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DTSTART:20260308T030000
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DTSTART:20251102T010000
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DTSTAMP:20260126T235614Z
UID:F9352B13-1887-42DA-81B0-375FD2996486
DTSTART;TZID=America/Los_Angeles:20260122T080000
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DESCRIPTION:[]\n\nNOTE: On-site registration is fully booked\; we have reac
 hed the limits of our facility. Please join us on-line.\n\nHybrid Bonding 
 has emerged as the technology of choice in the semiconductor industry for 
 ultra-fine-pitch interconnection. With significant benefits for interconne
 ct density and device performance\, it will become widely adopted for a br
 oad range of high-performance semiconductor devices in the years to come. 
 The success of Hybrid Bonding technology for high-volume manufacturing dep
 ends critically on the process technology as well as materials and equipme
 nt. Design\, performance characterization\, thermal management and reliabi
 lity are also important considerations to enable applications in various a
 reas.\n\nJoin us to learn about this expanding field\, and discover how it
  will affect heterogeneous integration and system design. We expect regist
 rations for our on-site program to be filled by the middle of January\; we
  apologize if you are not able to attend in person\, but we encourage you 
 to join us via WebEx.\n\nSEMI World Headquarters\, 673 South Milpitas Blvd
 \, Milpitas\, California\, United States\, Virtual: https://events.vtools.
 ieee.org/m/495346
LOCATION:SEMI World Headquarters\, 673 South Milpitas Blvd\, Milpitas\, Cal
 ifornia\, United States\, Virtual: https://events.vtools.ieee.org/m/495346
ORGANIZER:p.wesling@ieee.org
SEQUENCE:79
SUMMARY:IEEE/EPS Hybrid Bonding Symposium
URL;VALUE=URI:https://events.vtools.ieee.org/m/495346
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/55ecab48-14bd-40f9-91a3-46bd
 d436a187&quot; alt=&quot;&quot; width=&quot;458&quot; height=&quot;225&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span style=&quot;color: rgb
 (224\, 62\, 45)\;&quot;&gt;&lt;strong&gt;NOTE: On-site registration is fully booked\; we
  have reached the limits of our facility.&amp;nbsp\; Please join us on-line.&lt;/
 strong&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Hybrid Bonding&lt;/strong&gt; has emerged as the 
 technology of choice in the semiconductor industry for ultra-fine-pitch in
 terconnection. With significant benefits for interconnect density and devi
 ce performance\, it will become widely adopted for a broad range of high-p
 erformance semiconductor devices in the years to come. The success of Hybr
 id Bonding technology for high-volume manufacturing depends critically on 
 the process technology as well as materials and equipment. Design\, perfor
 mance characterization\, thermal management and reliability are also impor
 tant considerations to enable applications in various areas.&lt;/p&gt;\n&lt;p&gt;Join 
 us to learn about this expanding field\, and discover how it will affect h
 eterogeneous integration and system design.&amp;nbsp\; We expect &lt;strong&gt;regis
 trations &lt;/strong&gt;for our on-site program &lt;strong&gt;to be filled by the midd
 le of January\; &lt;/strong&gt;we apologize if you are not able to attend in per
 son\, but we encourage you to join us via WebEx.&amp;nbsp\;&lt;/p&gt;
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