BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Canada/Eastern BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250328T200616Z UID:B6E7839D-C103-408E-BDC7-62F900267927 DTSTART;TZID=Canada/Eastern:20250325T120000 DTEND;TZID=Canada/Eastern:20250325T150000 DESCRIPTION:Abstract :\n\nAIM Photonics\, a Department of Defense (DoD) Man ufacturing Innovation Institute (MII)\, offers end-to-end services in phot onic integrated circuits (PICs)\, interposers\, heterogeneous integration (HI)\, electronic photonic design automation (EPDA)\, and packaging. AIM P hotonics leverages the 300 mm Albany NanoTech Complex and the Test Assembl y and Packaging (TAP) facility in Rochester\, NY\, to provide these state- of-the-art capabilities. As a DoD MII\, AIM Photonics’ mission is to adv ance the photonics and packaging industries to help improve the U.S. ecosy stem and build a skilled workforce.\n\nThis talk will focus on how AIM Pho tonics is accomplishing its mission. To help advance the ecosystem\, AIM P hotonics offers interposer technologies and the two fundamental PIC techno logies: Base Multi-Project Wafer (MPW) and SiN MPW\, which are optimized f or sensors. In addition to the current offerings\, AIM Photonics will soon offer a Quantum Flex (QFlex) MPW optimized for quantum applications.\n\nB ecause of the challenges in photonic packaging\, packaging PIC chips into functional optoelectronic systems has not fully incorporated the advances made in electronic packaging. Addressing these challenges will require a c oordinated development of PIC fabrication processes and packaging technolo gies. An end-to-end development cycle that includes the PIC and packaging is critical. This talk will discuss the AIM Photonics ecosystem and provid e specific examples to illustrate co-processing and co-design.\n\nAnother challenge that AIM Photonics is addressing is the development of a skilled workforce. This talk will share an overview of our education and workforc e development programs\, which aim to build a qualified workforce to suppo rt the U.S. ecosystem.\n\nCo-sponsored by: McGill Optica Student Chapter\n \nSpeaker(s): David Harame\n\nAgenda: \n12 - 1:30 pm: networking lunch\, w ith students (on-site only)\n1:30 – 3 pm: technical seminar presentation (hybrid)\n\nRoom: MC603\, 6th floor\, Bldg: McConnell Engineering buildin g\, 3480 rue University\, Montreal\, Quebec\, Canada\, H3A 0C3\, Virtual: https://events.vtools.ieee.org/m/472834 LOCATION:Room: MC603\, 6th floor\, Bldg: McConnell Engineering building\, 3 480 rue University\, Montreal\, Quebec\, Canada\, H3A 0C3\, Virtual: https ://events.vtools.ieee.org/m/472834 ORGANIZER:matthew.t.posner@ieee.org SEQUENCE:19 SUMMARY:An End-to-End Approach to the Challenges in Photonic Integrated Cir cuits (PIC) and Packaging URL;VALUE=URI:https://events.vtools.ieee.org/m/472834 X-ALT-DESC:Description: <br /><p><strong>Abstract :</strong> &nbsp\;</p>\n< p>AIM Photonics\, a Department of Defense (DoD) Manufacturing Innovation I nstitute (MII)\, offers end-to-end services in photonic integrated circuit s (PICs)\, interposers\, heterogeneous integration (HI)\, electronic photo nic design automation (EPDA)\, and packaging. AIM Photonics leverages the 300 mm Albany NanoTech Complex and the Test Assembly and Packaging (TAP) f acility in Rochester\, NY\, to provide these state-of-the-art capabilities . As a DoD MII\, AIM Photonics&rsquo\; mission is to advance the photonics and packaging industries to help improve the U.S. ecosystem and build a s killed workforce.&nbsp\;</p>\n<p>This talk will focus on how AIM Photonics is accomplishing its mission. To help advance the ecosystem\, AIM Photoni cs offers interposer technologies and the two fundamental PIC technologies : Base Multi-Project Wafer (MPW) and SiN MPW\, which are optimized for sen sors. In addition to the current offerings\, AIM Photonics will soon offer a Quantum Flex (QFlex) MPW optimized for quantum applications.</p>\n<p>Be cause of the challenges in photonic packaging\, packaging PIC chips into f unctional optoelectronic systems has not fully incorporated the advances m ade in electronic packaging. Addressing these challenges will require a co ordinated development of PIC fabrication processes and packaging technolog ies. An end-to-end development cycle that includes the PIC and packaging i s critical. This talk will discuss the AIM Photonics ecosystem and provide specific examples to illustrate co-processing and co-design.</p>\n<p>Anot her challenge that AIM Photonics is addressing is the development of a ski lled workforce. This talk will share an overview of our education and work force development programs\, which aim to build a qualified workforce to s upport the U.S. ecosystem.&nbsp\;</p>\n<p>&nbsp\;</p>\n<p>&nbsp\;</p><br / ><br />Agenda: <br /><div>12 - 1:30 pm: networking lunch\, with students ( on-site only)</div>\n<div>1:30 &ndash\; 3 pm: technical seminar presentati on (hybrid)</div> END:VEVENT END:VCALENDAR