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DTSTART;TZID=America/Denver:20250917T180000
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DESCRIPTION:Presentation: 3D Memory\, 3D Packaging: What Next?\n\nAbstract:
  “If we make them smaller\, we can make them faster” has been the appr
 oach to building faster computers over the last 70-years starting with the
  first transistors and continuing as we built increasingly more complex in
 tegrated circuits. More recently we have gone Beyond Moore’s Law to fabr
 icate advanced supercomputers and AI computers using 3D Memory and 3D Pack
 aging. In this talk\, I review recent trends in 3D Memory and 3D Packaging
  which are driving these high performance system towards wafer scale syste
 ms with multiple reticle sized processors and 3D memories. We observe the 
 next generation HBM4\, high bandwidth 3D DRAM\, and the emergence of the H
 BF\, high bandwidth Flash memory\, to increase memory capacity to serve la
 rger databases.\n\nSpeaker(s): David Bondurant\, \n\nVirtual: https://even
 ts.vtools.ieee.org/m/500272
LOCATION:Virtual: https://events.vtools.ieee.org/m/500272
ORGANIZER:gowansj@ieee.org
SEQUENCE:23
SUMMARY:CIR & CIS: 3D Memory\, 3D Packaging: What Next?
URL;VALUE=URI:https://events.vtools.ieee.org/m/500272
X-ALT-DESC:Description: <br /><div class="presentation-title"><strong>Prese
 ntation: 3D Memory\, 3D Packaging: What Next?</strong></div>\n<div class="
 abstract">&nbsp\;</div>\n<div class="abstract"><strong>Abstract:</strong> 
 &ldquo\;If we make them smaller\, we can make them faster&rdquo\; has been
  the approach to building faster computers over the last 70-years starting
  with the first transistors and continuing as we built increasingly more c
 omplex integrated circuits. More recently we have gone Beyond Moore&rsquo\
 ;s Law to fabricate advanced supercomputers and AI computers using 3D Memo
 ry and 3D Packaging. In this talk\, I review recent trends in 3D Memory an
 d 3D Packaging which are driving these high performance system towards waf
 er scale systems with multiple reticle sized processors and 3D memories. W
 e observe the next generation HBM4\, high bandwidth 3D DRAM\, and the emer
 gence of the HBF\, high bandwidth Flash memory\, to increase memory capaci
 ty to serve larger databases.</div>
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