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DTSTART:20260329T030000
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DTSTAMP:20251123T162207Z
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DTSTART;TZID=Europe/Berlin:20251120T170000
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DESCRIPTION:Electronic components are getting increasingly integrated into 
 mission-critical applications and are exposed to harsh environmental condi
 tions (e.g.\, elevated temperatures). New methods of reliability estimatio
 n focus on product-specific condition monitoring and component health asse
 ssment. Prognostics and Health Management (PHM) using the Digital Twin-bas
 ed framework is a promising way to achieve this. This webinar delves into 
 several aspects of a Digital Twin and showcases a systematic procedure to 
 prepare a continuously updated Digital Twin ‘Instance’ with a six-para
 meter material model reflecting thermo-oxidative ageing of Epoxy Moulding 
 Compounds (EMC) and its effects on the thermomechanical behaviour of an el
 ectronic package.\n\nSpeaker(s): Adwait\, \n\nAgenda: \n05:00 PM Introduct
 ion - A. Prisacaru\n\n05:05 PM Digital Twin Technology for Microelectronic
 s Reliability - Dr. Adwait Inamdar\n\n05:45 Q&A\n\nVirtual: https://events
 .vtools.ieee.org/m/509932
LOCATION:Virtual: https://events.vtools.ieee.org/m/509932
ORGANIZER:alexandru.prisacaru@ieee.org
SEQUENCE:25
SUMMARY:Digital Twin Technology for Microelectronics Reliability
URL;VALUE=URI:https://events.vtools.ieee.org/m/509932
X-ALT-DESC:Description: <br /><p><span style="font-size: 10.0pt\; font-fami
 ly: 'Arial'\,sans-serif\; mso-fareast-font-family: Calibri\; mso-fareast-t
 heme-font: minor-latin\; mso-font-kerning: 0pt\; mso-ligatures: none\; mso
 -ansi-language: EN-US\; mso-fareast-language: EN-US\; mso-bidi-language: A
 R-SA\;">Electronic components are getting increasingly integrated into mis
 sion-critical applications and are exposed to harsh environmental conditio
 ns (e.g.\, elevated temperatures). New methods of reliability estimation f
 ocus on product-specific condition monitoring and component health assessm
 ent. Prognostics and Health Management (PHM) using the Digital Twin-based 
 framework is a promising way to achieve this. This webinar delves into sev
 eral aspects of a Digital Twin and showcases a systematic procedure to pre
 pare a continuously updated Digital Twin &lsquo\;Instance&rsquo\; with a s
 ix-parameter material model reflecting thermo-oxidative ageing of Epoxy Mo
 ulding Compounds (EMC) and its effects on the thermomechanical behaviour o
 f an electronic package.</span></p><br /><br />Agenda: <br /><p>05:00 PM I
 ntroduction - A. Prisacaru</p>\n<p>05:05 PM <span style="font-size: 10.0pt
 \; font-family: 'Arial'\,sans-serif\; mso-fareast-font-family: Calibri\; m
 so-fareast-theme-font: minor-latin\; mso-font-kerning: 0pt\; mso-ligatures
 : none\; mso-ansi-language: EN-US\; mso-fareast-language: EN-US\; mso-bidi
 -language: AR-SA\;">Digital Twin Technology for Microelectronics Reliabili
 ty - Dr. Adwait Inamdar</span></p>\n<p><span style="font-size: 10.0pt\; fo
 nt-family: 'Arial'\,sans-serif\; mso-fareast-font-family: Calibri\; mso-fa
 reast-theme-font: minor-latin\; mso-font-kerning: 0pt\; mso-ligatures: non
 e\; mso-ansi-language: EN-US\; mso-fareast-language: EN-US\; mso-bidi-lang
 uage: AR-SA\;">05:45 Q&amp\;A</span></p>
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