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DTSTAMP:20250416T115310Z
UID:4F145B5F-D4CF-4845-B79F-824AF1EA04D4
DTSTART;TZID=Europe/Amsterdam:20250410T080000
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DESCRIPTION:Seminar overview\n\nHeterogeneous system integration\, packagin
 g and reliability play a crucial role for the current and future developme
 nt of semiconductors\, quantum technologies and photonics. They are the ke
 y enabler to create new functionalities and business opportunities through
  the integration of different\ntypes of cost-effective and high-performanc
 e chips\, technologies and materials into a single system.\nThis seminar w
 ill discuss the progress and future challenges of heterogeneous integratio
 n\, packaging\, reliability and the potentials of creating more industry a
 nd business value.\nJoin us to explore the exciting opportunities that het
 erogeneous system integration can offer for the European ecosystem.\n\nCo-
 sponsored by: IEEE EPS Benelux Section Chapter\n\nSpeaker(s): Chris\, Gama
 l\, Xuejun\, Mudasir\, Saurabh\n\nAgenda: \nAgenda:\n\n08:30-08:50 - Welco
 me coffee\n\n08:50-09:00 - Welcome speech\n\n09:00-09:35 - Prof. Dr. Chris
  Bailey\n\n09:35-10:10 - Dr. Gamal Refai-Ahmed\n\n10:10-10:45 - Prof. Dr. 
 Xuejun Fan\n\n10:45-11:20 - Mudasir Ahmad\n\n11:20-11:55 - Saurabh Singhir
 \n\nRoom: EEMCS-Lecture Hall Chip\, Bldg: 36.HB.01.600\, TU Delft\, Cornel
 is Drebbelweg\, Delft\, Noord-Holland\, Netherlands\, 2628 CB
LOCATION:Room: EEMCS-Lecture Hall Chip\, Bldg: 36.HB.01.600\, TU Delft\, Co
 rnelis Drebbelweg\, Delft\, Noord-Holland\, Netherlands\, 2628 CB
ORGANIZER:pgromala@ieee.org
SEQUENCE:30
SUMMARY:IEEE EPS Seminar: Progress and future of heterogenous system integr
 ation\, packaging and reliability
URL;VALUE=URI:https://events.vtools.ieee.org/m/473625
X-ALT-DESC:Description: <br /><p>Seminar overview</p>\n<p>Heterogeneous sys
 tem integration\, packaging and reliability play a crucial role for the cu
 rrent and future development of semiconductors\, quantum technologies and 
 photonics. They are the key enabler to create new functionalities and busi
 ness opportunities through the integration of different<br>types of cost-e
 ffective and high-performance chips\, technologies and materials into a si
 ngle system.<br>This seminar will discuss the progress and future challeng
 es of heterogeneous integration\, packaging\, reliability and the potentia
 ls of creating more industry and business value.<br>Join us to explore the
  exciting opportunities that heterogeneous system integration can offer fo
 r the European ecosystem.</p><br /><br />Agenda: <br /><p>Agenda:</p>\n<p>
 08:30-08:50 - Welcome coffee</p>\n<p>08:50-09:00 - Welcome speech</p>\n<p>
 09:00-09:35 - Prof. Dr. Chris Bailey</p>\n<p>09:35-10:10 - Dr. Gamal Refai
 -Ahmed</p>\n<p>10:10-10:45 - Prof. Dr. Xuejun Fan</p>\n<p>10:45-11:20 - Mu
 dasir Ahmad</p>\n<p>11:20-11:55 - Saurabh Singhir</p>
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