry experience.\n\n· Current Role: Heterogen
 eous Integration Packaging Technologist at IBM.\n\nSpeaker(s): Eric Perfec
 to\, \n\nRoom: 3051\, Bldg: George M. Low CII\, 110 8th St\, Troy \, New Y
 ork\, United States\, 12180
LOCATION:Room: 3051\, Bldg: George M. Low CII\, 110 8th St\, Troy \, New Yo
 rk\, United States\, 12180
ORGANIZER:kingd7@rpi.edu 
SEQUENCE:7
SUMMARY:Distinguished Lecture Seminar on Fine-Pitch Cu-Pillar Interconnects
  
URL;VALUE=URI:https://events.vtools.ieee.org/m/467008
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 als of flip chip and Cu-pillar technology.&amp;nbsp\;&lt;/span&gt;&lt;/p&gt;\n&lt;p style=&quot;ma
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 from wire bonding to Cu-pillar for fine pitch interconnects.&amp;nbsp\;&lt;/span&gt;
 &lt;/p&gt;\n&lt;p style=&quot;margin-left: .5in\; text-indent: 0in\; mso-list: l2 level1
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 . Eric Perfecto is a leading expert with over 42 years of industry experie
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 an style=&quot;color: black\;&quot;&gt;Current Role: Heterogeneous Integration Packagin
 g Technologist at IBM.&amp;nbsp\; &lt;/span&gt;&lt;/p&gt;
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