BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Central BEGIN:DAYLIGHT DTSTART:20170312T030000 TZOFFSETFROM:-0600 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:CDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20171105T010000 TZOFFSETFROM:-0500 TZOFFSETTO:-0600 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:CST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20180131T220605Z UID:3AA1B93A-8D7F-11E7-8752-0050568D2FB3 DTSTART;TZID=US/Central:20170919T180000 DTEND;TZID=US/Central:20170919T200000 DESCRIPTION:As traditional computing technologies continue to scale\, cost and process complexity has driven the industry to look for new sources of performance gains. 3D integration has shown to be a disruptive technology that has demonstrated dramatic improvements in system speed\, power consum ption\, and noise reduction. By reducing parasitic losses and improving co nnectivity\, 3D technologies can be used in conjunction with the most adva nced 2D technologies and offer a means to harness the full system performa nce potential. This presentation will review current industry advances\, a s well as a glimpse into the next generation of 3D.\n\nSpeaker Bio\n\nBria n Mattis is the Director of Integration Engineering at Novati Technologies \, leading the development and integration of emerging technologies. He pr ovides technology development and product commercialization solutions for companies exploringc\, MEMS\, BioMEMs\, and semiconductor technologies. Pr ior to Novati\, he held device engineering positions at Samsung and Intel\ , where he helped build the integration for the 45nm\, 32nm\, and 16nm nod es. Brian has extensive experience in device integration\, semiconductor p hysics\, technology pathfinding\, and risk analysis. Brian is a founding o fficer of the IEEE Central Texas MEMS & Sensors Chapter and holds Ph.D.\, M.S.\, and B.S. degrees from the University of California\, Berkeley in El ectrical Engineering\, with a minor in Material Science.\n\nCo-sponsored b y: Capital Factory\n\nAgenda: \n6:00 Doors\, light food & beverages\, netw orking\n\n7:00-7:50 Presentation\n\n7:50-8:00 Q&A\n\n8:00 End\n\nRoom: Mob ility X\, Capital Factory\, 701 Brazos Street\, Austin\, Texas\, United St ates\, 78701 LOCATION:Room: Mobility X\, Capital Factory\, 701 Brazos Street\, Austin\, Texas\, United States\, 78701 ORGANIZER:blunceford@memstronics.com SEQUENCE:7 SUMMARY:3D Integration in Advanced CMOS and Sensors URL;VALUE=URI:https://events.vtools.ieee.org/m/46766 X-ALT-DESC:Description: <br /><p>As traditional computing technologies cont inue to scale\, cost and process complexity has driven the industry to loo k for new sources of performance gains.&nbsp\; 3D integration has shown to be a disruptive technology that has demonstrated dramatic improvements in system speed\, power consumption\, and noise reduction. By reducing paras itic losses and improving connectivity\, 3D technologies can be used in co njunction with the most advanced 2D technologies and offer a means to harn ess the full system performance potential.&nbsp\; This presentation will r eview current industry advances\, as well as a glimpse into the next gener ation of 3D.</p>\n<p>&nbsp\;</p>\n<p>Speaker Bio</p>\n<p>Brian Mattis is t he Director of Integration Engineering at Novati Technologies\, leading th e development and integration of emerging technologies.&nbsp\; He provides technology development and product commercialization solutions for compan ies exploringc\, MEMS\, BioMEMs\, and semiconductor technologies. Prior to Novati\, he held device engineering positions at Samsung and Intel\, wher e he helped build the integration for the 45nm\, 32nm\, and 16nm nodes.&nb sp\; Brian has extensive experience in device integration\, semiconductor physics\, technology pathfinding\, and risk analysis. Brian is a founding officer of the IEEE Central Texas MEMS &amp\; Sensors Chapter and holds Ph .D.\, M.S.\, and B.S. degrees from the University of California\, Berkeley in Electrical Engineering\, with a minor in Material Science.&nbsp\;</p>< br /><br />Agenda: <br /><p>6:00 &nbsp\;Doors\, light food &amp\; beverage s\, networking</p>\n<p>7:00-7:50 Presentation</p>\n<p>7:50-8:00 Q&amp\;A</ p>\n<p>8:00 End</p> END:VEVENT END:VCALENDAR