BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250424T200810Z UID:4D8618BA-9347-4FBE-981F-B8F77DF9106C DTSTART;TZID=America/Los_Angeles:20250424T120000 DTEND;TZID=America/Los_Angeles:20250424T130000 DESCRIPTION:The Analytical & Diagnostics Laboratory (ADL)\, an initiative u nder Binghamton University’s S3IP Center of Excellence\, is a centralize d\, interdisciplinary research facility. Partnering with the Integrated El ectronics Engineering Center (IEEC)\, a New York State Center for Advanced Technology\, the ADL advances electronics packaging\, reliability\, and m anufacturing research. Together\, they drive innovation in systems integra tion\, flexible electronics\, renewable energy\, and medical devices.\nMan y industry partners collaborate with us for our advanced instrumentation\, stress testing capability\, and failure analysis expertise. In this talk\ , we will review several case studies that center around these topics in m icroelectronics. For example\, in modern high-powered applications\, elect romigration which has been predominately a chip level phenomenon is now a concern for circuit boards with BGA sized features. We will show the progr ession from test vehicle design through stress evaluation into failure cha racterization. Another example centers around identification of an open ci rcuit in a functional printed circuit board. We will further elaborate on techniques used to isolate failures and identify failure mechanisms as wel l as the relationship between these mechanisms and typical environmental s tresses.\n\nSee LOCATION tab for WebEx info\n\nSpeaker(s): Jennifer Sammak ia\, Stephen Cain\n\nAgenda: \nSee LOCATION tab for WebEx info\n\nVirtual: https://events.vtools.ieee.org/m/479386 LOCATION:Virtual: https://events.vtools.ieee.org/m/479386 ORGANIZER:p.wesling@ieee.org SEQUENCE:26 SUMMARY:Electronics Packaging Case Studies at Binghamton University URL;VALUE=URI:https://events.vtools.ieee.org/m/479386 X-ALT-DESC:Description: <br /><p><span style="font-size: 18pt\;">The Analyt ical &amp\; Diagnostics Laboratory (ADL)\, an initiative under Binghamton University&rsquo\;s S3IP Center of Excellence\, is a centralized\, interdi sciplinary research facility. Partnering with the Integrated Electronics E ngineering Center (IEEC)\, a New York State Center for Advanced Technology \, the ADL advances electronics packaging\, reliability\, and manufacturin g research. Together\, they drive innovation in systems integration\, flex ible electronics\, renewable energy\, and medical devices.</span><br><span style="font-size: 18pt\;">&nbsp\; &nbsp\;Many industry partners collabora te with us for our advanced instrumentation\, stress testing capability\, and failure analysis expertise. In this talk\, we will review several case studies that center around these topics in microelectronics. For example\ , in modern high-powered applications\, electromigration which has been pr edominately a chip level phenomenon is now a concern for circuit boards wi th BGA sized features. We will show the progression from test vehicle desi gn through stress evaluation into failure characterization. Another exampl e centers around identification of an open circuit in a functional printed circuit board. We will further elaborate on techniques used to isolate fa ilures and identify failure mechanisms as well as the relationship between these mechanisms and typical environmental stresses.</span></p>\n<p>&nbsp \;</p>\n<p><span style="font-size: 18pt\;">See LOCATION tab for WebEx info </span></p><br /><br />Agenda: <br /><p><span style="font-size: 18pt\;">Se e LOCATION tab for WebEx info</span></p> END:VEVENT END:VCALENDAR