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DTSTART:20170312T030000
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DTSTART:20171105T010000
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BEGIN:VEVENT
DTSTAMP:20170919T211945Z
UID:62D149B5-932A-11E7-8752-0050568D2FB3
DTSTART;TZID=US/Pacific:20170920T180000
DTEND;TZID=US/Pacific:20170920T203000
DESCRIPTION:Modern electromagnetic simulation is founded on the vision that
  all electronic design is fundamentally based on Maxwell’s Equations\, t
 hus solving them directly would one day become the basis for the highest p
 erformance design. That day is today.\n\nJoin us for an evening event and 
 dinner as Dr. Williams presents how engineers deliver design innovation fo
 r 5G and IoT systems using advanced physics-based simulation. You will see
  that superior design can be delivered using advanced engineering simulati
 on and high-performance computing leading to advantage for both large corp
 orations and small start-ups.\n\nIndustry examples from 5G and IoT applica
 tions will be highlighted. An active phased array antenna system for real-
 time beamforming and high-bandwidth communications will be shown using mul
 ti-scale and multi-domain simulation. It will be shown that modern electro
 magnetic field solvers can combine with circuits and systems for base stat
 ion antenna system modeling.\n\nTopics in RFIC module design for sub-6GHz 
 applications will be described\, and layout-based design assembly will be 
 covered to illustrate how a combination of multi-die laminate structures c
 an be designed. Dr. Williams will also revisit a recent NXP presentation s
 howing how they utilized a multiphysics design flow for large-signal RF Po
 wer devices allowing them to create a device model for RF circuit simulati
 on but also to identify temperature distribution across wirebonds.\n\nIoT 
 examples will also be explored illustrating challenges of oil refinery ant
 enna placement and antenna design for an IoT smart meter. The presentation
  concludes with multi-Physics design of smartphone handsets for sub-6GHz 5
 G Readiness showing antenna match sensitivity to temperature along with hi
 s vision on what the future will bring and how it will impact organization
 s that embrace it.\n\nCo-sponsored by: VTS\, APS\, SPS\, EMBS\, CS\n\nSpea
 ker(s): Dr. Larry Williams\, \, Dr. Larry Williams\, \, Dr. Larry Williams
 \, \, Dr. Larry Williams\, \, Dr. Larry Williams\, \, Dr. Larry Williams\,
  \, Dr. Larry Williams\, \n\nAgenda: \n6:00 - 6:30 pm - Dinner and network
 ing\n\n6:30 - 8:00 pm - Dr. Williams 5G presentation\n\n8:00 - 8:30 pm - Q
 &amp;A and networking\n\nBldg: Hopper Hall \, Coleman University \, 8888 Balbo
 a Ave. \, San Diego\, California\, United States\, 92123
LOCATION:Bldg: Hopper Hall \, Coleman University \, 8888 Balboa Ave. \, San
  Diego\, California\, United States\, 92123
ORGANIZER:verly.flores@ansys.com
SEQUENCE:4
SUMMARY:5G and IoT Design Innovation Through Simulation
URL;VALUE=URI:https://events.vtools.ieee.org/m/46908
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;Modern electromagnetic simulation is found
 ed on the vision that all electronic design is fundamentally based on Maxw
 ell&amp;rsquo\;s Equations\, thus solving them directly would one day become t
 he basis for the highest performance design. That day is today.&lt;/p&gt;\n&lt;p&gt;Jo
 in us for an evening event and dinner as Dr. Williams presents how enginee
 rs deliver design innovation for 5G and IoT systems using advanced physics
 -based simulation. You will see that superior design can be delivered usin
 g advanced engineering simulation and high-performance computing leading t
 o advantage for both large corporations and small start-ups.&lt;/p&gt;\n&lt;p&gt;Indus
 try examples from 5G and IoT applications will be highlighted. An active p
 hased array antenna system for real-time beamforming and high-bandwidth co
 mmunications will be shown using multi-scale and multi-domain simulation. 
 It will be shown that modern electromagnetic field solvers can combine wit
 h circuits and systems for base station antenna system modeling.&lt;/p&gt;\n&lt;p&gt;T
 opics in RFIC module design for sub-6GHz applications will be described\, 
 and layout-based design assembly will be covered to illustrate how a combi
 nation of multi-die laminate structures can be designed. Dr. Williams will
  also revisit a recent NXP presentation showing how they utilized a multip
 hysics design flow for large-signal RF Power devices allowing them to crea
 te a device model for RF circuit simulation but also to identify temperatu
 re distribution across wirebonds.&lt;/p&gt;\n&lt;p&gt;IoT examples will also be explor
 ed illustrating challenges of oil refinery antenna placement and antenna d
 esign for an IoT smart meter. The presentation concludes with multi-Physic
 s design of smartphone handsets for sub-6GHz 5G Readiness showing antenna 
 match sensitivity to temperature along with his vision on what the future 
 will bring and how it will impact organizations that embrace it.&lt;/p&gt;&lt;br /&gt;
 &lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;6:00 - 6:30 pm - Dinner and networking&lt;/p&gt;\n&lt;p&gt;6:30
  - 8:00 pm - Dr. Williams&amp;nbsp\;5G&amp;nbsp\;presentation&lt;/p&gt;\n&lt;p&gt;8:00 - 8:30 
 pm - Q&amp;amp\;A and networking&lt;/p&gt;
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