BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Kuwait BEGIN:DAYLIGHT DTSTART:20380119T061407 TZOFFSETFROM:+0300 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=3TU;BYMONTH=1 TZNAME:+03 END:DAYLIGHT BEGIN:STANDARD DTSTART:19470313T235308 TZOFFSETFROM:+0306 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=2TH;BYMONTH=3 TZNAME:+03 END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251109T094740Z UID:398C65C6-6DE8-46DF-9D6C-E9606DCF5C92 DTSTART;TZID=Asia/Kuwait:20250819T170000 DTEND;TZID=Asia/Kuwait:20251119T190000 DESCRIPTION:This webinar\, conducted in partnership with IEEE YP AGs from G ermany\, France\, Benelux\, Jordan\, Tunisia\, and South Africa\, focused on broadband dielectric characterization and the design optimization of si licate materials for advanced electronic packaging. Participants were intr oduced to measurement techniques\, material selection strategies\, and opt imization approaches to enhance performance in high-frequency applications . The session emphasized practical solutions for engineers working on next -generation packaging technologies and material innovation.\n\nVirtual: ht tps://events.vtools.ieee.org/m/513349 LOCATION:Virtual: https://events.vtools.ieee.org/m/513349 ORGANIZER:mustafa_aqrabawe@ieee.org SEQUENCE:3 SUMMARY:Broadband Dielectric Characterization and Design Optimization of Si licate Materials for Advanced Packaging Applications URL;VALUE=URI:https://events.vtools.ieee.org/m/513349 X-ALT-DESC:Description: <br /><p>This webinar\, conducted in partnership wi th IEEE YP AGs from <strong data-start="1641" data-end="1704">Germany\, Fr ance\, Benelux\, Jordan\, Tunisia\, and South Africa</strong>\, focused on broadband dielectric characterization and the design optimization of sili cate materials for advanced electronic packaging. Participants were introd uced to measurement techniques\, material selection strategies\, and optim ization approaches to enhance performance in high-frequency applications. The session emphasized practical solutions for engineers working on next-g eneration packaging technologies and material innovation.</p> END:VEVENT END:VCALENDAR