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DTSTAMP:20251204T234528Z
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DTSTART;TZID=America/Los_Angeles:20251204T120000
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DESCRIPTION:[]Trends in consumer goods are leaning towards thinner\, more c
 ompact products with higher performance than their predecessors. Today’s
  consumer wants lightweight\, portable\, battery-operated gear that is pow
 erful enough to satisfy their needs for speed and ease of use. One of the 
 biggest challenges facing product design is thermal management. Case tempe
 rature limits for products that come in contact with user’s skin place c
 onstraints on internal power dissipation and increase the need for improve
 d thermal management. With the introduction of locally processed AI and hi
 gher compact portable device processing loads thermal issues are critical 
 for avoiding throttling.\nµCooling: A new device has been invented that c
 hanges the way thermal engineers are approaching system cooling design. µ
 Cooling is a new concept in air movers. It is small\, and thin and is a co
 mplete departure from rotating mass fans. This MEMS-based invention can mo
 ve air through very small spaces\, used directly on a chip or package\, pl
 aced remotely through tiny ducts\, or mounted outside of a product. In fac
 t\, the versatility of µCooling changes the way we can manage heat at the
  package\, SoC\, or bare-chip level. This talk will introduce µCooling\, 
 a MEMS-based\, all-silicon\, micro-sized air pump. The device will be desc
 ribed in terms of how it works\, performance characteristics\, and applica
 tion examples.\n\nSpeaker(s): Tom Tarter\, \n\nVirtual: https://events.vto
 ols.ieee.org/m/500418
LOCATION:Virtual: https://events.vtools.ieee.org/m/500418
ORGANIZER:p.wesling@ieee.org
SEQUENCE:17
SUMMARY:Characterization and Application of a New Chip-Level Air Pump
URL;VALUE=URI:https://events.vtools.ieee.org/m/500418
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/30b9926b-0798-4e5b-9e12-130b
 f5f98dbd" alt="" width="500" height="250">Trends in consumer goods are lea
 ning towards thinner\, more compact products with higher performance than 
 their predecessors. Today&rsquo\;s consumer wants lightweight\, portable\,
  battery-operated gear that is powerful enough to satisfy their needs for 
 speed and ease of use. One of the biggest challenges facing product design
  is thermal management. Case temperature limits for products that come in 
 contact with user&rsquo\;s skin place constraints on internal power dissip
 ation and increase the need for improved thermal management. With the intr
 oduction of locally processed AI and higher compact portable device proces
 sing loads thermal issues are critical for avoiding throttling.<br><strong
 >&micro\;Cooling:</strong> A new device has been invented that changes the
  way thermal engineers are approaching system cooling design. &micro\;Cool
 ing is a new concept in air movers. It is small\, and thin and is a comple
 te departure from rotating mass fans. This MEMS-based invention can move a
 ir through very small spaces\, used directly on a chip or package\, placed
  remotely through tiny ducts\, or mounted outside of a product. In fact\, 
 the versatility of &micro\;Cooling changes the way we can manage heat at t
 he package\, SoC\, or bare-chip level. This talk will introduce &micro\;Co
 oling\, a MEMS-based\, all-silicon\, micro-sized air pump. The device will
  be described in terms of how it works\, performance characteristics\, and
  application examples.</p>
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