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DTSTAMP:20250316T200323Z
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DESCRIPTION:Seminar\n\n- When: March 13th\, 2025\n- Where: LOW 3051\, RPI C
 ampus\n\nTalk Highlights\n\n- Fundamentals of the metallurgical and electr
 omigration behavior of SAC305 and eutectic Sn-Bi solder alloys.\n- Mechani
 sms of element migration in solder joints under high current stressing.\n-
  Formation of intermetallic phases and their impact on electrical resistan
 ce over time.\n- Comparison of electromigration effects in Sn-Bi and SAC30
 5 solder joints before void coalescence.\n\nAbout the Speaker\n\n- Dr. Pra
 bjit Singh is a Senior Technical Staff Member at IBM Poughkeepsie with 46 
 years of experience in metallurgical engineering for mainframe computer po
 wer\, packaging\, cooling\, and reliability.\n- Current Role: IBM Master I
 nventor and expert in data center contamination and reliability.\n- Academ
 ic Contributions: Former graduate course instructor in Power Electronics a
 t SUNY New Paltz\; author of an ASHRAE book on data center contamination.\
 n- Achievements: Holder of 89 issued patents\, Distinguished Alumnus of th
 e Indian Institute of Technology\, and an iNEMI Fellow.\n\nSpeaker(s): Dr.
  Singh\n\nAgenda: \n6:00 PM – Seminar Begins\n\n7:00 PM – Seminar Fini
 shes\n\n7:00 PM – Q&amp;A and Group Photo\n\n7:10 PM – Pizza Dinner and Di
 scussion\n\n8:00 PM – Clean Up\n\nRoom: LOW 3051\, Bldg: Low Center for 
 Industrial Innovation\, 1645 15th St\, Troy\, New York\, United States\, 1
 2180
LOCATION:Room: LOW 3051\, Bldg: Low Center for Industrial Innovation\, 1645
  15th St\, Troy\, New York\, United States\, 12180
ORGANIZER:kingd7@rpi.edu
SEQUENCE:22
SUMMARY:Seminar on Fundamentals of Electromigration in SAC305 and Sn-Bi Sol
 der Joints
URL;VALUE=URI:https://events.vtools.ieee.org/m/471083
X-ALT-DESC:Description: &lt;br /&gt;&lt;h3 data-start=&quot;107&quot; data-end=&quot;132&quot;&gt;&lt;strong d
 ata-start=&quot;111&quot; data-end=&quot;130&quot;&gt;Seminar&lt;/strong&gt;&lt;/h3&gt;\n&lt;ul&gt;\n&lt;li data-start
 =&quot;107&quot; data-end=&quot;132&quot;&gt;When: March 13th\, 2025&lt;/li&gt;\n&lt;li data-start=&quot;107&quot; d
 ata-end=&quot;132&quot;&gt;Where: LOW 3051\, RPI Campus&lt;/li&gt;\n&lt;/ul&gt;\n&lt;h3 data-start=&quot;10
 7&quot; data-end=&quot;132&quot;&gt;&lt;strong data-start=&quot;111&quot; data-end=&quot;130&quot;&gt;Talk Highlights&lt;
 /strong&gt;&lt;/h3&gt;\n&lt;ul data-start=&quot;133&quot; data-end=&quot;520&quot;&gt;\n&lt;li data-start=&quot;133&quot; 
 data-end=&quot;244&quot;&gt;Fundamentals of the metallurgical and electromigration beha
 vior of SAC305 and eutectic Sn-Bi solder alloys.&lt;/li&gt;\n&lt;li data-start=&quot;245
 &quot; data-end=&quot;327&quot;&gt;Mechanisms of element migration in solder joints under hi
 gh current stressing.&lt;/li&gt;\n&lt;li data-start=&quot;328&quot; data-end=&quot;418&quot;&gt;Formation 
 of intermetallic phases and their impact on electrical resistance over tim
 e.&lt;/li&gt;\n&lt;li data-start=&quot;419&quot; data-end=&quot;520&quot;&gt;Comparison of electromigratio
 n effects in Sn-Bi and SAC305 solder joints before void coalescence.&lt;/li&gt;\
 n&lt;/ul&gt;\n&lt;h3 data-start=&quot;522&quot; data-end=&quot;549&quot;&gt;&lt;strong data-start=&quot;526&quot; data-
 end=&quot;547&quot;&gt;About the Speaker&lt;/strong&gt;&lt;/h3&gt;\n&lt;ul data-start=&quot;550&quot; data-end=&quot;
 1444&quot; data-is-last-node=&quot;&quot; data-is-only-node=&quot;&quot;&gt;\n&lt;li data-start=&quot;550&quot; dat
 a-end=&quot;754&quot;&gt;&lt;strong data-start=&quot;552&quot; data-end=&quot;573&quot;&gt;Dr. Prabjit Singh&lt;/str
 ong&gt; is a Senior Technical Staff Member at IBM Poughkeepsie with 46 years 
 of experience in metallurgical engineering for mainframe computer power\, 
 packaging\, cooling\, and reliability.&lt;/li&gt;\n&lt;li data-start=&quot;755&quot; data-end
 =&quot;853&quot;&gt;&lt;strong data-start=&quot;757&quot; data-end=&quot;774&quot;&gt;Current Role:&lt;/strong&gt; IBM 
 Master Inventor and expert in data center contamination and reliability.&lt;/
 li&gt;\n&lt;li data-start=&quot;854&quot; data-end=&quot;1014&quot;&gt;&lt;strong data-start=&quot;856&quot; data-en
 d=&quot;883&quot;&gt;Academic Contributions:&lt;/strong&gt; Former graduate course instructor
  in Power Electronics at SUNY New Paltz\; author of an ASHRAE book on data
  center contamination.&lt;/li&gt;\n&lt;li data-start=&quot;1015&quot; data-end=&quot;1147&quot;&gt;&lt;strong
  data-start=&quot;1017&quot; data-end=&quot;1034&quot;&gt;Achievements:&lt;/strong&gt; Holder of 89 iss
 ued patents\, Distinguished Alumnus of the Indian Institute of Technology\
 , and an iNEMI Fellow.&lt;/li&gt;\n&lt;/ul&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p class=&quot;MsoN
 ormal&quot;&gt;&lt;span style=&quot;mso-fareast-font-family: &#39;Times New Roman&#39;\; color: bl
 ack\;&quot;&gt;6:00 PM &amp;ndash\; Seminar Begins&amp;nbsp\;&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNor
 mal&quot;&gt;&lt;span style=&quot;mso-fareast-font-family: &#39;Times New Roman&#39;\; color: blac
 k\;&quot;&gt;7:00 PM &amp;ndash\; Seminar Finishes&amp;nbsp\;&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNor
 mal&quot;&gt;&lt;span style=&quot;mso-fareast-font-family: &#39;Times New Roman&#39;\; color: blac
 k\;&quot;&gt;7:00 PM &amp;ndash\; Q&amp;amp\;A and Group Photo&amp;nbsp\;&lt;/span&gt;&lt;/p&gt;\n&lt;p class
 =&quot;MsoNormal&quot;&gt;&lt;span style=&quot;mso-fareast-font-family: &#39;Times New Roman&#39;\; col
 or: black\;&quot;&gt;7:10 PM &amp;ndash\; Pizza Dinner and Discussion&amp;nbsp\;&lt;/span&gt;&lt;/p
 &gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;span style=&quot;mso-fareast-font-family: &#39;Times New R
 oman&#39;\; color: black\;&quot;&gt;8:00 PM &amp;ndash\; Clean Up&lt;/span&gt;&lt;/p&gt;
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