BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Denver BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0700 TZOFFSETTO:-0600 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:MDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0600 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:MST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250426T190304Z UID:E765E2AA-92E9-4897-B01D-758839DC781C DTSTART;TZID=America/Denver:20250417T180000 DTEND;TZID=America/Denver:20250417T200000 DESCRIPTION:Come join us for this Dine and Learn event hosted by the Denver Section and University of Colorado Boulder. You're invited to participate in an exciting and engaging presentation titled "From Wafers to Cutting-E dge Products: The process of Testing\, Packaging\, and Design" by Tim Swet tlen.\n\nWhether you're a college student eager to expand your knowledge o r a technical professional looking to stay informed in this evolving indus try\, this presentation aims to cover the key test and assembly stages tha t deliver functional products to market.\n\n* Food and beverage will be pr ovided.\n\n* Parking code will be provided to event registrants.\n\nAbstra ct:\n\nAs Moore’s Law slows down on transistor density at the die level\ , advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes\, a thorough unde rstanding of the testing flow is important as more die are stacked on a si ngle final product.\n\nThis talk starts as the wafer exits the fab\, is ex posed to a battery of tests and routed to its highest value package and pr oduct. Each die on the wafer is processed on the same test flow but its te sting results will direct it to different bins sold at different selling p rices. These complex test flows allow the right parts to be assembled into the best final product whether it’s an advanced smart phone or an entry level AI accelerator card.\n\nCo-sponsored by: University of Colorado Bou lder\n\nSpeaker(s): Tim Swettlen\, \n\nAgenda: \nAgenda:\n\n6:00- 6:30PM F ood and networking\n\n6:30-7:30 PM Presentation\n\n7:30- 8:00 PM Q&A Disc ussion\n\n8:00 PM Adjourn\n\nRoom: 1B70\, Bldg: Discovery Learning Center (DLC)\, University of Colorado Boulder\, 1095 Regent Drive\, Boulder\, Col orado\, United States\, 80309\, Virtual: https://events.vtools.ieee.org/m/ 476572 LOCATION:Room: 1B70\, Bldg: Discovery Learning Center (DLC)\, University of Colorado Boulder\, 1095 Regent Drive\, Boulder\, Colorado\, United States \, 80309\, Virtual: https://events.vtools.ieee.org/m/476572 ORGANIZER:mona.elhelbawy@colorado.edu SEQUENCE:64 SUMMARY:IEEE Denver Dine & Learn: From Wafers to Cutting-Edge Products: The Process of Testing\, Packaging\, and Design URL;VALUE=URI:https://events.vtools.ieee.org/m/476572 X-ALT-DESC:Description: <br /><div style="caret-color: rgb(33\, 33\, 33)\; color: rgb(33\, 33\, 33)\; font-family: Aptos\; font-size: 16px\; font-sty le: normal\; font-variant-caps: normal\; font-weight: 400\; letter-spacing : normal\; orphans: auto\; text-align: start\; text-indent: 0px\; text-tra nsform: none\; white-space: normal\; widows: auto\; word-spacing: 0px\; -w ebkit-text-stroke-width: 0px\; text-decoration: none\; background-color: r gb(255\, 255\, 255)\; margin: 12pt 0px\;">\n<p class="MsoNormal">Come join us for this Dine and Learn event hosted by the Denver Section and Univers ity of Colorado Boulder.&nbsp\;You're invited to participate in an excitin g and engaging presentation titled&nbsp\;"From Wafers to Cutting-Edge Prod ucts: The process of Testing\, Packaging\, and Design" by Tim Swettlen.</p >\n<p class="MsoNormal">Whether you're a college student eager to expand y our knowledge or a technical professional looking to stay informed in this evolving industry\, this presentation aims to cover the key test and asse mbly stages that deliver functional products to market.</p>\n<p class="Mso Normal">* Food and beverage will be provided.</p>\n<p class="MsoNormal">* Parking code will be provided to event registrants.</p>\n<p class="MsoNorm al"><strong><span style="text-decoration: underline\;">Abstract: </span></ strong></p>\n<p class="MsoNormal">As Moore&rsquo\;s Law slows down on tran sistor density at the die level\, advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes\, a thorough understanding of the testing flow is important as more die are stacked on a single final product.</p>\n<p class="MsoNorm al">This talk starts as the wafer exits the fab\, is exposed to a battery of tests and routed to its highest value package and product. Each die on the wafer is processed on the same test flow but its testing results will direct it to different bins sold at different selling prices. These comple x test flows allow the right parts to be assembled into the best final pro duct whether it&rsquo\;s an advanced smart phone or an entry level AI acce lerator card.</p>\n</div><br /><br />Agenda: <br /><p><span style="text-de coration: underline\;"><strong>Agenda:</strong></span></p>\n<p><strong>6:0 0- 6:30PM</strong>&nbsp\; &nbsp\; Food and networking</p>\n<p><strong>6:30 -7:30 PM </strong>&nbsp\; &nbsp\;Presentation</p>\n<p><strong>7:30- 8:00 P M</strong>&nbsp\; &nbsp\;Q&amp\;A Discussion</p>\n<p><strong>8:00</strong> <strong>PM</strong>&nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\ ;Adjourn</p> END:VEVENT END:VCALENDAR