BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0600 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:CDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0500 TZOFFSETTO:-0600 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:CST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251027T140312Z UID:81AF28E0-6EEB-42E0-B423-390D2B137ACB DTSTART;TZID=America/Chicago:20251024T110000 DTEND;TZID=America/Chicago:20251024T123000 DESCRIPTION:Speaker: Dr. Michael Roberg\, Engineering Fellow at Qorvo Inc.\ n\nBio: Michael Roberg received the Ph.D. degree from the University of Co lorado at Boulder in 2012. From 2003 to 2009\, he was an engineer at Lockh eed Martin-MS2 in Moorestown\, NJ working on advanced phased array radar s ystems. From 2012 to 2022 he worked for Qorvo in the High Performance Anal og business unit as a MMIC Design Engineering Fellow. In 2021\, he receive d the Outstanding Young Engineer award from MTT-S and in 2022 he won the i ndustry paper competition at IMS in Denver. From 2022-2024 he was an Engin eering Fellow at mmTron\, Inc. where he focused on MMIC development for mi llimeter wave systems. Michael re-joined Qorvo as a Fellow in the research organization in 2024 and continues to focus on advanced MMIC development. \n\nTitle: Power Without Pain: High Power MMIC PA Design\, The Pitfalls an d How to Avoid Them\n\nAbstract: This presentation discusses high power mo nolithic microwave integrated circuit (MMIC) power amplifier (PA) design i n Gallium Arsenide (GaAs) and Gallium Nitride (GaN). At a high level\, GaN versus GaAs semiconductor technology from the perspective of power amplif ier design metrics is analyzed to help determine the relative advantages a nd disadvantages of each technology. This is followed with an introduction of the most prevalent MMIC design topologies for the bulk of microwave ap plications which include reactively matched\, non-uniform distributed\, ba lanced\, push-pull\, Doherty and serially combined. Following introduction of the main topologies\, the presentation focuses on the potential pitfal ls the MMIC designer can encounter with detailed discussion on how to avoi d them with the goal of first past design success. The presentation relies on experience from the author’s career with over 20 years of experience in the defense and commercial industries as well as academia. MMIC design ers will appreciate the candid explanation of the design topologies and pi tfalls while non-designers will come away with a good working knowledge of what can be achieved and what to watch out for.\n\nSpeaker(s): Michael R oberg \, Michael Roberg \n\nRoom: C4\, Bldg: Lecture Center\, University of Illinois Chicago\, Chicago\, Illinois\, United States\, 60607 LOCATION:Room: C4\, Bldg: Lecture Center\, University of Illinois Chicago\, Chicago\, Illinois\, United States\, 60607 ORGANIZER:pychen@uic.edu SEQUENCE:31 SUMMARY:IEEE Distinguished Microwave Lecturers: Power Without Pain: High Po wer MMIC PA Design\, The Pitfalls and How to Avoid Them by Dr. Michael Rob erg at Qorvo Inc. URL;VALUE=URI:https://events.vtools.ieee.org/m/507424 X-ALT-DESC:Description: <br /><div>\n<div>\n<div dir="ltr">\n<div>\n<p><str ong>Speaker:&nbsp\;</strong>Dr.&nbsp\;<span class="il">Michael</span>&nbsp \;<span class="il">Roberg</span>\, Engineering Fellow at Qorvo Inc.</p>\n< p><strong>Bio:<u>&nbsp\;</u></strong><span class="il">Michael</span>&nbsp\ ;<span class="il">Roberg</span>&nbsp\;received the Ph.D. degree from the U niversity of Colorado at Boulder in 2012. From 2003 to 2009\, he was an en gineer at Lockheed Martin-MS2 in Moorestown\, NJ working on advanced phase d array radar systems. From 2012 to 2022 he worked for Qorvo in the High P erformance Analog business unit as a MMIC Design Engineering Fellow. In 20 21\, he received the Outstanding Young Engineer award from MTT-S and in 20 22 he won the industry paper competition at IMS in Denver. From 2022-2024 he was an Engineering Fellow at mmTron\, Inc. where he focused on MMIC dev elopment for millimeter wave systems.&nbsp\;&nbsp\;<span class="il">Michae l</span> re-joined Qorvo as a Fellow in the research organization in 2024 and continues to focus on advanced MMIC development.</p>\n<p><strong>Title :<u>&nbsp\;</u></strong>Power Without Pain:&nbsp\; High Power MMIC PA Desi gn\, The Pitfalls and How to Avoid Them</p>\n<p><strong>Abstract:&nbsp\;</ strong>This presentation discusses high power monolithic microwave integra ted circuit (MMIC) power amplifier (PA) design in Gallium Arsenide (GaAs) and Gallium Nitride (GaN).&nbsp\; At a high level\, GaN versus GaAs semico nductor technology from the perspective of power amplifier design metrics is analyzed to help determine the relative advantages and disadvantages of each technology.&nbsp\; This is followed with an introduction of the most prevalent MMIC design topologies for the bulk of microwave applications w hich include reactively matched\, non-uniform distributed\, balanced\, pus h-pull\, Doherty and serially combined.&nbsp\; Following introduction of t he main topologies\, the presentation focuses on the potential pitfalls th e MMIC designer can encounter with detailed discussion on how to avoid the m with the goal of first past design success.&nbsp\; The presentation reli es on experience from the author&rsquo\;s career with over 20 years of exp erience in the defense and commercial industries as well as academia.&nbsp \; MMIC designers will appreciate the candid explanation of the design top ologies and pitfalls while non-designers will come away with a good workin g knowledge of what can be achieved and what to watch out for.</p>\n</div> \n</div>\n</div>\n</div>\n<div class="yj6qo">&nbsp\;</div> END:VEVENT END:VCALENDAR