BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Chicago
BEGIN:DAYLIGHT
DTSTART:20260308T030000
TZOFFSETFROM:-0600
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:CDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20251102T010000
TZOFFSETFROM:-0500
TZOFFSETTO:-0600
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:CST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20251110T170320Z
UID:EF0CAA3C-16ED-4A6C-B2FA-5CF3149FC246
DTSTART;TZID=America/Chicago:20251107T130000
DTEND;TZID=America/Chicago:20251107T143000
DESCRIPTION:This lecture presents the latest innovations in mmWave antenna-
 in-package (AiP) technologies as a key enabler of high-performance wireles
 s communication and sensing systems. It covers advancements in high-freque
 ncy packaging substrates for compact multi-layer AiP integration\, along w
 ith signal and power integrity challenges and solutions. The lecture also 
 includes heterogeneous integration approaches\, measurement methodologies 
 and results\, as well as an introduction to the emerging Antennas-to-AI pl
 atform concept.\n\nSpeaker(s): Atom\, \n\nRoom: Osborn Conference Room\, B
 ldg: ECSN\, 800 W Campbell Rd\, Richardson\, Texas\, United States\, 75080
 -3021
LOCATION:Room: Osborn Conference Room\, Bldg: ECSN\, 800 W Campbell Rd\, Ri
 chardson\, Texas\, United States\, 75080-3021
ORGANIZER:exp230017@utdallas.edu
SEQUENCE:2
SUMMARY:The Evolution of mmWave Antenna in Package Toward a Connected Intel
 ligent Future
URL;VALUE=URI:https://events.vtools.ieee.org/m/500589
X-ALT-DESC:Description: <br /><p style="language: en-US\; line-height: norm
 al\; margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-indent
 : 0in\; text-align: left\; direction: ltr\; unicode-bidi: embed\; mso-line
 -break-override: none\; word-break: normal\; punctuation-wrap: hanging\;">
 <span style="font-size: 18.0pt\; font-family: 'IBM Plex Sans'\; mso-ascii-
 font-family: 'IBM Plex Sans'\; mso-fareast-font-family: +mn-ea\; mso-bidi-
 font-family: +mn-cs\; mso-fareast-theme-font: minor-fareast\; mso-bidi-the
 me-font: minor-bidi\; color: black\; mso-color-index: 1\; mso-font-kerning
 : 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-te
 xtfill-fill-themecolor: text1\; mso-style-textfill-fill-color: black\; mso
 -style-textfill-fill-alpha: 100.0%\;">This lecture presents the latest inn
 ovations in mmWave antenna-in-package (AiP) technologies as a key enabler 
 of high-performance wireless communication and sensing systems. It covers 
 advancements in high-frequency packaging substrates for compact multi-laye
 r AiP integration\, along with signal and power integrity challenges and s
 olutions.<span style="mso-spacerun: yes\;">&nbsp\; </span>The lecture also
  includes heterogeneous integration approaches\, measurement methodologies
  and results\, as well as an introduction to the emerging Antennas-to-AI p
 latform concept.</span></p>
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