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DTSTART:20250309T030000
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DTSTART:20251102T010000
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DTSTAMP:20251030T190509Z
UID:C164EA7D-5065-438D-BA2F-C3902F89DA08
DTSTART;TZID=America/New_York:20251016T180000
DTEND;TZID=America/New_York:20251016T190000
DESCRIPTION:Seminar\n\n- When: October 16th\, 2025\n- Where: LOW 3051\, RPI
  Campus\n\nSeminar Topic\n\n- Exploring Innovations in Semiconductor Advan
 ced Packaging\n\nAbout the Speaker\n\n- Current Role: Manager\, Chiplet an
 d Advanced Packaging at IBM T.J. Watson Research Center.\n- Katsuyuki Saku
 ma has earned top awards for his contributions to microelectronics and bio
 medical engineering.\n- Over 20 years of experience researching 3D chip in
 tegration technologies.\n\nSpeaker(s): Dr. Sakuma-san\n\nAgenda: \n6:00 PM
  – Seminar Begins\n\n7:00 PM – Seminar Finishes\n\n7:00 PM – Q&amp;A\n\n
 7:10 PM – Pizza Dinner and Discussion\n\n8:00 PM – Clean Up\n\nRoom: L
 OW 3051\, Bldg: Low Center for Industrial Innovation\, 1645 15th St\, Troy
 \, New York\, United States\, 12180
LOCATION:Room: LOW 3051\, Bldg: Low Center for Industrial Innovation\, 1645
  15th St\, Troy\, New York\, United States\, 12180
ORGANIZER:chene8@rpi.edu
SEQUENCE:61
SUMMARY:Exploring Innovation in Semiconductor Advanced Packaging
URL;VALUE=URI:https://events.vtools.ieee.org/m/505724
X-ALT-DESC:Description: &lt;br /&gt;&lt;h3&gt;&lt;strong&gt;Seminar&lt;/strong&gt;&lt;/h3&gt;\n&lt;ul&gt;\n&lt;li&gt;
 When: October 16th\, 2025&lt;/li&gt;\n&lt;li&gt;Where: LOW 3051\, RPI Campus&lt;/li&gt;\n&lt;/u
 l&gt;\n&lt;h3&gt;&lt;strong&gt;Seminar Topic&lt;/strong&gt;&lt;/h3&gt;\n&lt;ul&gt;\n&lt;li&gt;Exploring Innovatio
 ns in Semiconductor Advanced Packaging&lt;/li&gt;\n&lt;/ul&gt;\n&lt;h3&gt;&lt;strong&gt;About the 
 Speaker&lt;/strong&gt;&lt;/h3&gt;\n&lt;ul&gt;\n&lt;li&gt;Current Role: Manager\, Chiplet and Advan
 ced Packaging at IBM T.J. Watson Research Center.&lt;/li&gt;\n&lt;li&gt;Katsuyuki Saku
 ma has earned top awards for his contributions to microelectronics and bio
 medical engineering.&lt;/li&gt;\n&lt;li&gt;Over 20 years of experience researching 3D 
 chip integration technologies.&lt;/li&gt;\n&lt;/ul&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;6:0
 0 PM &amp;ndash\; Seminar Begins&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;7:00 PM &amp;ndash\; Seminar Finis
 hes&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;7:00 PM &amp;ndash\; Q&amp;amp\;A&lt;/p&gt;\n&lt;p&gt;7:10 PM &amp;ndash\; Pizz
 a Dinner and Discussion&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;8:00 PM &amp;ndash\; Clean Up&lt;/p&gt;
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