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DTSTAMP:20250917T134443Z
UID:B8E28A3E-9579-4037-A559-5EDD484DB6F4
DTSTART;TZID=America/New_York:20250903T073000
DTEND;TZID=America/New_York:20250904T170000
DESCRIPTION:GE Aerospace\, IBM Research and IEEC\, CAMM-Binghamton Universi
 ty invite you to attend this two-day event on September 3 and 4\, 2025 at 
 GE Aerospace Research in Niskayuna NY.\n\nThis symposium brings together l
 eaders in academia\, industry and government to discuss electronics packag
 ing topics of:\n\n• Future of Computing for HPC and AI\n\n• mm Wave\, 
 5G and 6G in Packaging\n\n• Power Electronics / Harsh Environments\n\n
 • Thermal Challenges in Advance Packaging\n\n• Flexible &amp; Wearable Ele
 ctronics\n\n• Heterogeneous Integration\n\n• Advance Substrates\n\n•
  Photonics Packaging\n\nAgenda : https://www.binghamton.edu/ieec/eps/agend
 a.html\n\nThis year&#39;s program includes keynotes\, 8 sessions with technica
 l presentations\, a student poster session with students from local Univer
 sities\, and exhibits from leading companies.\n\nWe will have a special pa
 nel and a workshop\, we will update this page once plans are finalized.\n\
 nWe aim to share quality\, up-to-date information through different lenses
  on trending electronics packaging topics\, and provide opportunities to n
 etwork\, share ones expertise\, learn\, and build partnerships.\n\nWe high
 ly encourage graduate students to join us in the poster session to showcas
 e their research! Make sure to register.\n\nDue to security requirements a
 t GE Aerospace Research\, registration will close 2 weeks before the event
 \, no walk-ins are allowed. Additional security questions were added to th
 e registration page\, make sure to provide answers to all questions.\n\nRe
 gistration \, required forms and program details can be found on our websi
 te:\n\nhttps://www.binghamton.edu/ieec/eps/index.html\n\nContact us at: ep
 sympos@binghamton.edu\n\nREGISTER TODAY and join a community which seeks a
 dvancement in the electronics packaging field. We look forward to seeing y
 ou this fall.\n\nAgenda: \nAgenda : https://www.binghamton.edu/ieec/eps/ag
 enda.html\n\nGE Aerospace Research\, Niskayuna\, New York\, United States\
 , 12309
LOCATION:GE Aerospace Research\, Niskayuna\, New York\, United States\, 123
 09
ORGANIZER:chanb@binghamton.edu
SEQUENCE:29
SUMMARY:2025 Electronics Packaging Symposium
URL;VALUE=URI:https://events.vtools.ieee.org/m/497032
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;GE Aerospace\, IBM Research and IEEC\, CAM
 M-Binghamton University invite you to attend this two-day event on Septemb
 er 3 and 4\, 2025 at GE Aerospace Research in Niskayuna NY.&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\
 ;&lt;/p&gt;\n&lt;p&gt;This symposium brings together leaders in academia\, industry an
 d government to discuss electronics packaging topics of:&lt;/p&gt;\n&lt;p&gt;&amp;bull\; F
 uture of Computing for HPC and AI&lt;/p&gt;\n&lt;p&gt;&amp;bull\; mm Wave\, 5G and 6G in P
 ackaging&lt;/p&gt;\n&lt;p&gt;&amp;bull\; Power Electronics / Harsh Environments&lt;/p&gt;\n&lt;p&gt;&amp;b
 ull\; Thermal Challenges in Advance Packaging&lt;/p&gt;\n&lt;p&gt;&amp;bull\; Flexible &amp;am
 p\; Wearable Electronics&lt;/p&gt;\n&lt;p&gt;&amp;bull\; Heterogeneous Integration&lt;/p&gt;\n&lt;p
 &gt;&amp;bull\; Advance Substrates&lt;/p&gt;\n&lt;p&gt;&amp;bull\; Photonics Packaging&lt;/p&gt;\n&lt;p&gt;Ag
 enda : &lt;a title=&quot;https://www.binghamton.edu/ieec/eps/agenda.html&quot; href=&quot;ht
 tps://www.binghamton.edu/ieec/eps/agenda.html&quot; target=&quot;_blank&quot; rel=&quot;nofoll
 ow noopener noreferrer&quot; data-msys-clicktrack=&quot;0&quot;&gt;https://www.binghamton.ed
 u/ieec/eps/agenda.html&lt;/a&gt;&lt;/p&gt;\n&lt;p&gt;This year&#39;s program includes keynotes\,
  8 sessions with technical presentations\, a student poster session with s
 tudents from local Universities\, and exhibits from leading companies.&lt;/p&gt;
 \n&lt;p&gt;We will have a special panel and a workshop\, we will update this pag
 e once plans are finalized.&lt;/p&gt;\n&lt;p&gt;We aim to share quality\, up-to-date i
 nformation through different lenses on trending electronics packaging topi
 cs\, and provide opportunities to network\, share ones expertise\, learn\,
  and build partnerships.&lt;/p&gt;\n&lt;p&gt;We highly encourage graduate students to 
 join us in the poster session to showcase their research! Make sure to reg
 ister.&lt;/p&gt;\n&lt;p&gt;Due to security requirements at GE Aerospace Research\, reg
 istration will close 2 weeks before the event\, no walk-ins are allowed. A
 dditional security questions were added to the registration page\, make su
 re to provide answers to all questions.&lt;/p&gt;\n&lt;p&gt;Registration \, required f
 orms and program details can be found on our website:&lt;/p&gt;\n&lt;p&gt;&lt;a title=&quot;ht
 tps://www.binghamton.edu/ieec/eps/index.html&quot; href=&quot;https://www.binghamton
 .edu/ieec/eps/index.html&quot; target=&quot;_blank&quot; rel=&quot;nofollow noopener noreferre
 r&quot; data-msys-clicktrack=&quot;0&quot;&gt;https://www.binghamton.edu/ieec/eps/index.html
 &lt;/a&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;Contact us at: epsympos@binghamton.edu&lt;/p&gt;\n&lt;
 p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;REGISTER TODAY and join a community which seeks advancem
 ent in the electronics packaging field. We look forward to seeing you this
  fall.&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;Age
 nda : &lt;a title=&quot;https://www.binghamton.edu/ieec/eps/agenda.html&quot; href=&quot;htt
 ps://www.binghamton.edu/ieec/eps/agenda.html&quot; target=&quot;_blank&quot; rel=&quot;nofollo
 w noopener noreferrer&quot; data-msys-clicktrack=&quot;0&quot;&gt;https://www.binghamton.edu
 /ieec/eps/agenda.html&lt;/a&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;
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