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DTSTAMP:20250904T121843Z
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DTSTART;TZID=America/New_York:20250811T120000
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DESCRIPTION:This talk will explore the fundamentals of signal integrity (SI
 ) in high-speed applications\, with a focus on both frequency- and time-do
 main analysis. Attendees will gain a foundational understanding of how sig
 nal loss\, crosstalk\, and reflections affect system performance at high d
 ata rates. The presentation will also highlight recent advances in packagi
 ng techniques for broadband applications\, including chiplets and advanced
  interconnects\, and how these innovations help address challenges in high
 -frequency design. This session aims to bridge the gap between SI fundamen
 tals and modern packaging technologies\, offering a comprehensive overview
  for engineers and students working on broadband systems.\n\nAt the end of
  the talk\, the speaker will provide a summary of IEEE resources available
  to students and young professionals in the RF field.\n\nSpeaker(s): Dr. A
 hmed Abdelltif\, \n\nBldg: EIT 3142\, 200 University Ave W\, Waterloo\, On
 tario\, Canada\, N2L 3G1
LOCATION:Bldg: EIT 3142\, 200 University Ave W\, Waterloo\, Ontario\, Canad
 a\, N2L 3G1
ORGANIZER:aabdella@ieee.org
SEQUENCE:21
SUMMARY:Fundamentals of Signal Integrity for High-Speed Applications and Ad
 vances in Packaging Technology
URL;VALUE=URI:https://events.vtools.ieee.org/m/494527
X-ALT-DESC:Description: <br /><p><img style="display: block\; margin-left: 
 auto\; margin-right: auto\;" src="https://events.vtools.ieee.org/vtools_ui
 /media/display/0fcae070-bf07-414b-8123-9e865190170f" width="696" height="4
 35"></p>\n<p>&nbsp\;</p>\n<p data-start="145" data-end="867">This talk wil
 l explore the fundamentals of signal integrity (SI) in high-speed applicat
 ions\, with a focus on both frequency- and time-domain analysis. Attendees
  will gain a foundational understanding of how signal loss\, crosstalk\, a
 nd reflections affect system performance at high data rates. The presentat
 ion will also highlight recent advances in packaging techniques for broadb
 and applications\, including chiplets and advanced interconnects\, and how
  these innovations help address challenges in high-frequency design. This 
 session aims to bridge the gap between SI fundamentals and modern packagin
 g technologies\, offering a comprehensive overview for engineers and stude
 nts working on broadband systems.</p>\n<p data-start="869" data-end="1008"
 >At the end of the talk\, the speaker will provide a summary of IEEE resou
 rces available to students and young professionals in the RF field.</p>
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