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DTSTAMP:20250820T172909Z
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DTSTART;TZID=America/New_York:20250820T140000
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DESCRIPTION:Facebook: https://bit.ly/webinar-8-20-25-fb\nLinkedIn: https://
 bit.ly/webinar-8-20-25-li\nYouTube: https://bit.ly/webinar-8-20-25-yt\n\nA
 s technologies push the limits of traditional silicon\, the U.S. faces a c
 ritical challenge: how to continue delivering high-bandwidth\, energy-effi
 cient\, multifunctional microelectronics essential for advanced technologi
 es. Conventional 2D scaling is reaching physical and economic limits\, and
  while industry is pursuing advanced packaging\, the integration of mixed 
 materials – beyond silicon – remains largely untapped. Yet this integr
 ation is essential for achieving the order-of-magnitude improvements that 
 next-generation capabilities will require.\n\nJoin Michael Holmes from DAR
 PA’s Microsystems Technology Office\, to learn how DARPA’s [Next Gener
 ation Microelectronics Manufacturing (NGMM)](https://www.darpa.mil/researc
 h/programs/next-generation-microelectronics) program is addressing this ch
 allenge. NGMM is establishing the nation’s first open-access center for 
 U.S.-based 3D heterogeneous integration (3DHI) focused on mixed materials 
 integration to leapfrog ahead of today’s state of the art. In partnershi
 p with The University of Texas at Austin and its Texas Institute for Elect
 ronics (TIE)\, NGMM is developing a sustainable domestic hub for R&amp;D and p
 ilot production\, which will enable rapid prototyping and fabrication of a
 dvanced microsystems critical to future technological needs. Attendees wil
 l also learn about opportunities to engage with the NGMM community at the 
 inaugural NGMM Summit this October in Austin\, Texas.\n\nSpeaker(s): Micha
 el Holmes\n\nAgenda: \nIEEE-USA&#39;s free webinars/events are designed to hel
 p you find your next job\, maintain your career\, negotiate an appropriate
  salary\, understand ethical considerations in the workplace and learn abo
 ut other career-building strategies and public policy developments that af
 fect your profession.\n\nFor information regarding upcoming webinars or to
  visit our vast webinar archive\, please visit: [https://ieeeusa.org/caree
 rs/webinars](https://ieeeusa.org/careers/webinars/)\n\n[Stay informed abou
 t future IEEE-USA Webinars by subscribing now to Smartbrief!](https://news
 letter.smartbrief.com/rest/sign-up/2479DAB0-4089-43E7-925D-86AE0C1E6244?ca
 mpaign=e0d52cef)\n\nVirtual: https://events.vtools.ieee.org/m/494988
LOCATION:Virtual: https://events.vtools.ieee.org/m/494988
ORGANIZER:k.henneberry@ieee.org
SEQUENCE:15
SUMMARY:IEEE-USA Livestream Webinar: Next Generation Microelectronics Manuf
 acturing: Stacking the Future with Mixed-Materials 3DHI
URL;VALUE=URI:https://events.vtools.ieee.org/m/494988
X-ALT-DESC:Description: &lt;br /&gt;&lt;div&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;&lt;span sty
 le=&quot;font-family: georgia\, serif\;&quot;&gt;Facebook:&amp;nbsp\;&lt;a href=&quot;https://bit.l
 y/webinar-8-20-25-fb&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot; data-saferedirecturl=
 &quot;https://www.google.com/url?q=https://bit.ly/webinar-8-20-25-fb&amp;amp\;sourc
 e=gmail&amp;amp\;ust=1755797321864000&amp;amp\;usg=AOvVaw1A3dIsedoF5VIDrXnphFey&quot;&gt;h
 ttps://bit.ly/&lt;wbr&gt;webinar-8-20-25-fb&lt;/a&gt;&lt;br&gt;LinkedIn:&amp;nbsp\;&lt;a href=&quot;http
 s://bit.ly/webinar-8-20-25-li&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot; data-safered
 irecturl=&quot;https://www.google.com/url?q=https://bit.ly/webinar-8-20-25-li&amp;a
 mp\;source=gmail&amp;amp\;ust=1755797321864000&amp;amp\;usg=AOvVaw0tFwU-UDYGcy6Y36
 nBwzHz&quot;&gt;https://bit.ly/&lt;wbr&gt;webinar-8-20-25-li&lt;/a&gt;&lt;br&gt;YouTube:&amp;nbsp\;&lt;a hr
 ef=&quot;https://bit.ly/webinar-8-20-25-yt&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot; data
 -saferedirecturl=&quot;https://www.google.com/url?q=https://bit.ly/webinar-8-20
 -25-yt&amp;amp\;source=gmail&amp;amp\;ust=1755797321864000&amp;amp\;usg=AOvVaw1P2bikfi
 DDcydXb8V9SH5Y&quot;&gt;https://bit.ly/&lt;wbr&gt;webinar-8-20-25-yt&lt;/a&gt;&lt;/span&gt;&lt;/strong&gt;
 &lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;As technologi
 es push the limits of traditional silicon\, the U.S. faces a critical chal
 lenge: how to continue delivering high-bandwidth\, energy-efficient\, mult
 ifunctional microelectronics essential for advanced technologies. Conventi
 onal 2D scaling is reaching physical and economic limits\, and while indus
 try is pursuing advanced packaging\, the integration of mixed materials &amp;n
 dash\; beyond silicon &amp;ndash\; remains largely untapped. Yet this integrat
 ion is essential for achieving the order-of-magnitude improvements that ne
 xt-generation capabilities will require.&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;Join &lt;s
 trong&gt;Michael&amp;nbsp\;&lt;span class=&quot;il&quot;&gt;Holmes&lt;/span&gt;&lt;/strong&gt;&amp;nbsp\;from DAR
 PA&amp;rsquo\;s Microsystems Technology Office\, to learn how DARPA&amp;rsquo\;s&amp;n
 bsp\;&lt;a title=&quot;https://usg02.safelinks.protection.office365.us/?url=https%
 3A%2F%2Fwww.darpa.mil%2Fresearch%2Fprograms%2Fnext-generation-microelectro
 nics&amp;amp\;data=05%7C02%7Cmichael.holmes%40darpa.mil%7C319fa4c040a84151e1fe
 08ddc06d3e44%7Cf84814b5f44e46909314553e36b5f585%7C0%7&quot; href=&quot;https://www.d
 arpa.mil/research/programs/next-generation-microelectronics&quot; target=&quot;_blan
 k&quot; rel=&quot;noopener&quot; data-saferedirecturl=&quot;https://www.google.com/url?q=https
 ://www.darpa.mil/research/programs/next-generation-microelectronics&amp;amp\;s
 ource=gmail&amp;amp\;ust=1753990694641000&amp;amp\;usg=AOvVaw2LTvSL7P-KWeswRpvpEuN
 W&quot;&gt;Next Generation Microelectronics Manufacturing (NGMM)&lt;/a&gt; program is ad
 dressing this challenge. NGMM is establishing the nation&amp;rsquo\;s first op
 en-access center for U.S.-based 3D heterogeneous integration (3DHI) focuse
 d on mixed materials integration to leapfrog ahead of today&amp;rsquo\;s state
  of the art. In partnership with The University of Texas at Austin and its
  Texas Institute for Electronics (TIE)\, NGMM is developing a sustainable 
 domestic hub for R&amp;amp\;D and pilot production\, which will enable rapid p
 rototyping and fabrication of advanced microsystems critical to future tec
 hnological needs. Attendees will also learn about opportunities to engage 
 with the NGMM community at the inaugural NGMM Summit this October in Austi
 n\, Texas.&lt;/p&gt;\n&lt;/div&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&lt;span style=&quot;color: #00
 0000\; font-family: helvetica\, arial\, sans-serif\;&quot;&gt;IEEE-USA&#39;s free webi
 nars/events are designed to help you find your next job\, maintain your ca
 reer\, negotiate an appropriate salary\, understand ethical considerations
  in the workplace and learn about other career-building strategies and pub
 lic policy developments that affect your profession.&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span 
 style=&quot;font-family: helvetica\, arial\, sans-serif\;&quot;&gt;For information rega
 rding upcoming webinars or to visit our vast webinar archive\, please visi
 t:&amp;nbsp\;&lt;strong&gt;&lt;a href=&quot;https://ieeeusa.org/careers/webinars/&quot; target=&quot;_
 blank&quot; rel=&quot;noopener&quot;&gt;https://ieeeusa.org/careers/webinars&lt;/a&gt;&lt;/strong&gt;&lt;/s
 pan&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;a href=&quot;https://newsletter.smartbrief.com/rest/sign-
 up/2479DAB0-4089-43E7-925D-86AE0C1E6244?campaign=e0d52cef&quot;&gt;Stay informed a
 bout future IEEE-USA Webinars by subscribing now to Smartbrief!&lt;/a&gt;&lt;/stron
 g&gt;&lt;/p&gt;
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