BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20250309T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251024T153103Z UID:E5EAF28A-1C70-402A-BF7D-17F7F3B2CB28 DTSTART;TZID=America/New_York:20251023T130000 DTEND;TZID=America/New_York:20251023T140000 DESCRIPTION:Abstract\n\nThe Nanoscale Design and Manufacturing Laboratory ( NDML) at the University of Texas at Austin focuses on the design and devel opment of novel processes and equipment for the manufacturing of micro and nanoscale devices and structures. This talk will focus on two new microsc ale additive manufacturing processes\, known as Holographic Metasurface Na no Lithography (HMNL) and Microscale Selective Laser Sintering (μ-SLS)\, that has been developed in the NDML for the fabrication of 3D electronic i nterconnect structures. In the HMNL process\, sub-wavelength patterned met asurface masks (metamasks) are used to create multi-colored holograms in a photocurable metal-polymer hybrid resin. This process allows entire 3D\, multi-material (insulators and conductors) nanostructures to be patterned using a single light exposure. Preliminary volumetric patterning using thi s method shows a build rate of over 20 mm 3 /s in both metals and polymers with sub-micron resolution making it ideal for fabricating redistribution layers for chip packaging applications. In the μ-SLS process\, a thin la yer of nanoparticle ink is first spread onto the substrate. The substrate is then positioned under an optical subsystem using a custom-built nanopos itioning device. A laser that has been focused off a micromirror array is then used to sinter the nanoparticles together in a desired pattern with m icrometer resolution. Another layer is then coated onto the substrate and the process is repeated to build up the 3D structure. Finally\, the unsint ered nanoparticles are washed away to reveal the final 3D part which is we ll suited for making microelectronic bump structures. This talk will prese nt the materials science\, mechatronic systems\, optics designs\, and proc ess modeling used in both processes to make these additive manufacturing p rocess capable of achieving micrometer resolution with high throughput ove r large areas (~ 50 mm x 50 mm) and thus break the conventional tradeoff b etween resolution and throughput in microscale metal 3D printing.\n\nCo-sp onsored by: IEEE EDS (Electron Devices Society) https://eds.ieee.org/educa tion/webinars/register\n\nSpeaker(s): Michael Cullinan\, \n\nAgenda: \n\n\ nVirtual: https://events.vtools.ieee.org/m/508514 LOCATION:Virtual: https://events.vtools.ieee.org/m/508514 ORGANIZER:bettermann@ieee.org SEQUENCE:44 SUMMARY:Micro and Nanoscale Additive Manufacturing for Electronics Packagin g Applications URL;VALUE=URI:https://events.vtools.ieee.org/m/508514 X-ALT-DESC:Description: <br /><p>&nbsp\;</p>\n<h2 class="fusion-responsive- typography-calculated" data-fontsize="28" data-lineheight="39.2px"><strong >Abstract</strong></h2>\n<p>The Nanoscale Design and Manufacturing Laborat ory (NDML) at the University of Texas at Austin focuses on the design and development of novel processes and equipment for the manufacturing of micr o and nanoscale devices and structures. This talk will focus on two new mi croscale additive manufacturing processes\, known as Holographic Metasurfa ce Nano Lithography (HMNL) and Microscale Selective Laser Sintering (&mu\; -SLS)\, that has been developed in the NDML for the fabrication of 3D elec tronic interconnect structures. In the HMNL process\, sub-wavelength patte rned metasurface masks (metamasks) are used to create multi-colored hologr ams in a photocurable metal-polymer hybrid resin. This process allows enti re 3D\, multi-material (insulators and conductors) nanostructures to be pa tterned using a single light exposure. Preliminary volumetric patterning u sing this method shows a build rate of over 20 mm 3 /s in both metals and polymers with sub-micron resolution making it ideal for fabricating redist ribution layers for chip packaging applications. In the &mu\;-SLS process\ , a thin layer of nanoparticle ink is first spread onto the substrate. The substrate is then positioned under an optical subsystem using a custom-bu ilt nanopositioning device. A laser that has been focused off a micromirro r array is then used to sinter the nanoparticles together in a desired pat tern with micrometer resolution. Another layer is then coated onto the sub strate and the process is repeated to build up the 3D structure. Finally\, the unsintered nanoparticles are washed away to reveal the final 3D part which is well suited for making microelectronic bump structures. This talk will present the materials science\, mechatronic systems\, optics designs \, and process modeling used in both processes to make these additive manu facturing process capable of achieving micrometer resolution with high thr oughput over large areas (~ 50 mm x 50 mm) and thus break the conventional tradeoff between resolution and throughput in microscale metal 3D printin g.&nbsp\;</p><br /><br />Agenda: <br /><section>\n<p>&nbsp\;</p>\n<p>&nbsp \;</p>\n</section>\n<div>\n<div class="gmail_default">\n<div>\n<div class= "gmail_default">\n<div>\n<div class="gmail_default">\n<div>\n<div>\n<p>&nb sp\;</p>\n</div>\n</div>\n</div>\n</div>\n</div>\n</div>\n</div>\n</div>\n <p class="MsoNormal">&nbsp\;</p> END:VEVENT END:VCALENDAR