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DTSTART:20251102T010000
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DTSTAMP:20260208T140055Z
UID:E394CD2E-F3DE-4DBA-AF5D-AC1C9971FA44
DTSTART;TZID=America/New_York:20250418T080000
DTEND;TZID=America/New_York:20250418T133000
DESCRIPTION:The IEEE EDS/EPS MHV and RPI Chapters are excited to announce t
 he upcoming 2nd Mini-Colloquium (MQ) 2025 on Semiconductor Technology Evol
 ution\, which will take place at CBIS Auditorium\, RPI campus\, on April 1
 8th\, 2025.\n\nThis occasion presents a unique chance to gain insights fro
 m industry experts\, delve into topical issues\, and explore potential car
 eer opportunities as part of the CHIPS Workforce Development initiative.\n
 \nThe event is open to ALL! No IEEE membership required to register. Regis
 tration is mandatory to attend.\n\nCo-sponsored by: EDS MHV Chapter\n\nSpe
 aker(s): Dr. Poliks\, Dr. Lau\, Dr. Joshi\, Dr. Kerber\n\nAgenda: \nTime		
 Agenda\n08:00 – 08:40		Registration\nBreakfast and Refreshments\n08:40 
 – 08:55\n\nOpening Remarks\nDr. Farooq\, IBM\, EDS Mid-Hudson Valley Cha
 ir\n\nDr. Hull\, Vice President for Research\, Henry Burlage Jr. Professor
  of Engineering\, and Director of Center for Materials\, Devices\, and Int
 egrated Systems\n\nDr. Wen\, Russell Sage Professor and Head\, Electrical\
 , Computer\, and Systems Engineering\n09:00 – 09:45		Speaker 1: Mark Pol
 iks\, Distinguished Professor of Materials Science and Engineering and Sys
 tems Science and Industrial Engineering at the Thomas J. Watson College of
  Engineering and Applied Science\, Binghamton University\n\nTitle: Printin
 g\, Placing and Interconnecting Electronic Functions On Available Surfaces
 : Enabling Hybrid and Additive Approaches To Medical and Industrial Device
 s\n09:45 – 09:50		Q&amp;A / Transition (5 minutes)\n09:50 – 10:35		Speaker
  2: John H Lau\, IEEE Fellow\, IMAPS Fellow\, ASME Fellow\, Senior Packagi
 ng Engineer at Unimicron\n\nTitle: Flip Chip Technology – Solder Bumps\,
  Microbumps\, and Bumpless Cu-Cu Hybrid Bonding\n10:40 – 11:00		Break / 
 Networking Session\n11:00 – 11:45	[Rajiv Joshi]	Speaker 3: Rajiv V. Josh
 i\, IEEE Life Fellow\, IEEE Daniel Noble Award Winner\, Vice President of 
 Industry for IEEE Circuits and Systems Society\, Research Scientist at IBM
  T. J. Watson Research Center\n\nTitle: Invaluable Memories\n11:45 – 11:
 50		Q&amp;A / Transition (5 minutes)\n11:50 – 12:35\n[]\n\nSpeaker 4: Andrea
 s Kerber\, IEEE Senior Member\, IEEE Electron Devices Society Distinguishe
 d Lecturer\, CMOS Reliability Expert at Intel\n\nTitle: Reliability of Met
 al Gate / High-K CMOS devices\n\n12:40 – 13:30		Lunch\n\nRoom: Auditoriu
 m and Gallery\, Bldg: Center for Biotechnology and Interdisciplinary Studi
 es\, 110 8th St\, Troy\, New York\, United States\, 12180
LOCATION:Room: Auditorium and Gallery\, Bldg: Center for Biotechnology and 
 Interdisciplinary Studies\, 110 8th St\, Troy\, New York\, United States\,
  12180
ORGANIZER:kingd7@rpi.edu
SEQUENCE:133
SUMMARY:IEEE EPS RPI / EDS MHV - 2nd Mini-Colloquium: Semiconductor Technol
 ogy Evolution
URL;VALUE=URI:https://events.vtools.ieee.org/m/476707
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;The IEEE EDS/EPS MHV and RPI Chapters are 
 excited to announce the upcoming 2nd Mini-Colloquium (MQ) 2025 on Semicond
 uctor Technology Evolution\, which will take place at CBIS Auditorium\, RP
 I campus\, on April 18th\, 2025.&lt;/p&gt;\n&lt;p&gt;This occasion presents a unique c
 hance to gain insights from industry experts\, delve into topical issues\,
  and explore potential career opportunities as part of the CHIPS Workforce
  Development initiative.&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;The event is open
  to ALL! No IEEE membership required to register. Registration is mandator
 y to attend.&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;table 
 style=&quot;border-collapse: collapse\; width: 663px\; height: 1651.44px\; bord
 er-width: 1px\; border-spacing: 0px\;&quot; border=&quot;1&quot; width=&quot;467&quot; cellspacing=
 &quot;0&quot; cellpadding=&quot;0&quot;&gt;&lt;colgroup&gt;&lt;col style=&quot;width: 184px\;&quot; width=&quot;125&quot;&gt;&lt;col
  style=&quot;width: 172px\;&quot;&gt;&lt;col style=&quot;width: 307px\;&quot; width=&quot;342&quot;&gt;&lt;/colgroup
 &gt;\n&lt;tbody&gt;\n&lt;tr style=&quot;height: 22.3906px\;&quot;&gt;\n&lt;td class=&quot;xl67&quot; style=&quot;heig
 ht: 22.3906px\; width: 94pt\; border-width: 1px\;&quot; width=&quot;125&quot; height=&quot;19&quot;
 &gt;&lt;strong&gt;Time&lt;/strong&gt;&lt;/td&gt;\n&lt;td style=&quot;width: 128pt\; height: 22.3906px\;
  border-width: 1px\;&quot;&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/td&gt;\n&lt;td class=&quot;xl67&quot; styl
 e=&quot;width: 128pt\; height: 22.3906px\; border-width: 1px\;&quot; width=&quot;342&quot;&gt;&lt;st
 rong&gt;Agenda&lt;/strong&gt;&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;height: 67.1719px\;&quot;&gt;\n&lt;td cl
 ass=&quot;xl66&quot; style=&quot;height: 67.1719px\; width: 94pt\; border-width: 1px\;&quot; w
 idth=&quot;125&quot; height=&quot;39&quot;&gt;08:00 &amp;ndash\; 08:40&lt;/td&gt;\n&lt;td style=&quot;width: 128pt\
 ; height: 67.1719px\; border-width: 1px\;&quot;&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/td&gt;\n
 &lt;td class=&quot;xl65&quot; style=&quot;width: 128pt\; height: 67.1719px\; border-width: 1
 px\;&quot; width=&quot;342&quot;&gt;&lt;strong&gt;Registration&lt;/strong&gt;&lt;span class=&quot;font0&quot;&gt; &lt;br&gt;Br
 eakfast and Refreshments&lt;/span&gt;&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;height: 440.281px\
 ;&quot;&gt;\n&lt;td class=&quot;xl66&quot; style=&quot;height: 440.281px\; width: 94pt\; border-widt
 h: 1px\;&quot; width=&quot;125&quot; height=&quot;87&quot;&gt;08:40 &amp;ndash\; 08:55&lt;/td&gt;\n&lt;td style=&quot;wi
 dth: 128pt\; text-align: center\; height: 440.281px\; border-width: 1px\;&quot;
 &gt;\n&lt;p&gt;&lt;strong&gt;&lt;img src=&quot;https://events.vtools.ieee.org/vtools_ui/media/dis
 play/ec258de7-771b-452a-b2a0-1822c2d65393&quot; width=&quot;120&quot;&gt;&lt;/strong&gt;&lt;strong&gt;&lt;i
 mg src=&quot;https://faculty.rpi.edu/sites/default/files/2023-07/RobertHull-May
 2023-500x500.jpg&quot; width=&quot;120&quot;&gt;&lt;/strong&gt;&lt;strong&gt;&lt;img src=&quot;https://faculty.r
 pi.edu/sites/default/files/2022-08/wenpic2019small.jpg&quot; width=&quot;120&quot;&gt;&lt;/stro
 ng&gt;&lt;/p&gt;\n&lt;/td&gt;\n&lt;td class=&quot;xl65&quot; style=&quot;width: 128pt\; height: 440.281px\;
  border-width: 1px\;&quot; width=&quot;342&quot;&gt;&lt;strong&gt;Opening Remarks &lt;/strong&gt;&lt;span c
 lass=&quot;font5&quot;&gt;&lt;br&gt;&lt;/span&gt;&lt;span class=&quot;font0&quot;&gt;Dr. Farooq\, IBM\, EDS Mid-Hud
 son Valley Chair&lt;/span&gt;&lt;span class=&quot;font5&quot;&gt;&lt;br&gt;&lt;/span&gt;&lt;span class=&quot;font0&quot;&gt;
 &lt;br&gt;Dr. Hull\, Vice President for Research\, Henry Burlage Jr. Professor o
 f Engineering\, and Director of Center for Materials\, Devices\, and Integ
 rated Systems&lt;br&gt;&lt;br&gt;Dr. Wen\, &lt;/span&gt;Russell Sage Professor and Head\, El
 ectrical\, Computer\, and Systems Engineering&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;heig
 ht: 246.297px\;&quot;&gt;\n&lt;td class=&quot;xl66&quot; style=&quot;height: 246.297px\; width: 94pt
 \; border-width: 1px\;&quot; width=&quot;125&quot; height=&quot;210&quot;&gt;09:00 &amp;ndash\; 09:45&lt;/td&gt;
 \n&lt;td style=&quot;width: 128pt\; text-align: center\; height: 246.297px\; borde
 r-width: 1px\;&quot;&gt;&lt;strong&gt;&lt;img src=&quot;https://events.vtools.ieee.org/vtools_ui
 /media/display/579575eb-a3b9-474b-a90b-bc2ce1da3d51&quot; width=&quot;120&quot;&gt;&lt;/strong&gt;
 &lt;/td&gt;\n&lt;td class=&quot;xl65&quot; style=&quot;width: 128pt\; height: 246.297px\; border-w
 idth: 1px\;&quot; width=&quot;342&quot;&gt;&lt;strong&gt;Speaker 1: Mark Poliks&lt;/strong&gt;\, Disting
 uished Professor of Materials Science and Engineering and Systems Science 
 and Industrial Engineering at the Thomas J. Watson College of Engineering 
 and Applied Science\, Binghamton University&lt;br&gt;&lt;br&gt;Title:&lt;span class=&quot;font
 0&quot;&gt; Printing\, Placing and Interconnecting Electronic Functions On Availab
 le Surfaces: Enabling Hybrid and Additive Approaches To Medical and Indust
 rial Devices&lt;/span&gt;&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;height: 77.8594px\;&quot;&gt;\n&lt;td cla
 ss=&quot;xl66&quot; style=&quot;height: 77.8594px\; width: 94pt\; border-width: 1px\;&quot; wi
 dth=&quot;125&quot; height=&quot;78&quot;&gt;09:45 &amp;ndash\; 09:50&lt;/td&gt;\n&lt;td style=&quot;width: 128pt\;
  height: 77.8594px\; border-width: 1px\;&quot;&gt;&amp;nbsp\;&lt;/td&gt;\n&lt;td class=&quot;xl65&quot; s
 tyle=&quot;width: 128pt\; height: 77.8594px\; border-width: 1px\;&quot; width=&quot;342&quot;&gt;
 Q&amp;amp\;A / Transition&lt;span class=&quot;font0&quot;&gt; (5 minutes)&lt;/span&gt;&lt;/td&gt;\n&lt;/tr&gt;\n
 &lt;tr style=&quot;height: 180px\;&quot;&gt;\n&lt;td class=&quot;xl66&quot; style=&quot;height: 180px\; widt
 h: 94pt\; border-width: 1px\;&quot; width=&quot;125&quot; height=&quot;117&quot;&gt;09:50 &amp;ndash\; 10:
 35&lt;/td&gt;\n&lt;td style=&quot;width: 128pt\; height: 180px\; border-width: 1px\;&quot;&gt;&lt;s
 trong&gt;&lt;img style=&quot;display: block\; margin-left: auto\; margin-right: auto\
 ;&quot; src=&quot;https://events.vtools.ieee.org/vtools_ui/media/display/a0a304eb-b7
 28-4b66-bc53-906f57ad4892&quot; width=&quot;120&quot;&gt;&lt;/strong&gt;&lt;/td&gt;\n&lt;td class=&quot;xl65&quot; st
 yle=&quot;width: 128pt\; height: 180px\; border-width: 1px\;&quot; width=&quot;342&quot;&gt;&lt;stro
 ng&gt;Speaker 2: John H Lau&lt;/strong&gt;\, IEEE Fellow\, IMAPS Fellow\, ASME Fell
 ow\, Senior Packaging Engineer at Unimicron&lt;br&gt;&lt;br&gt;Title:&lt;span class=&quot;font
 0&quot;&gt; Flip Chip Technology &amp;ndash\; Solder Bumps\, Microbumps\, and Bumpless
  Cu-Cu Hybrid Bonding&lt;/span&gt;&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;height: 77.8594px\;&quot;&gt;
 \n&lt;td class=&quot;xl66&quot; style=&quot;height: 77.8594px\; width: 94pt\; border-width: 
 1px\;&quot; width=&quot;125&quot; height=&quot;78&quot;&gt;10:40 &amp;ndash\; 11:00&lt;/td&gt;\n&lt;td style=&quot;width
 : 128pt\; height: 77.8594px\; border-width: 1px\;&quot;&gt;&amp;nbsp\;&lt;/td&gt;\n&lt;td class
 =&quot;xl65&quot; style=&quot;width: 128pt\; height: 77.8594px\; border-width: 1px\;&quot; wid
 th=&quot;342&quot;&gt;Break / Networking Session&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;height: 156.73
 4px\;&quot;&gt;\n&lt;td class=&quot;xl66&quot; style=&quot;height: 156.734px\; width: 94pt\; border-
 width: 1px\;&quot; width=&quot;125&quot; height=&quot;117&quot;&gt;11:00 &amp;ndash\; 11:45&lt;/td&gt;\n&lt;td styl
 e=&quot;width: 128pt\; height: 156.734px\; border-width: 1px\;&quot;&gt;&lt;span class=&quot;fo
 nt6&quot;&gt;&lt;strong&gt;&lt;img style=&quot;display: block\; margin-left: auto\; margin-right
 : auto\;&quot; src=&quot;https://ieeesystemscouncil.org/files/ieeesyscouncil/styles/
 responsive_4_5_760w/public/images/contacts/Rajiv%20Joshi%20JSSCC%202022.jp
 g?h=5f0e43ea&amp;amp\;itok=Ja9xxi5K&quot; alt=&quot;Rajiv Joshi&quot; width=&quot;120&quot;&gt;&lt;/strong&gt;&lt;/
 span&gt;&lt;/td&gt;\n&lt;td class=&quot;xl68&quot; style=&quot;width: 128pt\; height: 156.734px\; bor
 der-width: 1px\;&quot; width=&quot;342&quot;&gt;&lt;span class=&quot;font6&quot;&gt;&lt;strong&gt;Speaker 3: Rajiv
  V. Joshi&lt;/strong&gt;\, IEEE Life Fellow\, IEEE Daniel Noble Award Winner\, V
 ice President of Industry for IEEE Circuits and Systems Society\, Research
  Scientist at IBM T. J. Watson Research Center&lt;br&gt;&lt;br&gt;Title:&lt;/span&gt;&lt;span c
 lass=&quot;font7&quot;&gt; Invaluable Memories&lt;/span&gt;&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;height: 7
 7.8594px\;&quot;&gt;\n&lt;td class=&quot;xl66&quot; style=&quot;height: 77.8594px\; width: 94pt\; bo
 rder-width: 1px\;&quot; width=&quot;125&quot; height=&quot;78&quot;&gt;11:45 &amp;ndash\; 11:50&lt;/td&gt;\n&lt;td 
 style=&quot;width: 128pt\; height: 77.8594px\; border-width: 1px\;&quot;&gt;&amp;nbsp\;&lt;/td
 &gt;\n&lt;td class=&quot;xl65&quot; style=&quot;width: 128pt\; height: 77.8594px\; border-width
 : 1px\;&quot; width=&quot;342&quot;&gt;Q&amp;amp\;A / Transition&lt;span class=&quot;font0&quot;&gt; (5 minutes)
 &lt;/span&gt;&lt;/td&gt;\n&lt;/tr&gt;\n&lt;tr style=&quot;break-before: page\; height: 227.125px\;&quot;&gt;
 \n&lt;td class=&quot;xl66&quot; style=&quot;height: 227.125px\; width: 94pt\; border-width: 
 1px\;&quot; width=&quot;125&quot; height=&quot;117&quot;&gt;11:50 &amp;ndash\; 12:35&lt;/td&gt;\n&lt;td style=&quot;widt
 h: 128pt\; height: 227.125px\; border-width: 1px\;&quot;&gt;\n&lt;p&gt;&lt;strong&gt;&lt;img styl
 e=&quot;display: block\; margin-left: auto\; margin-right: auto\;&quot; src=&quot;https:/
 /events.vtools.ieee.org/vtools_ui/media/display/c9145a80-aac0-42b3-bd5d-9a
 6af2bacd6d&quot; alt=&quot;&quot; width=&quot;120&quot; height=&quot;160&quot;&gt;&lt;br&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;/td&gt;\n&lt;td 
 class=&quot;xl65&quot; style=&quot;width: 128pt\; height: 227.125px\; border-width: 1px\;
 &quot; width=&quot;342&quot;&gt;\n&lt;p&gt;&lt;strong&gt;Speaker 4: Andreas Kerber&lt;/strong&gt;\, IEEE Senio
 r Member\, IEEE Electron Devices Society Distinguished Lecturer\, CMOS Rel
 iability Expert at Intel&lt;br&gt;&lt;br&gt;Title:&lt;span class=&quot;font0&quot;&gt; Reliability of 
 Metal Gate / High-K CMOS devices&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;/td&gt;\n&lt;/tr&gt;\
 n&lt;tr style=&quot;height: 77.8594px\;&quot;&gt;\n&lt;td class=&quot;xl66&quot; style=&quot;height: 77.8594
 px\; width: 94pt\; border-width: 1px\;&quot; width=&quot;125&quot; height=&quot;78&quot;&gt;12:40 &amp;nda
 sh\; 13:30&lt;/td&gt;\n&lt;td style=&quot;width: 128pt\; height: 77.8594px\; border-widt
 h: 1px\;&quot;&gt;&amp;nbsp\;&lt;/td&gt;\n&lt;td class=&quot;xl65&quot; style=&quot;width: 128pt\; height: 77.
 8594px\; border-width: 1px\;&quot; width=&quot;342&quot;&gt;Lunch&lt;/td&gt;\n&lt;/tr&gt;\n&lt;/tbody&gt;\n&lt;/t
 able&gt;
END:VEVENT
END:VCALENDAR