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PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
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TZID:Asia/Kuala_Lumpur
BEGIN:DAYLIGHT
DTSTART:20380119T111407
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DTSTART:19820101T000000
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BEGIN:VEVENT
DTSTAMP:20260114T052353Z
UID:F448E6A9-BE87-4ACB-87F2-D2092D20F243
DTSTART;TZID=Asia/Kuala_Lumpur:20251015T133000
DTEND;TZID=Asia/Kuala_Lumpur:20251015T140000
DESCRIPTION:IEEE EPS Malaysia organized two insightful panel sessions title
 d “How AI Can Help in Packaging”\, held in Penang\, moderated by KC Ta
 n\, discussions focused on AI applications in process control\, defect det
 ection\, and material optimization.\n\nPanelists includes Prof. Cheong Kua
 n Yew (Materials Scientist)\,Dr. Beth Keser (Advanced Packaging)\, Dr. Lee
  Teck Kheng (Interconnect Specialist)\,\,Mr. Hee Wei Ken (Dispensing Exper
 t)\n\nTopics covered included model training challenges\, failure predicti
 on\, and the view that AI is a tool—not a solution for every problem\, w
 ith reflections on its impact on engineering roles.\n\nThe sessions drew s
 trong participation from industry and academia\, reinforcing IEEE EPS Mala
 ysia’s role in driving dialogue on smart packaging technologies.\n\nPena
 ng\, Pulau Pinang\, Malaysia
LOCATION:Penang\, Pulau Pinang\, Malaysia
ORGANIZER:kaichat.tan@gmail.com
SEQUENCE:4
SUMMARY:Panel Session：How AI can help in Packaging - Penang
URL;VALUE=URI:https://events.vtools.ieee.org/m/508151
X-ALT-DESC:Description: &lt;br /&gt;&lt;p style=&quot;language: en-MY\; margin-top: 0pt\;
  margin-bottom: 0pt\; margin-left: 0in\; text-align: justify\; text-justif
 y: inter-ideograph\; direction: ltr\; unicode-bidi: embed\; mso-line-break
 -override: none\; word-break: normal\; punctuation-wrap: hanging\;&quot;&gt;&lt;span 
 style=&quot;font-size: 12.0pt\; font-family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-fon
 t-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-family: +mn-ea\; mso-bidi-
 font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-theme-font: minor-fareast\; 
 color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-text
 fill-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfi
 ll-fill-alpha: 100.0%\;&quot;&gt;IEEE EPS Malaysia organized two insightful panel 
 sessions titled &amp;ldquo\;How AI Can Help in Packaging&amp;rdquo\;\, held in Pen
 ang\, moderated by KC Tan\, d&lt;/span&gt;&lt;span style=&quot;font-size: 12.0pt\; font-
 family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;\; m
 so-fareast-font-family: +mn-ea\; mso-bidi-font-family: &#39;Calibri \\(MS\\)&#39;\
 ; mso-fareast-theme-font: minor-fareast\; color: black\; mso-font-kerning:
  12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-tex
 tfill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;&quot;&gt;iscussi
 ons &lt;/span&gt;&lt;span style=&quot;font-size: 12.0pt\; font-family: &#39;Calibri \\(MS\\)
 &#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-family: +
 mn-ea\; mso-bidi-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-theme-font:
  minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; language: en-US
 \; mso-style-textfill-type: solid\; mso-style-textfill-fill-color: black\;
  mso-style-textfill-fill-alpha: 100.0%\;&quot;&gt;focused on AI applications in pr
 ocess control\, defect detection\, and material optimization.&lt;/span&gt;&lt;/p&gt;\n
 &lt;p style=&quot;language: en-MY\; margin-top: 0pt\; margin-bottom: 0pt\; margin-
 left: 0in\; text-align: justify\; text-justify: inter-ideograph\; directio
 n: ltr\; unicode-bidi: embed\; mso-line-break-override: none\; word-break:
  normal\; punctuation-wrap: hanging\;&quot;&gt;&lt;span style=&quot;font-size: 12.0pt\; fo
 nt-family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;\
 ; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: &#39;Calibri \\(MS\\
 )&#39;\; mso-fareast-theme-font: minor-fareast\; color: black\; mso-font-kerni
 ng: 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-
 textfill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;&quot;&gt;Pane
 lists includes Prof. Cheong Kuan Yew (Materials Scientist)\,&lt;/span&gt;&lt;span s
 tyle=&quot;font-size: 12.0pt\; font-family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font
 -family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-family: +mn-ea\; mso-bidi-f
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 ill-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfil
 l-fill-alpha: 100.0%\;&quot;&gt;Dr. Beth Keser (Advanced Packaging)&lt;/span&gt;&lt;span st
 yle=&quot;font-size: 12.0pt\; font-family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font-
 family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-family: +mn-ea\; mso-bidi-fo
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 ll-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfill
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 amily: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;\; ms
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  mso-fareast-theme-font: minor-fareast\; color: black\; mso-font-kerning: 
 12.0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-text
 fill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;&quot;&gt;. Lee Te
 ck Kheng (Interconnect Specialist&lt;/span&gt;&lt;span style=&quot;font-size: 12.0pt\; f
 ont-family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;
 \; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: &#39;Calibri \\(MS\
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 tyle-textfill-fill-alpha: 100.0%\;&quot;&gt;\,\,&lt;/span&gt;&lt;span style=&quot;font-size: 12.
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  +mn-ea\; mso-bidi-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-theme-fon
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 d\; mso-style-textfill-fill-color: black\; mso-style-textfill-fill-alpha: 
 100.0%\;&quot;&gt;Hee&lt;/span&gt;&lt;span style=&quot;font-size: 12.0pt\; font-family: &#39;Calibri
  \\(MS\\)&#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-
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 ge: en-US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-color
 : black\; mso-style-textfill-fill-alpha: 100.0%\;&quot;&gt; Wei Ken (Dispensing Ex
 pert)&lt;br&gt;&lt;br&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p style=&quot;language: en-MY\; margin-top: 0pt\; ma
 rgin-bottom: 0pt\; margin-left: 0in\; text-align: justify\; text-justify: 
 inter-ideograph\; direction: ltr\; unicode-bidi: embed\; mso-line-break-ov
 erride: none\; word-break: normal\; punctuation-wrap: hanging\;&quot;&gt;&lt;span sty
 le=&quot;font-size: 12.0pt\; font-family: &#39;Calibri \\(MS\\)&#39;\; mso-ascii-font-f
 amily: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-family: +mn-ea\; mso-bidi-fon
 t-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-theme-font: minor-fareast\; col
 or: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-textfil
 l-type: solid\; mso-style-textfill-fill-color: black\; mso-style-textfill-
 fill-alpha: 100.0%\;&quot;&gt;Topics covered included model training challenges\, 
 failure prediction\, and the view that AI is a tool&amp;mdash\;not a solution 
 for every problem\, with reflections on its impact on engineering roles&lt;/s
 pan&gt;&lt;span style=&quot;font-size: 12.0pt\; font-family: &#39;Calibri \\(MS\\)&#39;\; mso
 -ascii-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-font-family: +mn-ea\;
  mso-bidi-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-theme-font: minor-
 fareast\; color: black\; mso-font-kerning: 12.0pt\; language: en-US\; mso-
 style-textfill-type: solid\; mso-style-textfill-fill-color: black\; mso-st
 yle-textfill-fill-alpha: 100.0%\;&quot;&gt;.&lt;br&gt;&lt;br&gt;&lt;/span&gt;&lt;/p&gt;\n&lt;p style=&quot;languag
 e: en-MY\; margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-
 align: justify\; text-justify: inter-ideograph\; direction: ltr\; unicode-
 bidi: embed\; mso-line-break-override: none\; word-break: normal\; punctua
 tion-wrap: hanging\;&quot;&gt;&lt;span style=&quot;font-size: 12.0pt\; font-family: &#39;Calib
 ri \\(MS\\)&#39;\; mso-ascii-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-fon
 t-family: +mn-ea\; mso-bidi-font-family: &#39;Calibri \\(MS\\)&#39;\; mso-fareast-
 theme-font: minor-fareast\; color: black\; mso-font-kerning: 12.0pt\; lang
 uage: en-US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-col
 or: black\; mso-style-textfill-fill-alpha: 100.0%\;&quot;&gt;The sessions drew str
 ong participation from industry and academia\, reinforcing IEEE EPS Malays
 ia&amp;rsquo\;s role in driving dialogue on smart packaging technologies.&lt;/spa
 n&gt;&lt;/p&gt;
END:VEVENT
END:VCALENDAR

