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DTSTART:20250330T030000
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DTSTAMP:20251010T071808Z
UID:D22AB4CE-EF15-4A32-A10A-353822273963
DTSTART;TZID=Europe/Prague:20250827T093000
DTEND;TZID=Europe/Prague:20250829T140000
DESCRIPTION:The International Seminar on Power Semiconductors (ISPS) provid
 es a forum for technical discussion in the area of power semiconductor dev
 ices and their applications. It is a small conference with the special fla
 ir of an atmosphere of searching deeper insight and intensive discussion.\
 n\nCo-sponsored by: Czech Technical University in Prague\, Faculty of Elec
 trical Engineering\n\nSpeaker(s): Shiori Idaka\, \n\nAgenda: \n27.8.2025\n
 \n1st session: SiC devices\n\n2nd session: Power Electronics roadmap and G
 aN Device\n\n28.8.2023\n\nPoster session\n\n3rd session Si Devices\n\n29.8
 .2025\n\n4th session Beyond Wide Bandgap\n\n5th session Packaging and Reli
 ability\n\n6th session Applications Chairperson\n\nISPS closing\n\nMore de
 tails are available here: https://technology.fel.cvut.cz/en/isps/\n\nRoom:
  Penthouse on 10th floor\, Bldg: Gate A\, Czech Institute of Informatics\,
  Robotics and Cybernetic\,  Jugoslávských partyzánů 1580/3\, Praha 6\,
  Czech Republic\, Czech Republic\, 16000
LOCATION:Room: Penthouse on 10th floor\, Bldg: Gate A\, Czech Institute of 
 Informatics\, Robotics and Cybernetic\,  Jugoslávských partyzánů 1580/
 3\, Praha 6\, Czech Republic\, Czech Republic\, 16000
ORGANIZER:sistekj@fel.cvut.cz
SEQUENCE:42
SUMMARY:17th INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS (ISPS) 2025
URL;VALUE=URI:https://events.vtools.ieee.org/m/502435
X-ALT-DESC:Description: <br /><p>The International Seminar on Power Semicon
 ductors (ISPS) provides a forum for technical discussion in the area of po
 wer semiconductor devices and their applications. It is a small conference
  with the special flair of an atmosphere of searching deeper insight and i
 ntensive discussion.</p><br /><br />Agenda: <br /><p><strong>27.8.2025</st
 rong></p>\n<p>1st session: SiC devices</p>\n<p>2nd session: Power Electron
 ics roadmap and GaN Device</p>\n<p>&nbsp\;</p>\n<p><strong>28.8.2023</stro
 ng></p>\n<p>Poster session</p>\n<p>3rd session Si Devices</p>\n<p>&nbsp\;<
 /p>\n<p><strong>29.8.2025</strong></p>\n<p>4th session Beyond Wide Bandgap
 </p>\n<p>5th session Packaging and Reliability</p>\n<p>6th session Applica
 tions Chairperson</p>\n<p>ISPS closing</p>\n<p>&nbsp\;</p>\n<p>More detail
 s are available here: <a href="https://technology.fel.cvut.cz/en/isps/">ht
 tps://technology.fel.cvut.cz/en/isps/</a></p>
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