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DESCRIPTION:Thermal Analysis for Thermal Challenges with Heterogeneous Pack
 aging\n\nAbstract:\n\nWith the commercialization of thermoreflectance ther
 mal imaging Microsanj has met many of the thermal challenges inherent with
  today’s advanced devices.\n\nThe thermoreflectance principle exploits t
 he fact that the reflectivity of a material changes with temperature. By m
 easuring the reflectivity change with probing wavelengths in the visible b
 and\, this technique supports thermal measurements with diffraction limite
 d spatial resolution in the sub-micron range and a temporal response in th
 e nanosecond range.\n\nNew thermal analysis challenges are arising with cu
 rrent trends and advances in heterogeneous packaging techniques. To addres
 s these new challenges\, Microsanj is developing enhancements and new prod
 ucts. A brief description of these techniques including optical pump-probe
  imaging\, flash thermography\, over-the-air imaging for the analysis of e
 mbedded antennas\, and others approaches being investigated will be provid
 ed in this presentation.\n\nBio:\n\nDustin Kendig\n\nDustin Kendig is Co-F
 ounder and Vice President of Microsanj LLC in Santa Clara\, California.\n\
 nAt Microsanj he is developing sub-micrometer transient thermal imaging sy
 stems for the semiconductor industry for thermal characterization and faul
 t isolation. Microsanj has 75+ commercial products and research partnershi
 ps with companies and research labs in a dozen countries.\n\nHe is a membe
 r of the IEEE Instrumentation and Measurement and Reliability Societies. I
 n 2009\, he was the recipient of the Huffman Prize\, Dean’s Award\, and 
 Chancellor’s Award. He won best poster at IEEE PVSC in 2010 and best pap
 er at IEEE ITherm in 2017. He holds 4 patents and has published over 60 pa
 pers.\n\nDustin Kendig received his B.S. Degree with Honors in Electrical 
 Engineering from the University of California\, Santa Cruz.\n\nAGENDA:\n\n
 Thursday March 6\, 2025\n\n11:30 AM: Networking\, Pizza &amp; Drinks\n\nNoon -
 - 1 pm: Seminar\n\nPlease register on Eventbrite before 9:30 AM on Thursda
 y February 6\, 2025\n\n$4 IEEE members $6 non IEEE members\n\n(discounts f
 or unemployed and students )\n\nSee examplesAdd\n\nCo-sponsored by: SCV/OE
 B/SF Jt. Section Chapter\,EP21\n\nBldg: ==&gt; Use corner entrance: Kifer Roa
 d / San Lucar Court ==&gt; Do not enter at main entrance on Kifer Road\, EAG 
 Labs\, 810 Kifer Road\, Sunnyvale\, California\, California\, United State
 s\, 95051
LOCATION:Bldg: ==&gt; Use corner entrance: Kifer Road / San Lucar Court ==&gt; Do
  not enter at main entrance on Kifer Road\, EAG Labs\, 810 Kifer Road\, Su
 nnyvale\, California\, California\, United States\, 95051
ORGANIZER:G.M.Friedman@ieee.org
SEQUENCE:34
SUMMARY:Thermal Analysis for Thermal Challenges with Heterogeneous Packagin
 g
URL;VALUE=URI:https://events.vtools.ieee.org/m/468737
X-ALT-DESC:Description: &lt;br /&gt;&lt;div class=&quot;eds-l-mar-vert-6 eds-l-sm-mar-ver
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 &quot;&gt;\n&lt;h1 class=&quot;event-title css-0&quot;&gt;Thermal Analysis for Thermal Challenges 
 with Heterogeneous Packaging&lt;/h1&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n&lt;div class=&quot;eds-l-mar-v
 ert-6 eds-l-sm-mar-vert-4 eds-text-bm structured-content-rich-text&quot;&gt;\n&lt;div
  class=&quot;eds-text--left&quot;&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;&lt;strong&gt;Abstract:&lt;/strong&gt;&lt;/
 h3&gt;\n&lt;h3&gt;With the commercialization of thermoreflectance thermal imaging M
 icrosanj has met many of the thermal challenges inherent with today&amp;rsquo\
 ;s advanced devices.&lt;/h3&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;The thermoreflectance princ
 iple exploits the fact that the reflectivity of a material changes with te
 mperature. By measuring the reflectivity change with probing wavelengths i
 n the visible band\, this technique supports thermal measurements with dif
 fraction limited spatial resolution in the sub-micron range and a temporal
  response in the nanosecond range.&lt;/h3&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;New thermal a
 nalysis challenges are arising with current trends and advances in heterog
 eneous packaging techniques. To address these new challenges\, Microsanj i
 s developing enhancements and new products. A brief description of these t
 echniques including optical pump-probe imaging\, flash thermography\, over
 -the-air imaging for the analysis of embedded antennas\, and others approa
 ches being investigated will be provided in this presentation.&lt;/h3&gt;\n&lt;p&gt;&amp;n
 bsp\;&lt;/p&gt;\n&lt;h3&gt;&amp;nbsp\;&amp;nbsp\;&lt;/h3&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n&lt;div class=&quot;&quot; data-tes
 tid=&quot;image-content&quot;&gt;\n&lt;div class=&quot;eds-l-mar-vert-6 eds-l-sm-mar-vert-4 eds
 -text-bm undefined&quot;&gt;\n&lt;div class=&quot;eds-fx--fade-in&quot;&gt;&amp;nbsp\;&lt;/div&gt;\n&lt;/div&gt;\n
 &lt;/div&gt;\n&lt;div class=&quot;eds-l-mar-vert-6 eds-l-sm-mar-vert-4 eds-text-bm struc
 tured-content-rich-text&quot;&gt;\n&lt;div class=&quot;eds-text--left&quot;&gt;\n&lt;h3&gt;Bio:&lt;/h3&gt;\n&lt;d
 iv class=&quot;css-188aeyp e9y8vn50&quot;&gt;\n&lt;div id=&quot;AboutThisEventSection&quot; class=&quot;c
 ss-cd870x em1van10&quot; tabindex=&quot;0&quot; role=&quot;button&quot; data-testid=&quot;AboutThisEvent
 Section&quot; aria-label=&quot;Overview. Use this section to provide more details ab
 out your event. You can include things to know\, venue information\, acces
 sibility options&amp;mdash\;anything that will help people know what to expect
 .&quot;&gt;\n&lt;div id=&quot;AboutThisEventPreview&quot; class=&quot;css-1dykrq ezg9ojv5&quot; data-test
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 class=&quot;css-1hbyxwu e1pmrtpl0&quot;&gt;\n&lt;h1&gt;Dustin Kendig&lt;/h1&gt;\n&lt;h3&gt;Dustin Kendig 
 is Co-Founder and Vice President of Microsanj LLC in Santa Clara\, Califor
 nia.&lt;/h3&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;At Microsanj he is developing sub-micromete
 r transient thermal imaging systems for the semiconductor industry for the
 rmal characterization and fault isolation. Microsanj has 75+ commercial pr
 oducts and research partnerships with companies and research labs in a doz
 en countries.&lt;/h3&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;He is a member of the IEEE Instrum
 entation and Measurement and Reliability Societies. In 2009\, he was the r
 ecipient of the Huffman Prize\, Dean&amp;rsquo\;s Award\, and Chancellor&amp;rsquo
 \;s Award. He won best poster at IEEE PVSC in 2010 and best paper at IEEE 
 ITherm in 2017. He holds 4 patents and has published over 60 papers.&lt;/h3&gt;\
 n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;Dustin Kendig received his B.S. Degree with Honors in
  Electrical Engineering from the University of California\, Santa Cruz.&lt;/h
 3&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;AGENDA:&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;s
 trong&gt;Thursday March 6&lt;/strong&gt;&lt;strong&gt;\, 2025&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;11
 :30 AM: Networking\, Pizza &amp;amp\; Drinks&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Noon -- 
 1 pm: Seminar&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Please register on Eventbrite befor
 e 9:30 AM on&lt;/strong&gt;&lt;strong&gt; Thursday February 6\, 2025&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;
 &lt;strong&gt;$4 IEEE members&amp;nbsp\; $6 non IEEE members &lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;stro
 ng&gt;(discounts for unemployed and students&lt;/strong&gt; )&lt;/p&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n
 &lt;/div&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n&lt;div class=&quot;css-y3qgqv ehpy08z1&quot; tabindex=&quot;0&quot; data
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 oter&gt;\n&lt;h3&gt;&amp;nbsp\;&lt;/h3&gt;\n&lt;/div&gt;\n&lt;/div&gt;
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