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DTSTART:20251102T010000
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DTSTAMP:20250828T203211Z
UID:AC860FF7-3042-490A-A826-BB9E7172FE1B
DTSTART;TZID=America/Los_Angeles:20250828T120000
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DESCRIPTION:[]Advances in smart response-based processes have significantly
  improved wire bond reliability and further strengthened the use of the te
 chnology in high-volume manufacturing (HVM). Wire bonding technology remai
 ns a staple choice in vast majority of semiconductor packages due to its l
 ow cost\, increased flexibility\, and high yield rate. A traditional wire 
 bond process consists of a wire loop with a ball bond on die and a wedge b
 ond on substrate. Vertical Wires are an emerging interconnect solution for
 med using a unique process on the same ball bond equipment. Vertical Wires
  can be used as an alternative to the traditional wire bond processes or i
 n conjunction with the traditional wire loops in SiPs. Although initially 
 developed for interconnection applications\, Vertical Wire technology was 
 introduced in HVM for EMI shielding in SiP and RF packages. This presentat
 ion will detail new advances in Vertical Wire Technology to further reduce
  wire pitch\, increase I/O density\, and reduce package footprint. An over
 view of application range\, capability and design rules for the technology
  will be discussed.\n\nSpeaker(s): Basil Milton\, \n\nVirtual: https://eve
 nts.vtools.ieee.org/m/495344
LOCATION:Virtual: https://events.vtools.ieee.org/m/495344
ORGANIZER:p.wesling@ieee.org
SEQUENCE:13
SUMMARY:Advances in Vertical Wire Technology for Wire Bond Applications
URL;VALUE=URI:https://events.vtools.ieee.org/m/495344
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/47ae14f2-ad9f-4250-a4d2-bf6a
 85ecc4dd&quot; alt=&quot;&quot; width=&quot;500&quot; height=&quot;250&quot;&gt;Advances in smart response-based
  processes have significantly improved wire bond reliability and further s
 trengthened the use of the technology in high-volume manufacturing (HVM). 
 Wire bonding technology remains a staple choice in vast majority of semico
 nductor packages due to its low cost\, increased flexibility\, and high yi
 eld rate. A traditional wire bond process consists of a wire loop with a b
 all bond on die and a wedge bond on substrate. Vertical Wires are an emerg
 ing interconnect solution formed using a unique process on the same ball b
 ond equipment. Vertical Wires can be used as an alternative to the traditi
 onal wire bond processes or in conjunction with the traditional wire loops
  in SiPs. Although initially developed for interconnection applications\, 
 Vertical Wire technology was introduced in HVM for EMI shielding in SiP an
 d RF packages. This presentation will detail new advances in Vertical Wire
  Technology to further reduce wire pitch\, increase I/O density\, and redu
 ce package footprint. An overview of application range\, capability and de
 sign rules for the technology will be discussed.&lt;/p&gt;
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