BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Sao_Paulo
BEGIN:DAYLIGHT
DTSTART:20380119T001407
TZOFFSETFROM:-0300
TZOFFSETTO:-0300
RRULE:FREQ=YEARLY;BYDAY=3TU;BYMONTH=1
TZNAME:-03
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20190216T230000
TZOFFSETFROM:-0200
TZOFFSETTO:-0300
RRULE:FREQ=YEARLY;BYDAY=3SA;BYMONTH=2
TZNAME:-03
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20250421T123811Z
UID:37E63AF3-A8C1-4451-9A00-13CDCE66D715
DTSTART;TZID=America/Sao_Paulo:20250414T133000
DTEND;TZID=America/Sao_Paulo:20250414T150000
DESCRIPTION:Embedded HPC &amp; Reliable Accelerator Integration in the AI Age b
 y Open EDA &amp; Eco Systems\n\nIncreasing emerging fields towards reliable em
 bedded accelerator and processor integration\, incl. High-Performance Comp
 uting(HPC) systems\, are “essential and challenging forces” driving ac
 tual and future silicon technologies. This results in heterogenous multi-c
 ore (MC)\, various vector accelerator incl. artificial intelligence (AI) a
 nd networked cyber-physical systems (CPS) integration. Here\, on one side 
 increasing monolythic integration of cooperating computational and physica
 l sensor components is necessary\, e. g. in embedded and smart on-demand a
 utomatized environments as diverse as applied in communication/consumer\, 
 automotive/transportation\, avionics\, civil infrastructure\, energy\, hea
 lthcare\, manufacturing (Industry 4.0)\, and also space appliances. Moreov
 er\, future complex dynamically adaptive and multi-domain electronic syste
 m integration tends to be more and more dependent on distributed real-time
  and embedded HPC availability. This results in the strong demand of newly
  operating decentralized/centralized intelligent\, interconnected\, and si
 licon technology integrated solutions\, subject to increased performance n
 eeds to facilitate computationally intensive algorithms\, power consumptio
 n to be minimized\, as well as sufficient degrees of reliability and verif
 iability to employ digital systems in highly networked as well as safety-c
 ritical environments\, e. g. in future embedded\, incl.6G\, automotive etc
 . system integration\, driven by software-defined approaches. Existing tec
 hnologies must evolve in order to meet such scalable and high requirements
 \, whereas Open Source Hardware &amp; Softwareincl. explainable AI-based compo
 nents will also play key roles in this actual dynamic development. Multipu
 rpose adaptivity\, connectivity and reliability are crucial\, especially i
 n scaling down silicon technologies according to “Extending Moore” for
  future processor technologies incl. dynamically reconfigurable and AI-dri
 ven accelerators. This requires new open EDA approaches with standardized 
 tool flows towards efficient heterogenous system integration. The talk wil
 l present important challenges of high-end heterogenous Multi-Core/Acceler
 ator HPC platforms by reliable SoC and SiPhardware/software integration wi
 th smart\, scalable\, reliable &amp; embedded accelerator &amp; processor solution
 s. This includes corresponding Global Ecosystem discussions in the presenc
 e of RISC-V\, national &amp; European Chipact\, 6G and automotive initiatives 
 whereas necessary AI &amp; chipdesign aspects have to be considered.\n\nThe ta
 lk will in addition sketch in this context some selected communication &amp; a
 utomotive related project initiatives like Open6GHub (6G for Society and S
 ustainability - https://www.open6ghub.de/en/)\, EPI (European Processor In
 itiative - [https://www.european-processor-initiative.eu](https://www.euro
 pean-processor-initiative.eu/))\, XANDAR (Safety and Security for Embedded
  Software Systems - [https://xandar-project.eu](https://xandar-project.eu/
 ))\, ZuSE-KI-mobil (Platform for energy-efficient AI processors in mobile 
 applications - https://www.itiv.kit.edu/english/201_8016.php)\, and the na
 tional project CeCaS (CentralCarServer - https://www.itiv.kit.edu/english/
 201_8769.php)\, among others.\n\nCo-sponsored by: UFRGS\n\nSpeaker(s): Jur
 gen Becker\, \n\nBldg: 43413\, Av. Bento Gonçalves\, 9500 - UFRGS Campus 
 do Vale\, Auditório do Instituto de Informática\, Porto Alegre\, Rio Gra
 nde do Sul\, Brazil\, 91509-900
LOCATION:Bldg: 43413\, Av. Bento Gonçalves\, 9500 - UFRGS Campus do Vale\,
  Auditório do Instituto de Informática\, Porto Alegre\, Rio Grande do Su
 l\, Brazil\, 91509-900
ORGANIZER:grellert@ieee.org
SEQUENCE:9
SUMMARY:Embedded HPC &amp; Reliable Accelerator Integration in the AI Age by Op
 en EDA &amp; Eco Systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/481098
X-ALT-DESC:Description: &lt;br /&gt;&lt;div&gt;\n&lt;div&gt;&lt;strong&gt;Embedded HPC &amp;amp\; Relia
 ble Accelerator Integration in the AI Age by Open EDA &amp;amp\; Eco Systems&lt;/
 strong&gt;&lt;/div&gt;\n&lt;/div&gt;\n&lt;div&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/div&gt;\n&lt;div&gt;\n&lt;div&gt;&lt;s
 pan lang=&quot;EN-US&quot;&gt;Increasing emerging fields towards reliable embedded acce
 lerator and processor integration\, incl.&amp;nbsp\;&lt;em&gt;High-Performance Compu
 ting&lt;/em&gt;(HPC)&lt;em&gt;&amp;nbsp\;&lt;/em&gt;systems\, are &amp;ldquo\;essential and challeng
 ing forces&amp;rdquo\; driving actual and future silicon technologies. This re
 sults in heterogenous&amp;nbsp\;&lt;em&gt;multi-core&lt;/em&gt;&amp;nbsp\;(MC)\, various vecto
 r accelerator incl.&lt;em&gt;&amp;nbsp\;artificial intelligence&amp;nbsp\;&lt;/em&gt;(AI) and 
 networked&amp;nbsp\;&lt;em&gt;cyber-physical systems&lt;/em&gt;&amp;nbsp\;(CPS) integration. H
 ere\, on one side increasing monolythic integration of cooperating computa
 tional and physical sensor components is necessary\, e. g. in embedded and
  smart&amp;nbsp\;&lt;em&gt;on-demand&lt;/em&gt;&amp;nbsp\;automatized environments as diverse 
 as applied in communication/consumer\, automotive/transportation\, avionic
 s\, civil infrastructure\, energy\, healthcare\, manufacturing (&lt;em&gt;Indust
 ry 4.0&lt;/em&gt;)\, and also space appliances. Moreover\, future complex dynami
 cally adaptive and multi-domain electronic system integration tends to be 
 more and more dependent on distributed real-time and&amp;nbsp\;&lt;em&gt;embedded HP
 C&amp;nbsp\;&lt;/em&gt;availability. This results in the strong demand of newly oper
 ating decentralized/centralized intelligent\, interconnected\, and silicon
  technology integrated solutions\, subject to increased performance needs&lt;
 strong&gt;&amp;nbsp\;&lt;/strong&gt;to facilitate computationally intensive algorithms\
 , power consumption&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;to be minimized\, as well as su
 fficient degrees of reliability and verifiability to employ digital system
 s in highly networked as well as safety-critical environments\, e. g. in f
 uture embedded\, incl.6G\, automotive etc. system integration\, driven by 
 software-defined approaches.&amp;nbsp\;&lt;/span&gt;&lt;span lang=&quot;EN-US&quot;&gt;Existing tech
 nologies must evolve in order to meet such scalable and high requirements\
 , whereas&amp;nbsp\;&lt;em&gt;Open Source Hardware&lt;/em&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&amp;amp\
 ;&amp;nbsp\;&lt;em&gt;Software&lt;/em&gt;incl.&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;explainable AI-based
  components will&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;also&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;play&lt;s
 trong&gt;&amp;nbsp\;&lt;/strong&gt;key roles in this actual dynamic development. Multip
 urpose adaptivity\, connectivity and reliability are crucial\, especially 
 in scaling down silicon technologies according to &amp;ldquo\;&lt;em&gt;Extending Mo
 ore&lt;/em&gt;&amp;rdquo\; for future processor technologies incl. dynamically recon
 figurable and AI-driven accelerators. This requires&amp;nbsp\;&lt;/span&gt;&lt;span lan
 g=&quot;EN-GB&quot;&gt;new open EDA approaches with standardized tool flows towards eff
 icient heterogenous system integration. &amp;nbsp\;&lt;/span&gt;The talk will presen
 t important challenges of high-end heterogenous&amp;nbsp\;&lt;em&gt;Multi-Core/Accel
 erator&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;HPC&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/em&gt;platforms by
 &amp;nbsp\;&lt;em&gt;reliable SoC&lt;/em&gt;&amp;nbsp\;and&amp;nbsp\;&lt;em&gt;SiP&lt;/em&gt;hardware/software
  integration with smart\, scalable\, reliable &amp;amp\; embedded accelerator 
 &amp;amp\; processor solutions. This includes corresponding&amp;nbsp\;&lt;em&gt;Global E
 cosystem&lt;/em&gt;&amp;nbsp\;discussions in the presence of&amp;nbsp\;&lt;em&gt;RISC-V&lt;/em&gt;\,
  national &amp;amp\;&amp;nbsp\;&lt;em&gt;European Chipact&lt;/em&gt;\,&amp;nbsp\;&lt;em&gt;6G&lt;/em&gt;&amp;nbsp\
 ;and&amp;nbsp\;&lt;em&gt;automotive&lt;/em&gt;&amp;nbsp\;initiatives whereas necessary AI &amp;amp
 \; chipdesign aspects have to be considered.&amp;nbsp\;&lt;/div&gt;\n&lt;div&gt;&amp;nbsp\;&lt;/d
 iv&gt;\n&lt;div&gt;The talk will in addition sketch in this context some selected&amp;n
 bsp\;&lt;em&gt;communication&lt;/em&gt;&amp;nbsp\;&amp;amp\;&amp;nbsp\;&lt;em&gt;automotive&lt;/em&gt;&amp;nbsp\;r
 elated project initiatives like&amp;nbsp\;&lt;strong&gt;&lt;em&gt;Open6GHub&lt;/em&gt;&lt;/strong&gt;&amp;
 nbsp\;(&lt;em&gt;6G for Society and Sustainability&amp;nbsp\;&lt;/em&gt;-&amp;nbsp\;&lt;a href=&quot;h
 ttps://www.open6ghub.de/en/&quot;&gt;https://www.open6ghub.de/en/&lt;/a&gt;)\,&amp;nbsp\;&lt;st
 rong&gt;&lt;em&gt;EPI&lt;/em&gt;&lt;/strong&gt;&amp;nbsp\;(&lt;em&gt;European Processor Initiative -&amp;nbsp
 \;&lt;a href=&quot;https://www.european-processor-initiative.eu/&quot;&gt;https://www.euro
 pean-processor-initiative.eu&lt;/a&gt;&lt;/em&gt;)\,&amp;nbsp\;&lt;strong&gt;&lt;em&gt;XANDAR&lt;/em&gt;&lt;/st
 rong&gt;&amp;nbsp\;(&lt;em&gt;Safety and Security for Embedded Software Systems -&amp;nbsp\
 ;&lt;a href=&quot;https://xandar-project.eu/&quot;&gt;https://xandar-project.eu&lt;/a&gt;&lt;/em&gt;)\
 ,&amp;nbsp\;&lt;strong&gt;&lt;em&gt;ZuSE-KI-mobil&lt;/em&gt;&lt;/strong&gt;&amp;nbsp\;(Platform for energy
 -efficient AI processors in mobile applications -&amp;nbsp\;&lt;a href=&quot;https://w
 ww.itiv.kit.edu/english/201_8016.php&quot;&gt;https://www.itiv.kit.edu/english/201
 _8016.php&lt;/a&gt;)\, and the national project&amp;nbsp\;&lt;strong&gt;&lt;em&gt;CeCaS&lt;/em&gt;&lt;/st
 rong&gt;&amp;nbsp\;(&lt;em&gt;CentralCarServer&lt;/em&gt;&amp;nbsp\;-&amp;nbsp\;&lt;a href=&quot;https://www.
 itiv.kit.edu/english/201_8769.php&quot;&gt;https://www.itiv.kit.edu/english/201_87
 69.php&lt;/a&gt;)\, among others.&lt;/div&gt;\n&lt;/div&gt;
END:VEVENT
END:VCALENDAR

