BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Los_Angeles BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0800 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:PDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0700 TZOFFSETTO:-0800 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:PST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251023T201217Z UID:A9E52092-D80D-4A43-81C9-67DBC0FE6B09 DTSTART;TZID=America/Los_Angeles:20251023T120000 DTEND;TZID=America/Los_Angeles:20251023T130000 DESCRIPTION:[]For over three decades\, Sn-based material solder joints have remained the silent workhorses of electronic packaging. Since the transit ion from eutectic Sn-Pb to SAC305 alloy systems\, these interconnects have sustained the fast-moving pace of system- and device-level integration wi th sufficient mechanical\, thermal\, and electrical reliability. While the semiconductor industry has undergone unprecedented transformation toward higher performance systems\, the SAC305 alloy solder joints have quietly a bsorbed stress\, ensured functionality\, and maintained manufacturability across generations of products.\nHowever\, the emergence of high-performan ce computing (HPC) and AI-driven network systems places unprecedented dema nds on these long-serving SAC305 interconnects. Are we asking too much fro m the long pasting current solder material and technology that has already given so much? This seminar revisits the fundamentals of solder joint evo lution\, exploring why it has been so effective for thirty years and the i nherent limitations now emerging. The general thermo-mechanical and electr ical performance degradation mechanism will be reviewed\, and compared wit h the new material systems such as low melting temperature alloy systems. The lessons between these different degradation mechanisms and further dem and and new boundary conditions will provide a view of what solder challen ges in the AI era might look like. We will discuss whether the era of trad itional solder joints is approaching its boundary of service\, and what em erging roles solder might play. Looking forward\, we will consider how int erconnects must adapt or be reimagined to meet the challenges of the next generation of AI and High-Performance computing systems.\n\nSpeaker(s): Ta e-Kyu Lee\, \n\nVirtual: https://events.vtools.ieee.org/m/501073 LOCATION:Virtual: https://events.vtools.ieee.org/m/501073 ORGANIZER:p.wesling@ieee.org SEQUENCE:11 SUMMARY:The Evolution and Emerging role of Solder Joints in AI and High-Per formance Electronics URL;VALUE=URI:https://events.vtools.ieee.org/m/501073 X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e vents.vtools.ieee.org/vtools_ui/media/display/41d447e5-aaa4-4fa1-a4a7-eb7c 68227ec9" alt="" width="500" height="250">For over three decades\, Sn-base d material solder joints have remained the silent workhorses of electronic packaging. Since the transition from eutectic Sn-Pb to SAC305 alloy syste ms\, these interconnects have sustained the fast-moving pace of system- an d device-level integration with sufficient mechanical\, thermal\, and elec trical reliability. While the semiconductor industry has undergone unprece dented transformation toward higher performance systems\, the SAC305 alloy solder joints have quietly absorbed stress\, ensured functionality\, and maintained manufacturability across generations of products.<br>However\, the emergence of high-performance computing (HPC) and AI-driven network sy stems places unprecedented demands on these long-serving SAC305 interconne cts. Are we asking too much from the long pasting current solder material and technology that has already given so much? This seminar revisits the f undamentals of solder joint evolution\, exploring why it has been so effec tive for thirty years and the inherent limitations now emerging. The gener al thermo-mechanical and electrical performance degradation mechanism will be reviewed\, and compared with the new material systems such as low melt ing temperature alloy systems. The lessons between these different degrada tion mechanisms and further demand and new boundary conditions will provid e a view of what solder challenges in the AI era might look like. We will discuss whether the era of traditional solder joints is approaching its bo undary of service\, and what emerging roles solder might play. Looking for ward\, we will consider how interconnects must adapt or be reimagined to m eet the challenges of the next generation of AI and High-Performance compu ting systems.</p> END:VEVENT END:VCALENDAR