BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Shanghai BEGIN:STANDARD DTSTART:19910915T010000 TZOFFSETFROM:+0900 TZOFFSETTO:+0800 TZNAME:CST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251030T094716Z UID:684A79E8-1F96-432A-93E7-001B0849B59C DTSTART;TZID=Asia/Shanghai:20251021T174100 DTEND;TZID=Asia/Shanghai:20251024T174100 DESCRIPTION:The 16th International Conference on ASIC (ASICON 2025) was suc cessfully held from October 21 to 24\, 2025\, in Kunming\, China. The conf erence was jointly organized and hosted by the IEEE Beijing Section\, the School of Microelectronics at Fudan University\, Yunnan University\, and t he National Integrated Circuit Innovation Center. This event provided a si gnificant platform for academic and industrial exchanges in the field of m icroelectronics. The opening ceremony was chaired by Professor Min Hao\, t he conference co-chair from Fudan University. Dr. Bin Zhao\, Chair of IEEE EDS\, delivered the opening address\, while Professor Yue Kun from Yunnan University and IEEE/EDS Fellow Professor Cor Claeys extended congratulati ons\, acknowledging the 30th anniversary of ASICON and its achievements. P rofessor Ye Fan\, the TPC co-chair\, presented a report on the conference preparation and technical program. Distinguished international experts att ended the ceremony\, including representatives from Belgium\, the United S tates\, South Korea\, and other countries.\n\n[] During the conference\ , eight keynote speeches were delivered by experts from Belgium\, the Unit ed States\, South Korea\, France\, and other regions\, focusing on the cur rent status\, future challenges\, and applications of integrated circuits in AI\, communications\, healthcare\, and more. These sessions stimulated lively discussions and fostered a strong academic atmosphere.\n\n[] In addition to the keynote reports\, the conference featured 30 technical ses sions with a total of 175 presentations\, including 57 invited talks by re nowned scholars. To commemorate the 100th anniversary of the FET transisto r\, a special FET 100th Forum was held with IEEE support. The event also i ncluded 76 poster presentations\, and companies such as ChangXin Memory Te chnologies and Common Mode Semiconductor showcased advanced manufacturing and design technologies.\n\n[] At the closing banquet on October 24\, t he conference awarded 10 best student papers and one outstanding young sch olar paper\, recognizing excellent contributions from domestic and interna tional universities. The conference effectively built a high-quality excha nge platform\, particularly benefiting young scientists and students\, and strengthened global collaboration in microelectronics\, contributing posi tively to the discipline's development and technological progress.\n\nKunm ing\, Yunnan\, China LOCATION:Kunming\, Yunnan\, China ORGANIZER:chenyun@fudan.edu.cn SEQUENCE:7 SUMMARY:The 16th International Conference on ASIC (ASICON 2025) URL;VALUE=URI:https://events.vtools.ieee.org/m/511144 X-ALT-DESC:Description: <br /><section class="ybc-p">The 16th International Conference on ASIC (ASICON 2025) was successfully held from October 21 to 24\, 2025\, in Kunming\, China. The conference was jointly organized and hosted by the IEEE Beijing Section\, the School of Microelectronics at Fud an University\, Yunnan University\, and the National Integrated Circuit In novation Center. This event provided a significant platform for academic a nd industrial exchanges in the field of microelectronics.</section>\n<sect ion class="ybc-p">The opening ceremony was chaired by Professor Min Hao\, the conference co-chair from Fudan University. Dr. Bin Zhao\, Chair of IEE E EDS\, delivered the opening address\, while Professor Yue Kun from Yunna n University and IEEE/EDS Fellow Professor Cor Claeys extended congratulat ions\, acknowledging the 30th anniversary of ASICON and its achievements. Professor Ye Fan\, the TPC co-chair\, presented a report on the conference preparation and technical program. Distinguished international experts at tended the ceremony\, including representatives from Belgium\, the United States\, South Korea\, and other countries.</section>\n<section class="ybc -p">\n<div class="hyc-common-markdown__replace">\n<div class="hyc-common-m arkdown__replace__item">\n<div class="hyc-content-img hyc-content-img--mul ti hyc-content-img--round" data-index="1"><img draggable="false" src="http s://hunyuan-plugin-private-1258344706.cos.ap-nanjing.myqcloud.com/pdf_yout u/img/1761816870_7357e7eed5204005a187b0fa0b1e67a4.jpeg?q-sign-algorithm=sh a1&amp\;q-ak=AKID372nLgqocp7HZjfQzNcyGOMTN3Xp6FEA&amp\;q-sign-time=1761817 207%3B2077177207&amp\;q-key-time=1761817207%3B2077177207&amp\;q-header-lis t=host&amp\;q-url-param-list=&amp\;q-signature=5c4cf9f7029099cbe54ee384e39 6b5d58a1c2ba3" alt="" crossorigin="anonymous"></div>\n</div>\n</div>\n</se ction>\n<section class="ybc-p">During the conference\, eight keynote speec hes were delivered by experts from Belgium\, the United States\, South Kor ea\, France\, and other regions\, focusing on the current status\, future challenges\, and applications of integrated circuits in AI\, communication s\, healthcare\, and more. These sessions stimulated lively discussions an d fostered a strong academic atmosphere.</section>\n<section class="ybc-p" >\n<div class="hyc-common-markdown__replace">\n<div class="hyc-common-mark down__replace__item">\n<div class="hyc-content-img hyc-content-img--multi hyc-content-img--round" data-index="1"><img draggable="false" src="https:/ /hunyuan-plugin-private-1258344706.cos.ap-nanjing.myqcloud.com/pdf_youtu/i mg/1761816870_5a16ac7571554179bf1ec0b06a1cfb88.jpeg?q-sign-algorithm=sha1& amp\;q-ak=AKID372nLgqocp7HZjfQzNcyGOMTN3Xp6FEA&amp\;q-sign-time=1761817208 %3B2077177208&amp\;q-key-time=1761817208%3B2077177208&amp\;q-header-list=h ost&amp\;q-url-param-list=&amp\;q-signature=2ca43a1e1038cc21eead42fee97d68 3b0967b06f" alt="" crossorigin="anonymous"></div>\n</div>\n</div>\n</secti on>\n<section class="ybc-p">In addition to the keynote reports\, the confe rence featured 30 technical sessions with a total of 175 presentations\, i ncluding 57 invited talks by renowned scholars. To commemorate the 100th a nniversary of the FET transistor\, a special FET 100th Forum was held with IEEE support. The event also included 76 poster presentations\, and compa nies such as ChangXin Memory Technologies and Common Mode Semiconductor sh owcased advanced manufacturing and design technologies.</section>\n<sectio n class="ybc-p">\n<div class="hyc-common-markdown__replace">\n<div class=" hyc-common-markdown__replace__item">\n<div class="hyc-content-img hyc-cont ent-img--multi hyc-content-img--round" data-index="1"><img draggable="fals e" src="https://hunyuan-plugin-private-1258344706.cos.ap-nanjing.myqcloud. com/pdf_youtu/img/1761816870_04e3058495994a32b639269c46c8521d.jpeg?q-sign- algorithm=sha1&amp\;q-ak=AKID372nLgqocp7HZjfQzNcyGOMTN3Xp6FEA&amp\;q-sign- time=1761817210%3B2077177210&amp\;q-key-time=1761817210%3B2077177210&amp\; q-header-list=host&amp\;q-url-param-list=&amp\;q-signature=e9a6da93290891c 55246c07a2c81633c845ab3fa" alt="" crossorigin="anonymous"></div>\n</div>\n </div>\n</section>\n<section class="ybc-p">At the closing banquet on Octob er 24\, the conference awarded 10 best student papers and one outstanding young scholar paper\, recognizing excellent contributions from domestic an d international universities. The conference effectively built a high-qual ity exchange platform\, particularly benefiting young scientists and stude nts\, and strengthened global collaboration in microelectronics\, contribu ting positively to the discipline's development and technological progress .</section> END:VEVENT END:VCALENDAR