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DTSTART:20250330T030000
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DTSTART:20251026T020000
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DTSTAMP:20250915T125834Z
UID:CF184B9E-1BD9-40A5-9875-E32F641EA983
DTSTART;TZID=Europe/Berlin:20250911T160000
DTEND;TZID=Europe/Berlin:20250911T183000
DESCRIPTION:Despite the much debated end of Moore&#39;s Law\, CMOS scaling stil
 l maintains economic relevance with 3nm finFET SoCs already in the marketp
 lace for over a year and 2nm gate-all-around SoCs anticipated this year. M
 odest feature size reduction and design/technology innovations co-optimize
 d for primarily logic scaling continue to offer compelling node-to-node po
 wer\, performance\, area\, and cost benefits. In this tutorial\, we will s
 tart with a walk through memory lane\, recounting a brief history of trans
 istor evolution to motivate the migration from the planar MOSFET to the fu
 lly depleted FinFET. We will summarize the key process technology elements
  that have enabled the finFET CMOS nodes\, highlighting the resulting devi
 ce technology characteristics and challenges. This will set the context fo
 r motivating the introduction of the gate-all-around transistor architectu
 re\, namely nanoribbons or nanosheets\, and unveiling the magic of how the
 se devices are fabricated. We will then shift to summarize the challenges 
 that CMOS technology scaling has imposed on analog design. To address the 
 growing effort required for analog/mixed-signal design closure\, we will c
 over design strategies on how analog design has adapted and thrived throug
 hout decades of increasingly unfriendly CMOS scaling\, including the migra
 tion to heterogeneous integration as prophesied by Gordon Moore&#39;s seminal 
 1965 paper.\n\nCo-sponsored by: NXP Semiconductors\n\nSpeaker(s): Alvin Lo
 ke\n\nBldg: NXP Semiconductors Germany GmbH\, Schatzbogen 7\, Munich\, Bay
 ern\, Germany\, 81829\, Virtual: https://events.vtools.ieee.org/m/493693
LOCATION:Bldg: NXP Semiconductors Germany GmbH\, Schatzbogen 7\, Munich\, B
 ayern\, Germany\, 81829\, Virtual: https://events.vtools.ieee.org/m/493693
ORGANIZER:moustafa.nawito@gmail.com
SEQUENCE:17
SUMMARY:Distinguished Lecture: Alvin Loke – &quot;The Road to Gate-All-Around 
 and Its Impact on Analog Design&quot;
URL;VALUE=URI:https://events.vtools.ieee.org/m/493693
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;Despite the much debated end of Moore&#39;s La
 w\, CMOS scaling still maintains economic relevance with 3nm finFET SoCs a
 lready in the marketplace for over a year and 2nm gate-all-around SoCs ant
 icipated this year. Modest feature size reduction and design/technology in
 novations co-optimized for primarily logic scaling continue to offer compe
 lling node-to-node power\, performance\, area\, and cost benefits. In this
  tutorial\, we will start with a walk through memory lane\, recounting a b
 rief history of transistor evolution to motivate the migration from the pl
 anar MOSFET to the fully depleted FinFET. We will summarize the key proces
 s technology elements that have enabled the finFET CMOS nodes\, highlighti
 ng the resulting device technology characteristics and challenges. This wi
 ll set the context for motivating the introduction of the gate-all-around 
 transistor architecture\, namely nanoribbons or nanosheets\, and unveiling
  the magic of how these devices are fabricated. We will then shift to summ
 arize the challenges that CMOS technology scaling has imposed on analog de
 sign. To address the growing effort required for analog/mixed-signal desig
 n closure\, we will cover design strategies on how analog design has adapt
 ed and thrived throughout decades of increasingly unfriendly CMOS scaling\
 , including the migration to heterogeneous integration as prophesied by Go
 rdon Moore&#39;s seminal 1965 paper.&lt;/p&gt;
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