BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Kuala_Lumpur BEGIN:DAYLIGHT DTSTART:20380119T111407 TZOFFSETFROM:+0800 TZOFFSETTO:+0800 RRULE:FREQ=YEARLY;BYDAY=3TU;BYMONTH=1 TZNAME:+08 END:DAYLIGHT BEGIN:STANDARD DTSTART:19820101T000000 TZOFFSETFROM:+0730 TZOFFSETTO:+0800 RRULE:FREQ=YEARLY;BYDAY=1FR;BYMONTH=1 TZNAME:+08 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251018T015404Z UID:E2CC548F-3D2B-4456-8020-78FA54BF863F DTSTART;TZID=Asia/Kuala_Lumpur:20251015T080000 DTEND;TZID=Asia/Kuala_Lumpur:20251015T173000 DESCRIPTION:On October 15\, 2025\, the IEEE Electronics Packaging Society ( EPS) Malaysia Chapter hosted Advanced Packaging Workshop at G Hotel\, Pena ng\, drawing strong participation from both industry and academia.\n\nDr. Beth Keser\, delivered a comprehensive session on “Introduction to and A dvances in 2.3D Fan-Out Wafer & Panel Level Packaging”\, highlighting th e latest innovations and trends in high-density integration and market ben chmark.\n\nDr. Lee Teck Kheng\, who presented on “Reliability Management ”\, sharing best practices and methodologies for ensuring long-term perf ormance and robustness in advanced semiconductor packages.\n\nThe workshop attracted 87 participants\, including professionals from leading companie s such as Intel\, TF-AMD\, QDOS\, Indium\, and many others. The presence o f students from universities like USM\, UniMAP\, and other institutions ad ded a vibrant academic dimension to the event\, fostering meaningful inter action between future engineers and seasoned industry experts.\n\nPenang\, Pulau Pinang\, Malaysia LOCATION:Penang\, Pulau Pinang\, Malaysia ORGANIZER:kaichat.tan@gmail.com SEQUENCE:24 SUMMARY:Advanced Packaging Workshop 2025 Penang URL;VALUE=URI:https://events.vtools.ieee.org/m/508149 X-ALT-DESC:Description: <br /><p style="language: en-MY\; line-height: 16.8 pt\; mso-line-height-rule: exactly\; margin-top: 0pt\; margin-bottom: 0pt\ ; margin-left: 0in\; text-align: justify\; text-justify: inter-ideograph\; direction: ltr\; unicode-bidi: embed\; mso-line-break-override: none\; wo rd-break: normal\; punctuation-wrap: hanging\;"><span style="font-size: 12 .0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii-font-family: 'Calibri \ \(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Calibr i \\(MS\\)'\; mso-fareast-theme-font: minor-fareast\; color: black\; mso-f ont-kerning: 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; m so-style-textfill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0 %\;">On </span><span style="font-size: 12.0pt\; font-family: 'Calibri \\(M S\\)'\; mso-ascii-font-family: 'Calibri \\(MS\\)'\; mso-fareast-font-famil y: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-f ont: minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; language: e n-US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-color: bla ck\; mso-style-textfill-fill-alpha: 100.0%\;">October 15\, 2025\, the IEEE Electronics Packaging Society (EPS) Malaysia Chapter hosted </span><span style="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii-fon t-family: 'Calibri \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi- font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-font: minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-text fill-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfi ll-fill-alpha: 100.0%\;">Advanced </span><span style="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii-font-family: 'Calibri \\(MS\\) '\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS \\)'\; mso-fareast-theme-font: minor-fareast\; color: black\; mso-font-ker ning: 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-styl e-textfill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;">Pa ckaging Workshop at G Hotel\, Penang\, drawing strong participation from b oth industry and academia</span><span style="font-size: 12.0pt\; font-fami ly: 'Calibri \\(MS\\)'\; mso-ascii-font-family: 'Calibri \\(MS\\)'\; mso-f areast-font-family: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; ms o-fareast-theme-font: minor-fareast\; color: black\; mso-font-kerning: 12. 0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-textfil l-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;">.</span></p >\n<p style="language: en-MY\; line-height: 16.8pt\; mso-line-height-rule: exactly\; margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text- align: justify\; text-justify: inter-ideograph\; direction: ltr\; unicode- bidi: embed\; mso-line-break-override: none\; word-break: normal\; punctua tion-wrap: hanging\;"><span style="font-size: 12.0pt\; font-family: 'Calib ri \\(MS\\)'\; mso-ascii-font-family: 'Calibri \\(MS\\)'\; mso-fareast-fon t-family: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; mso-fareast- theme-font: minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; lang uage: en-US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-col or: black\; mso-style-textfill-fill-alpha: 100.0%\;">Dr. Beth Keser\, </sp an><span style="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso- ascii-font-family: 'Calibri \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-font: minor-f areast\; color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-s tyle-textfill-type: solid\; mso-style-textfill-fill-color: black\; mso-sty le-textfill-fill-alpha: 100.0%\;">delivered </span><span style="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii-font-family: 'Calibr i \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Cal ibri \\(MS\\)'\; mso-fareast-theme-font: minor-fareast\; color: black\; ms o-font-kerning: 12.0pt\; language: en-US\; mso-style-textfill-type: solid\ ; mso-style-textfill-fill-color: black\; mso-style-textfill-fill-alpha: 10 0.0%\;">a comprehensive session on &ldquo\;Introduction to and Advances in 2.3D Fan-Out Wafer &amp\; Panel Level Packaging&rdquo\;\, highlighting th e latest innovations and trends in high-density integration and </span><sp an style="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii- font-family: 'Calibri \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bi di-font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-font: minor-fareast \; color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-t extfill-type: solid\; mso-style-textfill-fill-color: black\; mso-style-tex tfill-fill-alpha: 100.0%\;">market benchmark.</span></p>\n<p style="langua ge: en-MY\; line-height: 16.8pt\; mso-line-height-rule: exactly\; margin-t op: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-align: justify\; te xt-justify: inter-ideograph\; direction: ltr\; unicode-bidi: embed\; mso-l ine-break-override: none\; word-break: normal\; punctuation-wrap: hanging\ ;"><span style="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso- ascii-font-family: 'Calibri \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-font: minor-f areast\; color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-s tyle-textfill-type: solid\; mso-style-textfill-fill-color: black\; mso-sty le-textfill-fill-alpha: 100.0%\;">Dr. Lee Teck Kheng\, who presented on &l dquo\;Reliability Management&rdquo\;\, sharing best practices and methodol ogies for ensuring long-term performance and robustness in advanced semico nductor packages.</span></p>\n<p style="language: en-MY\; line-height: 16. 8pt\; mso-line-height-rule: exactly\; margin-top: 0pt\; margin-bottom: 0pt \; margin-left: 0in\; text-align: justify\; text-justify: inter-ideograph\ ; direction: ltr\; unicode-bidi: embed\; mso-line-break-override: none\; w ord-break: normal\; punctuation-wrap: hanging\;"><span style="font-size: 1 2.0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii-font-family: 'Calibri \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Calib ri \\(MS\\)'\; mso-fareast-theme-font: minor-fareast\; color: black\; mso- font-kerning: 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfill-fill-alpha: 100. 0%\;">The workshop attracted 87 participants\, including professionals fro m leading companies such as Intel\, TF-AMD\, QDOS\, Indium\, and many othe rs. The presence of students from universities like USM\, </span><span sty le="font-size: 12.0pt\; font-family: 'Calibri \\(MS\\)'\; mso-ascii-font-f amily: 'Calibri \\(MS\\)'\; mso-fareast-font-family: +mn-ea\; mso-bidi-fon t-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-font: minor-fareast\; col or: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-textfil l-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfill- fill-alpha: 100.0%\;">UniMAP</span><span style="font-size: 12.0pt\; font-f amily: 'Calibri \\(MS\\)'\; mso-ascii-font-family: 'Calibri \\(MS\\)'\; ms o-fareast-font-family: +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-font: minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-text fill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;">\, and o ther institutions added a vibrant academic dimension to the event\, foster ing meaningful interaction between future engineers and seasoned industry experts</span><span style="font-size: 12.0pt\; font-family: 'Calibri \\(MS \\)'\; mso-ascii-font-family: 'Calibri \\(MS\\)'\; mso-fareast-font-family : +mn-ea\; mso-bidi-font-family: 'Calibri \\(MS\\)'\; mso-fareast-theme-fo nt: minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; language: en -US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-color: blac k\; mso-style-textfill-fill-alpha: 100.0%\;">.</span></p>\n<p style="langu age: en-MY\; line-height: 16.8pt\; mso-line-height-rule: exactly\; margin- top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-align: justify\; t ext-justify: inter-ideograph\; direction: ltr\; unicode-bidi: embed\; mso- line-break-override: none\; word-break: normal\; punctuation-wrap: hanging \;">&nbsp\;</p> END:VEVENT END:VCALENDAR