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DTSTART:20380119T091407
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BEGIN:VEVENT
DTSTAMP:20250621T071851Z
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DTSTART;TZID=Asia/Dhaka:20251218T080000
DTEND;TZID=Asia/Dhaka:20251219T200000
DESCRIPTION:CFP of STI 2025: 7th Int'l Conf. on Sustainable Technologies fo
 r Industry 5.0\n\nWHY STI?\n\n❖ First conference in southeast Asia on Su
 stainable Technologies for Industry 4.0 and Industry 5.0\n\n❖ Only confe
 rence in Bangladesh\, which is technically sponsored by the central IEEE C
 omputer Society\, USA\n\n❖ All the papers of our previous editions are i
 ncluded in the IEEE xplore digital library within short period of times\n\
 n❖ From the very first edition\, all the accepted papers are included in
  the Scopus and other renowned databases\n\n❖ With each subsequent editi
 on\, involvement of international participants is increasing\, e.g. 2019: 
 20\, 2020: 22 \, 2021: 35\, 2022: 36 and 2023: 36+\, 2024: 36+ countries\n
 \nCALL FOR PAPER\n\nSTI conference provides a platform for facilitating an
 d promoting innovative research on Industry 5.0 (or Industrial Revolution 
 5.0) by encompassing research areas related to Track 1: Intelligent Comput
 ing\, Networking and Security Systems\; Track 2: Energy\, Robotics\, Elect
 ronics\, Sensors and Communications\; Track 3: Industry 5.0 Design and App
 lications\; Track 4: Textile Engineering. STI 2025 welcomes researchers\, 
 industry professionals\, and practitioners to display their scientific ach
 ievements and sustainable solutions for industrial developments in the fie
 lds of computer science & engineering\, electrical & electronic engineerin
 g\, textile engineering\, robotics and cyber-physical systems related to I
 ndustry 5.0. It will be hosted at the permanent campus of Green University
  of Bangladesh\, Purbachal American City\, Dhaka\, Bangladesh during 18-19
  December 2025.\n\nCo-sponsored by: IEEE Computer Society Bangladesh Chapt
 er\n\nGreen University of Bangladesh\, Dhaka\, Dhaka\, Bangladesh
LOCATION:Green University of Bangladesh\, Dhaka\, Dhaka\, Bangladesh
ORGANIZER:ahsan.habib.tareq@gmail.com
SEQUENCE:0
SUMMARY:CFP OF STI 2025: 7TH INT'L CONF. ON SUSTAINABLE TECHNOLOGIES FOR IN
 DUSTRY 5.0
URL;VALUE=URI:https://events.vtools.ieee.org/m/489946
X-ALT-DESC:Description: <br /><p class="MsoNormal" style="margin-bottom: 10
 .5pt\; line-height: normal\; background: white\;"><span style="font-size: 
 18.0pt\; font-family: 'Times New Roman'\,serif\; mso-fareast-font-family: 
 'Times New Roman'\; color: #e37222\; text-transform: uppercase\; mso-font-
 kerning: 0pt\; mso-ligatures: none\;">CFP of&nbsp\;STI&nbsp\;2025: 7th Int
 'l Conf. on Sustainable Technologies for Industry 5.0</span></p>\n<p class
 ="MsoNormal" style="mso-margin-top-alt: auto\; mso-margin-bottom-alt: auto
 \; line-height: normal\; background: white\;"><span style="font-family: 'A
 rial'\,sans-serif\; mso-fareast-font-family: 'Times New Roman'\; color: #2
 22222\; mso-font-kerning: 0pt\; mso-ligatures: none\;">WHY&nbsp\;STI?</spa
 n></p>\n<p class="MsoNormal" style="margin-bottom: 0in\; line-height: norm
 al\; background: white\;"><span style="font-family: 'Segoe UI Symbol'\,san
 s-serif\; mso-fareast-font-family: 'Times New Roman'\; mso-bidi-font-famil
 y: 'Segoe UI Symbol'\; color: #222222\; mso-font-kerning: 0pt\; mso-ligatu
 res: none\;">❖</span><span style="font-family: 'Arial'\,sans-serif\; mso
 -fareast-font-family: 'Times New Roman'\; color: #222222\; mso-font-kernin
 g: 0pt\; mso-ligatures: none\;"> First conference in southeast Asia on Sus
 tainable Technologies for Industry 4.0 and Industry 5.0</span></p>\n<p cla
 ss="MsoNormal" style="margin-bottom: 0in\; line-height: normal\; backgroun
 d: white\;"><span style="font-family: 'Segoe UI Symbol'\,sans-serif\; mso-
 fareast-font-family: 'Times New Roman'\; mso-bidi-font-family: 'Segoe UI S
 ymbol'\; color: #222222\; mso-font-kerning: 0pt\; mso-ligatures: none\;">
 ❖</span><span style="font-family: 'Arial'\,sans-serif\; mso-fareast-font
 -family: 'Times New Roman'\; color: #222222\; mso-font-kerning: 0pt\; mso-
 ligatures: none\;"> Only conference in Bangladesh\, which is technically s
 ponsored by the central&nbsp\;IEEE&nbsp\;Computer Society\, USA</span></p>
 \n<p class="MsoNormal" style="margin-bottom: 0in\; line-height: normal\; b
 ackground: white\;"><span style="font-family: 'Segoe UI Symbol'\,sans-seri
 f\; mso-fareast-font-family: 'Times New Roman'\; mso-bidi-font-family: 'Se
 goe UI Symbol'\; color: #222222\; mso-font-kerning: 0pt\; mso-ligatures: n
 one\;">❖</span><span style="font-family: 'Arial'\,sans-serif\; mso-farea
 st-font-family: 'Times New Roman'\; color: #222222\; mso-font-kerning: 0pt
 \; mso-ligatures: none\;"> All the papers of our previous editions are inc
 luded in the&nbsp\;IEEE&nbsp\;xplore digital library within short period o
 f times</span></p>\n<p class="MsoNormal" style="margin-bottom: 0in\; line-
 height: normal\; background: white\;"><span style="font-family: 'Segoe UI 
 Symbol'\,sans-serif\; mso-fareast-font-family: 'Times New Roman'\; mso-bid
 i-font-family: 'Segoe UI Symbol'\; color: #222222\; mso-font-kerning: 0pt\
 ; mso-ligatures: none\;">❖</span><span style="font-family: 'Arial'\,sans
 -serif\; mso-fareast-font-family: 'Times New Roman'\; color: #222222\; mso
 -font-kerning: 0pt\; mso-ligatures: none\;"> From the very first edition\,
  all the accepted papers are included in the Scopus and other renowned dat
 abases</span></p>\n<p class="MsoNormal" style="margin-bottom: 0in\; line-h
 eight: normal\; background: white\;"><span style="font-family: 'Segoe UI S
 ymbol'\,sans-serif\; mso-fareast-font-family: 'Times New Roman'\; mso-bidi
 -font-family: 'Segoe UI Symbol'\; color: #222222\; mso-font-kerning: 0pt\;
  mso-ligatures: none\;">❖</span><span style="font-family: 'Arial'\,sans-
 serif\; mso-fareast-font-family: 'Times New Roman'\; color: #222222\; mso-
 font-kerning: 0pt\; mso-ligatures: none\;"> With each subsequent edition\,
  involvement of international participants is increasing\, e.g. 2019: 20\,
  2020: 22 \, 2021: 35\, 2022: 36 and 2023: 36+\, 2024: 36+ countries</span
 ></p>\n<p class="MsoNormal" style="mso-margin-top-alt: auto\; mso-margin-b
 ottom-alt: auto\; line-height: normal\; background: white\;"><span style="
 font-family: 'Arial'\,sans-serif\; mso-fareast-font-family: 'Times New Rom
 an'\; color: #222222\; mso-font-kerning: 0pt\; mso-ligatures: none\;">CALL
  FOR PAPER</span></p>\n<p class="MsoNormal" style="mso-margin-top-alt: aut
 o\; mso-margin-bottom-alt: auto\; text-align: justify\; line-height: norma
 l\; background: white\;"><span style="font-family: 'Arial'\,sans-serif\; m
 so-fareast-font-family: 'Times New Roman'\; color: #222222\; mso-font-kern
 ing: 0pt\; mso-ligatures: none\;">STI conference provides a platform for f
 acilitating and promoting innovative research on Industry 5.0 (or Industri
 al Revolution 5.0) by encompassing research areas related to Track 1: Inte
 lligent Computing\, Networking and Security Systems\; Track 2: Energy\, Ro
 botics\, Electronics\, Sensors and Communications\; Track 3: Industry 5.0 
 Design and Applications\; Track 4: Textile Engineering. STI 2025 welcomes 
 researchers\, industry professionals\, and practitioners to display their 
 scientific achievements and sustainable solutions for industrial developme
 nts in the fields of computer science &amp\; engineering\, electrical &amp
 \; electronic engineering\, textile engineering\, robotics and cyber-physi
 cal systems related to Industry 5.0. It will be hosted at the permanent ca
 mpus of Green University of Bangladesh\, Purbachal American City\, Dhaka\,
  Bangladesh during 18-19 December 2025.</span></p>\n<p class="MsoNormal" s
 tyle="mso-margin-top-alt: auto\; mso-margin-bottom-alt: auto\; text-align:
  justify\; line-height: normal\; background: white\;"><span style="font-fa
 mily: 'Arial'\,sans-serif\; mso-fareast-font-family: 'Times New Roman'\; c
 olor: #222222\; mso-font-kerning: 0pt\; mso-ligatures: none\;"><img src="h
 ttps://events.vtools.ieee.org/vtools_ui/media/display/509a9ab1-d88f-4768-9
 c91-408868937c60"></span></p>\n<p class="MsoNormal" style="mso-margin-top-
 alt: auto\; mso-margin-bottom-alt: auto\; text-align: justify\; line-heigh
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