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TZID:Europe/Paris
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DTSTART:20260329T030000
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DTSTART:20251026T020000
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DTSTAMP:20251117T093139Z
UID:4D5906BE-6B8A-4D38-A7EB-F52D9C0BD362
DTSTART;TZID=Europe/Paris:20251113T100000
DTEND;TZID=Europe/Paris:20251113T120000
DESCRIPTION:Ultra-scaled active devices in both CMOS and BiCMOS technologie
 s have reached outstanding fT/fmax\, enabling an ever-increasing number of
  future emerging applications in the microwave/mm-wave frequency range\, f
 or the next-generation (5G/6G) wireless transceivers for communication\, s
 ensing and imaging applications.\n\nThis lecture addresses some fundamenta
 l and most severe design challenges for low-power mm-wave ICs\, and advanc
 ed design methodologies that can mitigate the performance degradation and 
 allow getting the largest potential out of the ultra-scaled technologies. 
 It reports the design of innovative building-blocks as key enabling soluti
 ons for compact low-power mm-wave array ICs for next-generation (5G/6G) wi
 reless transceivers.\n\nSpeaker(s): Dr. Zito\n\nRoom: 312\, Bldg: T\, 46 A
 venue Felix Viallet\, Grenoble\, Rhooe-Alpes\, France\, 38000\, Virtual: h
 ttps://events.vtools.ieee.org/m/506120
LOCATION:Room: 312\, Bldg: T\, 46 Avenue Felix Viallet\, Grenoble\, Rhooe-A
 lpes\, France\, 38000\, Virtual: https://events.vtools.ieee.org/m/506120
ORGANIZER:ieee-student-branch@univ-grenoble-alpes.fr
SEQUENCE:23
SUMMARY:Compact Low-Power mm-wave ICs for Next-Generation (5G/6G) Wireless 
 Transceivers
URL;VALUE=URI:https://events.vtools.ieee.org/m/506120
X-ALT-DESC:Description: <br /><p>Ultra-scaled active devices in both CMOS a
 nd BiCMOS technologies have reached outstanding fT/fmax\, enabling an ever
 -increasing number of future emerging applications in the microwave/mm-wav
 e frequency range\, for the next-generation (5G/6G) wireless transceivers 
 for communication\, sensing and imaging applications.</p>\n<p>This lecture
  addresses some fundamental and most severe design challenges for low-powe
 r mm-wave ICs\, and advanced design methodologies that can mitigate the pe
 rformance degradation and allow getting the largest potential out of the u
 ltra-scaled technologies. It reports the design of innovative building-blo
 cks as key enabling solutions for compact low-power mm-wave array ICs for 
 next-generation (5G/6G) wireless transceivers.</p>
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