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DTSTAMP:20100506T154946Z
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DESCRIPTION:Memory technology and the memory business has for many years be
 en the engine that powered technological innovations in the semiconductors
  especially in the area of lithography and innovative micro-structural eng
 ineering. While stand-alone memory itself has been commoditized\, when emb
 edded in high performance logic it provides incredible leverage for high p
 erformance processors\, network and mobile appliances\, and almost every a
 pplication. In this talk\, we will explore the course of memory in systems
 \, especially DRAM\, integration of deep trench technology into high perfo
 rmance logic\, the value it brings as well as the collateral advantages it
  has brought about in power management\, noise decoupling\, autonomic chip
  repair and its potential evolution into 3-dimensional chip technology.\n\
 nNewark\, NJ 07102\, New Jersey\, United States
LOCATION:Newark\, NJ 07102\, New Jersey\, United States
ORGANIZER:dmisra@ieee.org
SEQUENCE:0
SUMMARY:[Legacy Report] From Deep Trenches to Skyscrapers: A walk down Memo
 ry Lane
URL;VALUE=URI:https://events.vtools.ieee.org/m/50023
X-ALT-DESC:Description: <br />Memory technology and the memory business has
  for many years been the engine that powered technological innovations in 
 the semiconductors especially in the area of lithography and innovative mi
 cro-structural engineering.  While stand-alone memory itself has been comm
 oditized\, when embedded in high performance logic it provides incredible 
 leverage for high performance processors\, network and mobile appliances\,
  and almost every application.  In this talk\, we will explore the course 
 of memory in systems\, especially DRAM\, integration of deep trench techno
 logy into high performance logic\, the value it brings as well as the coll
 ateral advantages it has brought about in power management\, noise decoupl
 ing\, autonomic chip repair and its potential evolution into 3-dimensional
  chip technology.
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