BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Denver BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0700 TZOFFSETTO:-0600 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:MDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0600 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:MST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20250528T160749Z UID:D8903243-9E7D-455D-ADD5-6D28C2715C69 DTSTART;TZID=America/Denver:20250527T180000 DTEND;TZID=America/Denver:20250527T200000 DESCRIPTION:Please Join Us For a Great Italian Dinner to Honor John Reinert 2025 Winner of the John Meredith Region 5 Lifetime Achievement Award at t he Downtown Panino's Restaurant on Tuesday\, May 27 6 pm.\n\nDavid Bondura nt will do a talk on the latest packaging technology for High Performance & AI Processors:\n\n“If we make them smaller\, we can make them faster ” has been the approach to building faster computers over the last 70-ye ars starting with the first transistors and continuing as we built increas ingly more complex integrated circuits. More recently we have gone Beyond Moore’s Law to fabricate advanced supercomputers and AI computers using 3D Memory and 3D Packaging. In this talk\, I review recent trends in 3D Me mory and 3D Packaging which are driving these high performance system towa rds wafer scale systems with multiple reticle sized processors and 3D memo ries. We observe the next generation HBM4\, high bandwidth 3D DRAM\, and t he emergence of the HBF\, high bandwidth Flash memory\, to increase memory capacity to serve larger databases.\n\nSpeaker(s): David Bondurant\, \n\n Agenda: \nDinner\n\nAward Presentation\n\nPresentation\n\nBldg: The Downto wn Panino's\, 604 North Tejon Street\, Colorado Springs\, Colorado\, Unite d States\, 80903\, Virtual: https://events.vtools.ieee.org/m/485191 LOCATION:Bldg: The Downtown Panino's\, 604 North Tejon Street\, Colorado Sp rings\, Colorado\, United States\, 80903\, Virtual: https://events.vtools. ieee.org/m/485191 ORGANIZER:dbondurant@mac.com SEQUENCE:60 SUMMARY:Pikes Peak Section\, LMAG\, Computer Society\, ED/CAS Chapters Meet ing URL;VALUE=URI:https://events.vtools.ieee.org/m/485191 X-ALT-DESC:Description: <br /><p>Please Join Us For a Great Italian Dinner to Honor <strong>John Reinert 2025 Winner of the John Meredith Region 5 Li fetime Achievement Award</strong> at the <strong>Downtown Panino's Restaur ant</strong> on Tuesday\, May 27 6 pm. &nbsp\;</p>\n<p>David Bondurant wil l do a talk on the latest packaging technology for High Performance &amp\; AI Processors:</p>\n<p><img src="https://events.vtools.ieee.org/vtools_ui /media/display/b6b2f3b7-4b6f-4e75-a958-98e2c78ed2e9"></p>\n<p>&ldquo\;If w e make them smaller\, we can make them faster&rdquo\; has been the approac h to building faster computers over the last 70-years starting with the fi rst transistors and continuing as we built increasingly more complex integ rated circuits. &nbsp\;More recently we have gone <strong>Beyond Moore&rsq uo\;s Law</strong> to fabricate advanced supercomputers and AI computers u sing <strong>3D Memory and 3D Packaging</strong>.<span class="Apple-conver ted-space">&nbsp\; </span>In this talk\, I review recent trends in 3D Memo ry and 3D Packaging which are driving these high performance system toward s <strong>wafer scale systems with multiple reticle sized processors and 3 D memories</strong>.<span class="Apple-converted-space">&nbsp\; </span>We observe the next generation <strong>HBM4\, high bandwidth 3D DRAM</strong> \, and the emergence of the <strong>HBF\, high bandwidth Flash memory</str ong>\, to increase memory capacity to serve larger databases.</p><br /><br />Agenda: <br /><p>Dinner</p>\n<p>Award Presentation</p>\n<p>Presentation </p> END:VEVENT END:VCALENDAR