BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Asia/Shanghai
BEGIN:STANDARD
DTSTART:19910915T010000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
TZNAME:CST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20250710T183217Z
UID:E065BD5E-51B5-47C9-A31F-2BF2CA383A8B
DTSTART;TZID=Asia/Shanghai:20250805T090000
DTEND;TZID=Asia/Shanghai:20250807T180000
DESCRIPTION:The International Conference on Electronic Packaging Technology
  (ICEPT) is one of the largest and most cohesive packaging technology conf
 erence in Asia. ICEPT 2025 will be held by Shanghai University\, IEEE Elec
 tronics Packaging Society (IEEE-EPS)\, and Electronic Manufacturing & Pack
 aging Technology Society of Chinese Institute of Electronics (CIE-EMPT). O
 rganized by National Center for Advanced Packaging (NCAP) \, and Beijing H
 erogees Consulting Company\, China.\n\nThis year's ICEPT will be held in S
 hanghai\, China from August 5th to August 7th\, 2025.\n\nCo-sponsored by: 
 Zhuo Li\n\nNo.66\, Jiatang Road\, Juyuan New District\, Jiading District\,
  Shanghai\, Shanghai\, China
LOCATION:No.66\, Jiatang Road\, Juyuan New District\, Jiading District\, Sh
 anghai\, Shanghai\, China
ORGANIZER:zhuo_li@fudan.edu.cn
SEQUENCE:20
SUMMARY:2025 26th International Conference on Electronic Packaging Technolo
 gy
URL;VALUE=URI:https://events.vtools.ieee.org/m/492395
X-ALT-DESC:Description: <br /><p>The International Conference on Electronic
  Packaging Technology (ICEPT) is one of the largest and most cohesive pack
 aging technology conference in Asia. ICEPT 2025 will be held by Shanghai U
 niversity\, IEEE Electronics Packaging Society (IEEE-EPS)\, and Electronic
  Manufacturing &amp\; Packaging Technology Society of Chinese Institute of
  Electronics (CIE-EMPT). Organized by National Center for Advanced Packagi
 ng (NCAP) \, and Beijing Herogees Consulting Company\, China.&nbsp\;</p>\n
 <p>This year's ICEPT will be held in Shanghai\, China from August 5th to A
 ugust 7th\, 2025.</p>
END:VEVENT
END:VCALENDAR