BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250521T141452Z UID:7F137EDD-4960-42D1-8CF0-36B1097361D5 DTSTART;TZID=America/New_York:20250514T170000 DTEND;TZID=America/New_York:20250514T190000 DESCRIPTION:Electronics play a crucial role across all industry sectors\, e specially as systems become more interconnected\, cloud-based\, electrifie d\, and powered by artificial intelligence (AI). This applies not only to existing electronics but also to emerging technologies pushing the boundar ies of scale\, data speed\, power\, and AI-driven innovations. Emerging te chnologies that are major drivers for electronics growth include Hyperscal ars driven by AI and machine learning\, IOT\, EV and autonomous vehicles.\ n\nGenerative AI has been driving demand for high performance GPU based se rvers and increased loads at data centers. Chip makers have in turn been f ocused on development of MPUs and GPUs optimized for AI. 5 and 6G applicat ions likewise require sensing\, computation and transfer of large volumes of data without latency. All these applications have been pushing electron ics towards heterogenous integration with 2.5 and 3D chiplets which allow for greater speeds\, functionality and smaller footprints.\n\nHowever\, th ese newer designs\, materials and shrinking of scale cause thermal managem ent and reliability issues in electronics introducing new failure sites an d modes.\n\nThis seminar will focus on the critical role reliability plays in the design\, manufacturing\, and long-term performance of electronic s ystems. The presentation will start with an overview of the semiconductor supply chain\, answering questions such as “who are the key players in v arious industries?” and “what is driving innovation and how is it taki ng shape?” The session will continue with addressing key foundational el ectronics reliability concepts such as the bathtub curve\, the difference between reliability physics and handbook calculations\, prognostic health management\, and common failure mechanisms. Additional time will be spent describing the reliability challenges presented by advanced packaging\, li ke 3D heterogeneous integrated packages\n\nTo address the evolving topic o f electronics reliability as industry needs evolve\, Ansys\, in collaborat ion with IEEE\, is hosting an Electronics reliability tutorial series that explore electronic component reliability\, key electronic failure mechani sm and root cause\, manufacturing reliability\, and simulation/testing for reliability. These tutorials are offered as bundles for continuing educat ion credit with an electronics reliability certificate from IEEE.\n\nSpeak er(s): Dr. Jon Kordell\, \n\nBldg: Main Cafeteria\, MIT Lincoln Laboratory \, 244 Wood Street\, Lexington\, Massachusetts\, United States\, 02421\, V irtual: https://events.vtools.ieee.org/m/483183 LOCATION:Bldg: Main Cafeteria\, MIT Lincoln Laboratory\, 244 Wood Street\, Lexington\, Massachusetts\, United States\, 02421\, Virtual: https://event s.vtools.ieee.org/m/483183 ORGANIZER:k.safina@ieee.org SEQUENCE:19 SUMMARY:Introduction to Electronic Reliability in the Age of AI URL;VALUE=URI:https://events.vtools.ieee.org/m/483183 X-ALT-DESC:Description: <br /><p>Electronics play a crucial role across all industry sectors\, especially as systems become more interconnected\, clo ud-based\, electrified\, and powered by artificial intelligence (AI). This applies not only to existing electronics but also to emerging technologie s pushing the boundaries of scale\, data speed\, power\, and AI-driven inn ovations. Emerging technologies that are major drivers for electronics gro wth include Hyperscalars driven by AI and machine learning\, IOT\, EV and autonomous vehicles.</p>\n<p>Generative AI has been driving demand for hig h performance GPU based servers and increased loads at data centers. Chip makers have in turn been focused on development of MPUs and GPUs optimized for AI. 5 and 6G applications likewise require sensing\, computation and transfer of large volumes of data without latency. All these applications have been pushing electronics towards heterogenous integration with 2.5 an d 3D chiplets which allow for greater speeds\, functionality and smaller f ootprints.</p>\n<p>However\, these newer designs\, materials and shrinking of scale cause thermal management and reliability issues in electronics i ntroducing new failure sites and modes.</p>\n<p>This seminar will focus on the critical role reliability plays in the design\, manufacturing\, and l ong-term performance of electronic systems. The presentation will start wi th an overview of the semiconductor supply chain\, answering questions suc h as &ldquo\;who are the key players in various industries?&rdquo\; and &l dquo\;what is driving innovation and how is it taking shape?&rdquo\; The s ession will continue with addressing key foundational electronics reliabil ity concepts such as the bathtub curve\, the difference between reliabilit y physics and handbook calculations\, prognostic health management\, and c ommon failure mechanisms. Additional time will be spent describing the rel iability challenges presented by advanced packaging\, like 3D heterogeneou s integrated packages</p>\n<p>To address the evolving topic of electronics reliability as industry needs evolve\, Ansys\, in collaboration with IEEE \, is hosting an Electronics reliability tutorial series that explore elec tronic component reliability\, key electronic failure mechanism and root c ause\, manufacturing reliability\, and simulation/testing for reliability. These tutorials are offered as bundles for continuing education credit wi th an electronics reliability certificate from IEEE.</p> END:VEVENT END:VCALENDAR