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DTSTAMP:20251228T184734Z
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DTSTART;TZID=America/Los_Angeles:20251126T100000
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DESCRIPTION:Technical Seminar by IEEE Solid-State Circuits Society Distingu
 ished Lecturer\, Dr. Tony Chan Carusone\, with the following abstract:\n\n
 In the rapidly evolving landscape of artificial intelligence\, chiplets ar
 e emerging as a transformative technology\, paving the way for the next ge
 neration of AI systems. Chiplets permit the integration of more processing
  power within a single package\, and allow for new connectivity solutions 
 so that thousands of AI accelerators can work as a cohesive unit. Optical 
 connectivity\, facilitated by chiplets\, offers high-speed data transmissi
 on with lower power consumption\, crucial for handling the massive data lo
 ads in AI applications. The emerging chiplet ecosystem\, underwritten by h
 igh-performance die-to-die interfaces\, is throwing open the doors of inno
 vation and facilitating the next wave of AI scaling.\n\nSpeaker(s): Tony C
 han Carusone\, \n\nRoom: 3038\, Bldg: Macleod Building\, 2356 Main Mall\, 
 Vancouver\, British Columbia\, Canada\, V6T 1Z4
LOCATION:Room: 3038\, Bldg: Macleod Building\, 2356 Main Mall\, Vancouver\,
  British Columbia\, Canada\, V6T 1Z4
ORGANIZER:shahriar@ece.ubc.ca
SEQUENCE:36
SUMMARY:Scaling AI with Chiplet-Based Systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/512516
X-ALT-DESC:Description: <br /><p>Technical Seminar by IEEE Solid-State Circ
 uits Society Distinguished Lecturer\, Dr. Tony Chan Carusone\, with the fo
 llowing abstract:</p>\n<p>In the rapidly evolving landscape of artificial 
 intelligence\, chiplets are emerging as a transformative technology\, pavi
 ng the way for the next generation of AI systems. Chiplets permit the inte
 gration of more processing power within a single package\, and allow for n
 ew connectivity solutions so that thousands of AI accelerators can work as
  a cohesive unit. Optical connectivity\, facilitated by chiplets\, offers 
 high-speed data transmission with lower power consumption\, crucial for ha
 ndling the massive data loads in AI applications. The emerging chiplet eco
 system\, underwritten by high-performance die-to-die interfaces\, is throw
 ing open the doors of innovation and facilitating the next wave of AI scal
 ing.</p>
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