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DTSTART:20251102T010000
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BEGIN:VEVENT
DTSTAMP:20260109T192737Z
UID:6DAD37BF-9F83-412B-827E-98F20ADEFA8E
DTSTART;TZID=America/Los_Angeles:20250911T173000
DTEND;TZID=America/Los_Angeles:20250911T183000
DESCRIPTION:[]\n\nAt the time of the event\, join us on Zoom https://simnet
 .zoom.us/j/92184919783?pwd=GHpuXcsNStX6j6dGIk5uuFt741bVbf.1\n\nAbstract:\n
 The arrival of Wi-Fi 7 in early 2024\, based on IEEE 802.11be\, marks a pa
 radigm shift in wireless networking—moving from single-link connections 
 toward collaborative multi-link operation\, enabling greater capacity and 
 lower latency. With multi-link operation\, Wi-Fi 7 can achieve a maximum t
 hroughput of 30 Gbps.\n\nWhile this peak throughput supports most existing
  applications\, it falls short of meeting the strict reliability demands o
 f emerging use cases such as the metaverse\, augmented and virtual reality
 \, robotics\, and industrial automation. These challenges are driving the 
 development of the next generation—Wi-Fi 8.\n\nTo address these needs\, 
 the IEEE 802.11 Task Group bn has been established to define Ultra High Re
 liability (UHR) PHY and MAC layers. Their goal is to improve WLAN reliabil
 ity\, reduce latency\, enhance manageability\, and increase throughput acr
 oss varying signal-to-noise ratios (SNRs).\n\nIn this talk\, we will ident
 ify and describe the key PHY and MAC elements that will shape Wi-Fi 8\, wh
 ich will operate in the 2.4 GHz\, 5 GHz\, and 6 GHz bands. We will also di
 scuss the enabling mechanisms under design and present performance results
  where appropriate.\n\nBio:\nDr. Cheng Chen is a Senior Staff Wireless Sta
 ndards Engineer at Intel Corporation. He leads Intel&#39;s standardization eff
 orts on Wi-Fi sensing (802.11bf) and integrated millimeter wave (802.11bq)
  within the IEEE 802.11 Working Group\, as well as Intel&#39;s Wi-Fi certifica
 tion programs within the Wi-Fi Alliance. He currently serves as Editor for
  the IEEE 802.11bq Task Group\, Technical Editor for the Wi-Fi 7 Technical
  Task Group\, and Vice Chair of the Wi-Fi Sensing Task Group in the Wi-Fi 
 Alliance. He previously served as Technical Editor for the Wi-Fi 6 Technic
 al Task Group (July 2021–June 2022).\n\nDr. Chen is a Senior Member of t
 he IEEE and an IEEE ComSoc Distinguished Lecturer for the 2025–2026 term
 . He is an active contributor and voting member of multiple IEEE 802.11 st
 andards\, including 802.11ay (Next-generation 60 GHz Wi-Fi)\, 802.11be (Ex
 tremely High Throughput)\, 802.11bf (WLAN Sensing)\, 802.11bn (Ultra High 
 Reliability)\, and 802.11bq (Integrated Millimeter Wave). He also contribu
 tes to several Wi-Fi Alliance certification programs\, including Wi-Fi 6\,
  Wi-Fi 6E\, Wi-Fi 7\, and Wi-Fi sensing.\n\nIn recognition of his outstand
 ing contributions across standards forums\, Dr. Chen has received multiple
  awards\, including the IEEE Standards Association Award for Outstanding C
 ontributions to IEEE 802.11ay and the Wi-Fi Alliance Leadership Recognitio
 n Award for the Wi-Fi 6 launch.\n\nDr. Chen earned his B.E. degree in Elec
 tronics and Information Engineering from Huazhong University of Science an
 d Technology\, Wuhan\, China\, in 2011\, and his M.S. and Ph.D. degrees in
  Electrical Engineering from Northwestern University\, Evanston\, IL\, in 
 2013 and 2016\, respectively.\n\nCo-sponsored by: Pradeep Kumar\n\nVirtual
 : https://events.vtools.ieee.org/m/497970
LOCATION:Virtual: https://events.vtools.ieee.org/m/497970
ORGANIZER:pradeep@ieee.org
SEQUENCE:35
SUMMARY:Oregon ComSoc: The Next Leap in Wireless: Inside the Evolution from
  Wi-Fi 7 to 8
URL;VALUE=URI:https://events.vtools.ieee.org/m/497970
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&lt;img src=&quot;https://
 events.vtools.ieee.org/vtools_ui/media/display/9a28657f-85f0-4ded-bc76-dc9
 dbdc2f064&quot; alt=&quot;&quot; width=&quot;700&quot; height=&quot;366&quot;&gt;&lt;br&gt;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;&lt;span sty
 le=&quot;color: rgb(230\, 126\, 35)\;&quot;&gt;&lt;strong&gt;&lt;span style=&quot;color: rgb(52\, 73\
 , 94)\;&quot;&gt;At the time of the event\, join us on Zoom&lt;/span&gt; &lt;a href=&quot;https:
 //simnet.zoom.us/j/92184919783?pwd=GHpuXcsNStX6j6dGIk5uuFt741bVbf.1&quot;&gt;https
 ://simnet.zoom.us/j/92184919783?pwd=GHpuXcsNStX6j6dGIk5uuFt741bVbf.1&lt;/a&gt;&lt;/
 strong&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Abstract:&lt;/strong&gt;&lt;br data-start=&quot;206&quot; data
 -end=&quot;209&quot;&gt;The arrival of Wi-Fi 7 in early 2024\, based on IEEE 802.11be\,
  marks a paradigm shift in wireless networking&amp;mdash\;moving from single-l
 ink connections toward collaborative multi-link operation\, enabling great
 er capacity and lower latency. With multi-link operation\, Wi-Fi 7 can ach
 ieve a maximum throughput of 30 Gbps.&lt;/p&gt;\n&lt;p data-start=&quot;524&quot; data-end=&quot;8
 36&quot;&gt;While this peak throughput supports most existing applications\, it fa
 lls short of meeting the strict reliability demands of emerging use cases 
 such as the metaverse\, augmented and virtual reality\, robotics\, and ind
 ustrial automation. These challenges are driving the development of the ne
 xt generation&amp;mdash\;Wi-Fi 8.&lt;/p&gt;\n&lt;p data-start=&quot;838&quot; data-end=&quot;1125&quot;&gt;To 
 address these needs\, the IEEE 802.11 Task Group bn has been established t
 o define Ultra High Reliability (UHR) PHY and MAC layers. Their goal is to
  improve WLAN reliability\, reduce latency\, enhance manageability\, and i
 ncrease throughput across varying signal-to-noise ratios (SNRs).&lt;/p&gt;\n&lt;p d
 ata-start=&quot;1127&quot; data-end=&quot;1394&quot;&gt;In this talk\, we will identify and descr
 ibe the key PHY and MAC elements that will shape Wi-Fi 8\, which will oper
 ate in the 2.4 GHz\, 5 GHz\, and 6 GHz bands. We will also discuss the ena
 bling mechanisms under design and present performance results where approp
 riate.&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;margin-bottom: 0in\; line-height: 
 normal\; background: white\;&quot;&gt;&lt;strong&gt;&lt;span style=&quot;mso-fareast-font-family
 : &#39;Times New Roman&#39;\; mso-bidi-font-family: Arial\; color: #222222\; mso-f
 ont-kerning: 0pt\; mso-ligatures: none\;&quot;&gt;Bio: &lt;br&gt;&lt;/span&gt;&lt;/strong&gt;Dr. Che
 ng Chen is a Senior Staff Wireless Standards Engineer at Intel Corporation
 . He leads Intel&#39;s standardization efforts on Wi-Fi sensing (802.11bf) and
  integrated millimeter wave (802.11bq) within the IEEE 802.11 Working Grou
 p\, as well as Intel&#39;s Wi-Fi certification programs within the Wi-Fi Allia
 nce. He currently serves as Editor for the IEEE 802.11bq Task Group\, Tech
 nical Editor for the Wi-Fi 7 Technical Task Group\, and Vice Chair of the 
 Wi-Fi Sensing Task Group in the Wi-Fi Alliance. He previously served as Te
 chnical Editor for the Wi-Fi 6 Technical Task Group (July 2021&amp;ndash\;June
  2022).&lt;/p&gt;\n&lt;p data-start=&quot;2012&quot; data-end=&quot;2519&quot;&gt;Dr. Chen is a Senior Mem
 ber of the IEEE and an IEEE ComSoc Distinguished Lecturer for the 2025&amp;nda
 sh\;2026 term. He is an active contributor and voting member of multiple I
 EEE 802.11 standards\, including 802.11ay (Next-generation 60 GHz Wi-Fi)\,
  802.11be (Extremely High Throughput)\, 802.11bf (WLAN Sensing)\, 802.11bn
  (Ultra High Reliability)\, and 802.11bq (Integrated Millimeter Wave). He 
 also contributes to several Wi-Fi Alliance certification programs\, includ
 ing Wi-Fi 6\, Wi-Fi 6E\, Wi-Fi 7\, and Wi-Fi sensing.&lt;/p&gt;\n&lt;p data-start=&quot;
 2521&quot; data-end=&quot;2804&quot;&gt;In recognition of his outstanding contributions acro
 ss standards forums\, Dr. Chen has received multiple awards\, including th
 e IEEE Standards Association Award for Outstanding Contributions to IEEE 8
 02.11ay and the Wi-Fi Alliance Leadership Recognition Award for the Wi-Fi 
 6 launch.&lt;/p&gt;\n&lt;p data-start=&quot;2806&quot; data-end=&quot;3090&quot;&gt;Dr. Chen earned his B.
 E. degree in Electronics and Information Engineering from Huazhong Univers
 ity of Science and Technology\, Wuhan\, China\, in 2011\, and his M.S. and
  Ph.D. degrees in Electrical Engineering from Northwestern University\, Ev
 anston\, IL\, in 2013 and 2016\, respectively.&lt;/p&gt;
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