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PRODID:IEEE vTools.Events//EN
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TZID:Asia/Shanghai
BEGIN:STANDARD
DTSTART:19910915T010000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
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BEGIN:VEVENT
DTSTAMP:20250818T045321Z
UID:DBED96DB-2107-434A-B235-FEF17496FACF
DTSTART;TZID=Asia/Shanghai:20250711T090000
DTEND;TZID=Asia/Shanghai:20250811T122600
DESCRIPTION:In celebration of the 100th anniversary of the invention of the
  field-effect transistor (FET)\, the FET100 Celebration Activity: Colloqui
 um on Industry–Academia–Research Collaborative Innovation in GaN Techn
 ology was successfully held at Room BS4114\, IBSS Building\, SIP South Cam
 pus of Xi’an Jiaotong-Liverpool University (XJTLU). The event was jointl
 y organized by the IEEE CASS-EDS Suzhou Joint Chapter\, the IEEE CASS-EDS 
 XJTLU Student Branch Chapter\, and the XJTLU Advanced Semiconductor Resear
 ch Center. The colloquium was initiated and chaired by Associate Professor
  Wen Liu\, and jointly coordinated by Ms. Yu Hu and Ms. Jiao Li\, attracti
 ng enthusiastic participation from faculty\, students\, and industry repre
 sentatives.\n\nThis colloquium focused on the cutting-edge advancements an
 d interdisciplinary collaboration in Gallium Nitride (GaN) power electroni
 cs\, featuring keynote presentations from experts representing Nanjing Uni
 versity\, Innoscience Technology\, and XJTLU\, as well as research showcas
 es by student teams working on wide-bandgap semiconductor technologies.\n\
 nExpert Keynotes: Deep Dive into GaN Technologies and Applications\n\nThe 
 event opened with a keynote speech by Dr. Dunjun Chen\, Vice Dean of the S
 chool of Electronic Science and Engineering at Nanjing University. In his 
 talk\, “Gate Dielectric Technology and Reliability Mechanism of GaN-base
 d Power Devices”\, Dr. Chen elaborated on the intrinsic material propert
 ies of GaN — including its wide bandgap\, strong polarization\, and sign
 ificant lattice mismatch — and presented his team&#39;s latest research in B
 aTiO₃-based gate dielectric engineering. With optimized annealing at 400
 –500°C\, the team achieved record device performance: a breakdown volta
 ge of 1910 V\, a figure-of-merit of 1.05 GW/cm²\, and an average electric
  field strength of 1.4 MV/cm. Furthermore\, the devices demonstrated an ex
 ceptional on/off current ratio of 4.1×10⁹\, subthreshold swing of 70.6 
 mV/dec\, and saturation current of 508 mA/mm. Dr. Chen also introduced adv
 ancements in p-NiO gate structures\, which significantly improved hole con
 centration and carrier mobility.\n\nThe second talk was delivered by Dr. J
 iangmin Gu\, Associate Professor at the School of Intelligent Engineering\
 , XJTLU. His presentation\, “Sub-Block Design for Monolithic PMIC Based 
 on GaN HEMT Technology”\, focused on system-level design of monolithic G
 aN power management ICs (PMICs). Highlighting the superior performance of 
 GaN in high-voltage\, high-frequency\, and high-temperature applications\,
  Dr. Gu presented multiple functional circuit blocks including temperature
  sensors\, voltage reference generators\, over-temperature protection (OTP
 )\, undervoltage lockout (UVLO)\, and PWM control modules. His team’s wo
 rk bridges the gap between device-level modeling (using calibrated ASM-HEM
 T models) and circuit-level integration\, demonstrating high efficiency an
 d compactness in 48V-to-1V DC-DC converter designs.\n\nFollowing a short i
 ntermission\, the colloquium hosted a student research showcase\, where XJ
 TLU postgraduate students Chao Wang\, Xuanming Zhang\, Maoqing Ling\, Yan 
 Liu\, and Pingyu Cao presented their recent work on GaN material engineeri
 ng\, device optimization\, and simulation techniques. Their presentations 
 reflected the strength of emerging talent in wide-bandgap semiconductor re
 search at XJTLU.\n\nThe final keynote was delivered by Dr. Shuilin Tian\, 
 Senior Director of Product Design and Application at Innoscience Technolog
 y. His talk\, “High-Frequency Application of GaN Power Devices”\, prov
 ided a comprehensive comparison between GaN and traditional silicon power 
 devices. He emphasized GaN’s advantages in bandgap (3.39 eV)\, breakdown
  field (10× Si)\, and electron mobility (1500 cm²/V·s)\, enabling ultra
 -low on-resistance and high switching frequencies. For instance\, GaN devi
 ces have achieved 800 kHz switching in power banks with 97% efficiency\, a
 nd significantly reduced device sizes (down to 1/4 of Si devices at 100 V 
 rating). Through case studies in consumer electronics\, data centers\, and
  automotive systems\, Dr. Tian highlighted the compactness\, zero Qrr\, lo
 w Qg\, and thermal efficiency of integrated GaN solutions like InnoGaN™\
 , noting future research directions such as dynamic Ron\, threshold voltag
 e stability\, and paralleled device reliability.\n\nToward Deeper Collabor
 ation in GaN Innovation: This colloquium served not only as a platform for
  academic exchange but also as a springboard for future collaboration betw
 een . Attendees expressed strong interest in strengthening the links betwe
 en research\, education\, and industrial deployment in the GaN field. XJTL
 U will continue to promote interdisciplinary innovation in wide-bandgap se
 miconductors\, fostering talent development\, technological translation\, 
 and long-term partnership to support China’s next-generation semiconduct
 or industry.\n\nCo-sponsored by: XJTLU Adavanced Semiconductor Research Ce
 nter (ASRC)\n\nRoom:  BS4114\, Bldg:  IBSS Building \, Xi’an Jiaotong-Li
 verpool University (XJTLU) \, 111 Ren’ai Road \, Suzhou\, Jiangsu\, Chin
 a\, 215123
LOCATION:Room:  BS4114\, Bldg:  IBSS Building \, Xi’an Jiaotong-Liverpool
  University (XJTLU) \, 111 Ren’ai Road \, Suzhou\, Jiangsu\, China\, 215
 123
ORGANIZER:wen.liu@xjtlu.edu.cn
SEQUENCE:21
SUMMARY:FET100 Celebration: Colloquium on Industry–Academia–Research Co
 llaborative Innovation in GaN Technology
URL;VALUE=URI:https://events.vtools.ieee.org/m/497191
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot;&gt;&lt;span style=&quot;mso-fareast
 -language: ZH-CN\;&quot;&gt;&amp;nbsp\;&lt;img src=&quot;https://events.vtools.ieee.org/vtools
 _ui/media/display/91114fd1-4bc1-4929-8bc1-a01718ebd0f3&quot;&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p cl
 ass=&quot;MsoNormal&quot;&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;span style=&quot;mso-fareast
 -language: ZH-CN\;&quot;&gt;In celebration of the&amp;nbsp\;&lt;strong&gt;100th anniversary 
 of the invention of the field-effect transistor (FET)&lt;/strong&gt;\, the &lt;stro
 ng&gt;&lt;em&gt;FET100 Celebration Activity: Colloquium on Industry&amp;ndash\;Academia
 &amp;ndash\;Research Collaborative Innovation in GaN Technology&lt;/em&gt; &lt;/strong&gt;
 was successfully held at Room BS4114\, IBSS Building\, SIP South Campus of
  &lt;span style=&quot;color: rgb(0\, 0\, 0)\;&quot;&gt;&lt;strong&gt;Xi&amp;rsquo\;an Jiaotong-Liver
 pool University (XJTLU)&lt;/strong&gt;&lt;/span&gt;. The event was jointly organized b
 y the IEEE CASS-EDS Suzhou Joint Chapter\, the IEEE CASS-EDS XJTLU Student
  Branch Chapter\, and the XJTLU Advanced Semiconductor Research Center. &lt;s
 trong&gt;The colloquium was initiated and chaired by Associate Professor Wen 
 Liu&lt;/strong&gt;\, and jointly coordinated by &lt;strong&gt;Ms. Yu Hu &lt;/strong&gt;and &lt;
 strong&gt;Ms. Jiao Li&lt;/strong&gt;\, attracting enthusiastic participation from f
 aculty\, students\, and industry representatives.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;Ms
 oNormal&quot;&gt;&lt;span style=&quot;mso-fareast-language: ZH-CN\;&quot;&gt;This colloquium focus
 ed on the &lt;strong&gt;cutting-edge advancements and interdisciplinary collabor
 ation in Gallium Nitride (GaN) power electronics\, &lt;/strong&gt;featuring keyn
 ote presentations from experts representing &lt;strong&gt;Nanjing University\, I
 nnoscience Technology\, and XJTLU&lt;/strong&gt;\, as well as research showcases
  by student teams working on wide-bandgap semiconductor technologies.&lt;/spa
 n&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;&lt;span style=&quot;font-size: 14.0pt\; line
 -height: 150%\; mso-fareast-language: ZH-CN\;&quot;&gt;Expert Keynotes: Deep Dive 
 into GaN Technologies and Applications&lt;/span&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoN
 ormal&quot;&gt;&lt;span style=&quot;mso-fareast-language: ZH-CN\;&quot;&gt;The event opened with a
  keynote speech by &lt;strong&gt;Dr. Dunjun Chen\, Vice Dean of the School of El
 ectronic Science and Engineering at Nanjing University. &lt;/strong&gt;In his ta
 lk\, &lt;strong&gt;&lt;em&gt;&amp;ldquo\;Gate Dielectric Technology and Reliability Mechan
 ism of GaN-based Power Devices&amp;rdquo\;&lt;/em&gt;&lt;/strong&gt;\, Dr. Chen elaborated
  on the intrinsic material properties of GaN &amp;mdash\; including its wide b
 andgap\, strong polarization\, and significant lattice mismatch &amp;mdash\; a
 nd presented his team&#39;s latest research in BaTiO₃-based gate dielectric 
 engineering. With optimized annealing at 400&amp;ndash\;500&amp;deg\;C\, the team 
 achieved record device performance: a breakdown voltage of 1910 V\, a figu
 re-of-merit of 1.05 GW/cm&amp;sup2\;\, and an average electric field strength 
 of 1.4 MV/cm. Furthermore\, the devices demonstrated an exceptional on/off
  current ratio of 4.1&amp;times\;10⁹\, subthreshold swing of 70.6 mV/dec\, a
 nd saturation current of 508 mA/mm. Dr. Chen also introduced advancements 
 in p-NiO gate structures\, which significantly improved hole concentration
  and carrier mobility.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;span style=&quot;mso-f
 areast-language: ZH-CN\;&quot;&gt;The second talk was delivered by &lt;strong&gt;Dr. Jia
 ngmin Gu&lt;/strong&gt;&lt;em&gt;\, &lt;/em&gt;Associate Professor at the School of Intellig
 ent Engineering\, XJTLU. His presentation\, &lt;em&gt;&amp;ldquo\;S&lt;strong&gt;ub-Block 
 Design for Monolithic PMIC Based on GaN HEMT Technology&amp;rdquo\;&lt;/strong&gt;&lt;/
 em&gt;&lt;strong&gt;\,&lt;/strong&gt; focused on system-level design of monolithic GaN po
 wer management ICs (PMICs). Highlighting the superior performance of GaN i
 n high-voltage\, high-frequency\, and high-temperature applications\, Dr. 
 Gu presented multiple functional circuit blocks including temperature sens
 ors\, voltage reference generators\, over-temperature protection (OTP)\, u
 ndervoltage lockout (UVLO)\, and PWM control modules. His team&amp;rsquo\;s wo
 rk bridges the gap between device-level modeling (using calibrated ASM-HEM
 T models) and circuit-level integration\, demonstrating high efficiency an
 d compactness in 48V-to-1V DC-DC converter designs.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;
 MsoNormal&quot;&gt;&lt;span style=&quot;mso-fareast-language: ZH-CN\;&quot;&gt;Following a short i
 ntermission\, the colloquium hosted a student research showcase\, where &lt;s
 trong&gt;XJTLU postgraduate students Chao Wang\, Xuanming Zhang\, Maoqing Lin
 g\, Yan Liu\, and Pingyu Cao&lt;/strong&gt; presented their recent work on GaN m
 aterial engineering\, device optimization\, and simulation techniques. The
 ir presentations reflected the strength of emerging talent in wide-bandgap
  semiconductor research at XJTLU.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;span s
 tyle=&quot;mso-fareast-language: ZH-CN\;&quot;&gt;The final keynote was delivered by &lt;s
 trong&gt;Dr. Shuilin Tian&lt;/strong&gt;\, &lt;strong&gt;Senior Director of Product Desig
 n and Application at Innoscience Technology&lt;/strong&gt;. His talk\, &lt;strong&gt;&lt;
 em&gt;&amp;ldquo\;High-Frequency Application of GaN Power Devices&amp;rdquo\;&lt;/em&gt;&lt;/s
 trong&gt;\, provided a comprehensive comparison between GaN and traditional s
 ilicon power devices. He emphasized GaN&amp;rsquo\;s advantages in bandgap (3.
 39 eV)\, breakdown field (10&amp;times\; Si)\, and electron mobility (1500 cm&amp;
 sup2\;/V&amp;middot\;s)\, enabling ultra-low on-resistance and high switching 
 frequencies. For instance\, GaN devices have achieved 800 kHz switching in
  power banks with 97% efficiency\, and significantly reduced device sizes 
 (down to 1/4 of Si devices at 100 V rating). Through case studies in consu
 mer electronics\, data centers\, and automotive systems\, Dr. Tian highlig
 hted the compactness\, zero &lt;em&gt;Q&lt;sub&gt;rr&lt;/sub&gt;&lt;/em&gt;\, low &lt;em&gt;Q&lt;sub&gt;g&lt;/sub
 &gt;&lt;/em&gt;\, and thermal efficiency of integrated GaN solutions like InnoGaN&amp;t
 rade\;\, noting future research directions such as dynamic Ron\, threshold
  voltage stability\, and paralleled device reliability.&lt;/span&gt;&lt;/p&gt;\n&lt;p cla
 ss=&quot;MsoNormal&quot;&gt;&lt;strong&gt;&lt;span style=&quot;font-size: 14.0pt\; line-height: 150%\
 ; mso-fareast-language: ZH-CN\;&quot;&gt;Toward Deeper Collaboration in GaN Innova
 tion: &lt;/span&gt;&lt;/strong&gt;&lt;span style=&quot;mso-fareast-language: ZH-CN\;&quot;&gt;This col
 loquium served not only as a platform for academic exchange but also as a 
 springboard for future collaboration between . Attendees expressed strong 
 interest in strengthening the links between research\, education\, and ind
 ustrial deployment in the GaN field. &lt;/span&gt;&lt;span style=&quot;mso-fareast-langu
 age: ZH-CN\;&quot;&gt;XJTLU will continue to promote interdisciplinary innovation 
 in wide-bandgap semiconductors\, fostering talent development\, technologi
 cal translation\, and long-term partnership to support China&amp;rsquo\;s next
 -generation semiconductor industry.&lt;/span&gt;&lt;/p&gt;
END:VEVENT
END:VCALENDAR

