BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Chicago BEGIN:DAYLIGHT DTSTART:20260308T030000 TZOFFSETFROM:-0600 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:CDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0500 TZOFFSETTO:-0600 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:CST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20251114T145512Z UID:07356C76-F3D5-4731-8957-F7D72EC2B604 DTSTART;TZID=America/Chicago:20251113T133000 DTEND;TZID=America/Chicago:20251113T143000 DESCRIPTION:Sn-based solder joints have quietly moved along with the progre ss of electronic packaging\, reliably bridging generations of systems from the eutectic Sn-Pb era to the now-dominant SAC305 alloy. These interconne cts have delivered sufficient mechanical\, thermal\, and electrical perfor mance while enabling system integration and manufacturability across multi ple technology nodes. But with the rise of artificial intelligence (AI) sy stems and high-performance computing (HPC) platforms the limits of what so lder joints must endure are facing challenges. Increase in current carryin g capability for higher power density\, enhanced thermal cycling performan ce for large size components\, manufacturing challenges\, and system-level stress mitigation are stretching SAC305 interconnects\, which served 30 y ears in industry\, now to the edge of their capabilities. This seminar wil l examine the solder joint microstructure base evolution and the stability mechanism\, the reasons for its decades-long availability and also visiti ng the potential limitations that are now emerging under AI systems and hi gh-performance computing (HPC). We will explore degradation mechanisms in conventional solder alloys\, contrast them with low-melting and alternativ e solder material systems\, and assess how evolving reliability requiremen ts reshape interconnect strategies. The discussion will consider whether c onventional solder material can continue to serve as the backbone of packa ging\, or whether new roles or entirely reimagined interconnect solutions will be required to sustain the next era of AI and high-performance electr onics.\n\nSpeaker(s): \, Tae\n\nVirtual: https://events.vtools.ieee.org/m/ 514142 LOCATION:Virtual: https://events.vtools.ieee.org/m/514142 ORGANIZER:hasnine@ieee.org SEQUENCE:11 SUMMARY:From convention to transformation: The evolving role of solder inte rconnects in High-performance computing URL;VALUE=URI:https://events.vtools.ieee.org/m/514142 X-ALT-DESC:Description: <br /><p class="MsoNormal" style="text-align: justi fy\; text-justify: inter-ideograph\;">Sn-based solder joints have quietly moved along with the progress of electronic packaging\, reliably bridging generations of systems from the eutectic Sn-Pb era to the now-dominant SAC 305 alloy. These interconnects have delivered sufficient mechanical\, ther mal\, and electrical performance while enabling system integration and man ufacturability across multiple technology nodes. But with the rise of arti ficial intelligence (AI) systems and high-performance computing (HPC) plat forms the limits of what solder joints must endure are facing challenges. Increase in current carrying capability for higher power density\, enhance d thermal cycling performance for large size components\, manufacturing ch allenges\, and system-level stress mitigation are stretching SAC305 interc onnects\, which served 30 years in industry\, now to the edge of their cap abilities. This seminar will examine the solder joint microstructure base evolution and the stability mechanism\, the reasons for its decades-long a vailability and also visiting the potential limitations that are now emerg ing under AI systems and high-performance computing (HPC). We will explore degradation mechanisms in conventional solder alloys\, contrast them with low-melting and alternative solder material systems\, and assess how evol ving reliability requirements reshape interconnect strategies. The discuss ion will consider whether conventional solder material can continue to ser ve as the backbone of packaging\, or whether new roles or entirely reimagi ned interconnect solutions will be required to sustain the next era of AI and high-performance electronics.</p> END:VEVENT END:VCALENDAR