BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Warsaw BEGIN:DAYLIGHT DTSTART:20250330T030000 TZOFFSETFROM:+0100 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:CEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20251026T020000 TZOFFSETFROM:+0200 TZOFFSETTO:+0100 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:CET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250523T145218Z UID:3BBE41BD-4A4B-430C-9C3C-4F11C245E657 DTSTART;TZID=Europe/Warsaw:20250522T093000 DTEND;TZID=Europe/Warsaw:20250522T123000 DESCRIPTION:“Low-power\, Low-noise Sensor Interface Circuits for Biomedic al Applications”\n\n“Towards Monolithic Mobile Ultrasound Imaging Syst em for Medical and Drone Applications”\n\nLink to join: [https://teams.m icrosoft.com/l/meetupjoin/](https://teams.microsoft.com/l/meetupjoin/%2019 %3ameeting_YjdmNzc5ZjktZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0? context=%7b%22Tid%22%3a%2280b1033f-%2021e0-4a82-bbc0-f05fdccd3bc8%22%2c%22 Oid%22%3a%22545fba56-0464-41a5-b7dc-45378bee1698%22%7d)\n[19%3ameeting_Yjd mNzc5ZjktZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0?context=%7b%22 Tid%22%3a%2280b1033f-](https://teams.microsoft.com/l/meetupjoin/%2019%3ame eting_YjdmNzc5ZjktZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0?conte xt=%7b%22Tid%22%3a%2280b1033f-%2021e0-4a82-bbc0-f05fdccd3bc8%22%2c%22Oid%2 2%3a%22545fba56-0464-41a5-b7dc-45378bee1698%22%7d)\n[21e0-4a82-bbc0-f05fdc cd3bc8%22%2c%22Oid%22%3a%22545fba56-0464-41a5-b7dc-45378bee1698%22%7d](htt ps://teams.microsoft.com/l/meetupjoin/%2019%3ameeting_YjdmNzc5ZjktZjdlZS00 MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0?context=%7b%22Tid%22%3a%2280b10 33f-%2021e0-4a82-bbc0-f05fdccd3bc8%22%2c%22Oid%22%3a%22545fba56-0464-41a5- b7dc-45378bee1698%22%7d)\n\nAbstracts:\n\nBiomedical and healthcare applic ations provide attractive opportunities for the semiconductor sector. In b oth fields\, the target is to gather data from multiple sensor nodes with minimal power consumption while maintaining low noise operation. However\, designing a sensor interface circuit for such applications is challenging due to its harsh environment. Also\, in such cases\, the trade-off betwee n available resources and performance among the components both in analog front-end and in the digital back-end is crucial.\n\nUltrasound Imaging Sy stem (UIS) has been widely used in medical imaging with its non-invasive\, non-destructive monitoring nature\; but so far the UIS has large form fac tor\, making it difficult to integrate in mobile form factor. For drone an d robotic vision and navigation\, low-power 3-D depth sensing with robust operations against strong/weak light and various weather conditions is cru cial. CMOS image sensor (CIS) and light detection and ranging (LiDAR) can provide high-fidelity imaging. However\, CIS lacks depth sensing and has d ifficulty in low light conditions. LiDAR is expensive with issues of deali ng with strong direct interference sources. UIS\, on the other hand\, is r obust in various weather and light conditions and is cost-effective. Howev er\, in air channel\, it often suffers from long image reconstruction late ncy and low framerate.\n\nBio: Jerald Yoo (S’05-M’10-SM’15) received the B.S.\, M.S.\, and Ph.D. degrees in Department of Electrical Engineeri ng from the Korea Advanced Institute of Science and Technology (KAIST)\, D aejeon\, Korea\, in 2002\, 2007\, and 2010\, respectively. From 2010 to 20 16\, he was with the Department of Electrical Engineering and Computer Sci ence\, Masdar Institute\, Abu Dhabi\, United Arab Emirates\, where he was an Associate Professor. From 2010 to 2011\, he was also with the Microsyst ems Technology Laboratories (MTL)\, Massachusetts Institute of Technology (MIT) as a visiting scholar. Between 2017 and 2024\, he was with the Depar tment of Electrical and Computer Engineering\, National University of Sing apore\, Singapore\, as an Associate Professor. Since 2024\, he has been wi th the Department of Electrical and Computer Engineering\, Seoul National University\, where he is currently an Associate Professor.\n\nRoom: 121\, Bldg: B1\, AGH University of Krakow\, Kraków\, Malopolskie\, Poland\, 30- 059 LOCATION:Room: 121\, Bldg: B1\, AGH University of Krakow\, Kraków\, Malopo lskie\, Poland\, 30-059 ORGANIZER:piotr.kmon@agh.edu.pl SEQUENCE:39 SUMMARY:Seminar on Biomedical Microelectronics: Sensor Interfaces and Ultra sound Imaging - Prof. Jerald Yoo URL;VALUE=URI:https://events.vtools.ieee.org/m/484215 X-ALT-DESC:Description: <br /><p><strong>&ldquo\;Low-power\, Low-noise Sens or Interface Circuits for Biomedical Applications&rdquo\;</strong></p>\n<p ><strong>&ldquo\;Towards Monolithic Mobile Ultrasound Imaging System for M edical and Drone&nbsp\;Applications&rdquo\;</strong></p>\n<p>Link to join: <a href="https://teams.microsoft.com/l/meetupjoin/%2019%3ameeting_YjdmNzc 5ZjktZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0?context=%7b%22Tid% 22%3a%2280b1033f-%2021e0-4a82-bbc0-f05fdccd3bc8%22%2c%22Oid%22%3a%22545fba 56-0464-41a5-b7dc-45378bee1698%22%7d">https://teams.microsoft.com/l/meetup join/</a><br><a href="https://teams.microsoft.com/l/meetupjoin/%2019%3amee ting_YjdmNzc5ZjktZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0?contex t=%7b%22Tid%22%3a%2280b1033f-%2021e0-4a82-bbc0-f05fdccd3bc8%22%2c%22Oid%22 %3a%22545fba56-0464-41a5-b7dc-45378bee1698%22%7d">19%3ameeting_YjdmNzc5Zjk tZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/0?context=%7b%22Tid%22%3 a%2280b1033f-</a><br><a href="https://teams.microsoft.com/l/meetupjoin/%20 19%3ameeting_YjdmNzc5ZjktZjdlZS00MGZjLTgyOWUtMGE1YzJlZmE3OTQy%40thread.v2/ 0?context=%7b%22Tid%22%3a%2280b1033f-%2021e0-4a82-bbc0-f05fdccd3bc8%22%2c% 22Oid%22%3a%22545fba56-0464-41a5-b7dc-45378bee1698%22%7d">21e0-4a82-bbc0-f 05fdccd3bc8%22%2c%22Oid%22%3a%22545fba56-0464-41a5-b7dc-45378bee1698%22%7d &nbsp\;</a></p>\n<p>Abstracts:</p>\n<p>Biomedical and healthcare applicati ons provide attractive opportunities for the semiconductor sector. In both fields\, the target is to gather data from multiple sensor nodes with min imal power consumption while maintaining low noise operation. However\, de signing a sensor interface circuit for such applications is challenging du e to its harsh environment. Also\, in such cases\, the trade-off between a vailable resources and performance among the components both in analog fro nt-end and in the digital back-end is crucial.</p>\n<p>Ultrasound Imaging System (UIS) has been widely used in medical imaging with its non-invasive \, non-destructive monitoring nature\; but so far the UIS has large form f actor\, making it difficult to integrate in mobile form factor. For drone and robotic vision and navigation\, low-power 3-D depth sensing with robus t operations against strong/weak light and various weather conditions is c rucial. CMOS image sensor (CIS) and light detection and ranging (LiDAR) ca n provide high-fidelity imaging. However\, CIS lacks depth sensing and has difficulty in low light conditions. LiDAR is expensive with issues of dea ling with strong direct interference sources. UIS\, on the other hand\, is robust in various weather and light conditions and is cost-effective. How ever\, in air channel\, it often suffers from long image reconstruction la tency and low framerate.</p>\n<p>&nbsp\;</p>\n<p><strong>Bio: </strong>Jer ald Yoo (S&rsquo\;05-M&rsquo\;10-SM&rsquo\;15) received the B.S.\, M.S.\, and Ph.D. degrees in Department of Electrical Engineering from the Korea A dvanced Institute of Science and Technology (KAIST)\, Daejeon\, Korea\, in 2002\, 2007\, and 2010\, respectively. From 2010 to 2016\, he was with th e Department of Electrical Engineering and Computer Science\, Masdar Insti tute\, Abu Dhabi\, United Arab Emirates\, where he was an Associate Profes sor. From 2010 to 2011\, he was also with the Microsystems Technology Labo ratories (MTL)\, Massachusetts Institute of Technology (MIT) as a visiting scholar. Between 2017 and 2024\, he was with the Department of Electrical and Computer Engineering\, National University of Singapore\, Singapore\, as an Associate Professor. Since 2024\, he has been with the Department o f Electrical and Computer Engineering\, Seoul National University\, where he is currently an Associate Professor.</p> END:VEVENT END:VCALENDAR