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DTSTART:20380119T111407
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DTSTAMP:20251018T012344Z
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DTSTART;TZID=Asia/Kuala_Lumpur:20251014T123000
DTEND;TZID=Asia/Kuala_Lumpur:20251014T173000
DESCRIPTION:IEEE EPS MALAYSIA in collaboration with NXP hosted 2 lecturers 
 and 19 students from Monash universities of Malaysia for an exclusive educ
 ational visit to its semiconductor packaging facility in Petaling Jaya.\n\
 nThe group was given a guided tour of several production lines\, including
  ball grid array\, leaded packages\, flip-chip\, and System-in-Package (Si
 P) technologies. Students had the opportunity to observe real-time manufac
 turing processes\, interact with NXP engineers\, and gain insights into th
 e complexities of modern semiconductor packaging.\n\nThis visit is part of
  IEEE EPS MALAYISIA ongoing commitment to fostering industry-academia coll
 aboration and inspiring the next generation of engineers. The engagement p
 rovided students with a valuable glimpse into the practical applications o
 f their studies and the future of electronics innovation.\n\nPetaling Jaya
 \, Selangor\, Malaysia
LOCATION:Petaling Jaya\, Selangor\, Malaysia
ORGANIZER:kaichat.tan@gmail.com
SEQUENCE:28
SUMMARY:Inside Industry: Student Factory Tour
URL;VALUE=URI:https://events.vtools.ieee.org/m/508148
X-ALT-DESC:Description: <br /><p>IEEE EPS MALAYSIA in collaboration with NX
 P hosted 2 lecturers and 19 students from Monash universities of Malaysia 
 for an exclusive educational visit to its semiconductor packaging facility
  in Petaling Jaya.</p>\n<p>The group was given a guided tour of several pr
 oduction lines\, including ball grid array\, leaded packages\, flip-chip\,
  and System-in-Package (SiP)&nbsp\;technologies. Students had the opportun
 ity to observe real-time manufacturing processes\, interact with NXP engin
 eers\, and gain insights into the complexities of modern semiconductor pac
 kaging.</p>\n<p>This visit is part of IEEE EPS MALAYISIA ongoing commitmen
 t to fostering industry-academia collaboration and inspiring the next gene
 ration of engineers. The engagement provided students with a valuable glim
 pse into the practical applications of their studies and the future of ele
 ctronics innovation.</p>
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