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VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Asia/Taipei
BEGIN:STANDARD
DTSTART:19790930T230000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
TZNAME:CST
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BEGIN:VEVENT
DTSTAMP:20260204T095304Z
UID:3E7EF3AB-8B0B-40CF-AFD8-7E4212E80214
DTSTART;TZID=Asia/Taipei:20251125T100000
DTEND;TZID=Asia/Taipei:20251125T113000
DESCRIPTION:As power density in HPC and AI chips increases\, effective ther
 mal management becomes essential to maintain performance and reliability. 
 Thermal Test Chips (TTCs) and Thermal Test Vehicles (TTVs) enable accurate
  emulation and measurement of chip thermal behavior across various sizes a
 nd configurations. With configurable power distribution and high-resolutio
 n temperature sensing\, these tools allow early thermal design optimizatio
 n and material evaluation. TTC- and TTV-based platforms are thus vital for
  developing advanced cooling solutions in modern semiconductor packaging.\
 n\nCo-sponsored by: National Tsing Hua University\, NTHU Department of Pow
 er Mechanical Engineering\n\nSpeaker(s): Dr. Dongkai Shangguan \, \n\nRoom
 : Lecture Hall R107\, Bldg: Engineering Building I\, No. 101\, Section 2\,
  Guangfu Road\, East District\, Hsinchu City\, Taiwan\, Hsinchu\, T&#39;ai-wan
 \, Taiwan\, 300
LOCATION:Room: Lecture Hall R107\, Bldg: Engineering Building I\, No. 101\,
  Section 2\, Guangfu Road\, East District\, Hsinchu City\, Taiwan\, Hsinch
 u\, T&#39;ai-wan\, Taiwan\, 300
ORGANIZER:crkao@ntu.edu.tw
SEQUENCE:23
SUMMARY:Dr. Dongkai Shangguan IEEE EPS Lecture
URL;VALUE=URI:https://events.vtools.ieee.org/m/515815
X-ALT-DESC:Description: &lt;br /&gt;&lt;article class=&quot;text-token-text-primary w-ful
 l focus:outline-none [--shadow-height:45px] has-data-writing-block:pointer
 -events-none has-data-writing-block:-mt-(--shadow-height) has-data-writing
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 idth:40rem] thread-lg:[--thread-content-max-width:48rem] mx-auto max-w-(--
 thread-content-max-width) flex-1 group/turn-messages focus-visible:outline
 -hidden relative flex w-full min-w-0 flex-col agent-turn&quot; tabindex=&quot;-1&quot;&gt;\n
 &lt;div class=&quot;flex max-w-full flex-col grow&quot;&gt;\n&lt;div class=&quot;min-h-8 text-mess
 age relative flex w-full flex-col items-end gap-2 text-start break-words w
 hitespace-normal [.text-message+&amp;amp\;]:mt-1&quot; dir=&quot;auto&quot; data-message-auth
 or-role=&quot;assistant&quot; data-message-id=&quot;c391c570-9ab1-4286-85e2-eec4fcf06106&quot;
  data-message-model-slug=&quot;gpt-5-1&quot;&gt;\n&lt;div class=&quot;flex w-full flex-col gap-
 1 empty:hidden first:pt-[1px]&quot;&gt;\n&lt;div class=&quot;markdown prose dark:prose-inv
 ert w-full break-words light markdown-new-styling&quot;&gt;\n&lt;p data-start=&quot;52&quot; da
 ta-end=&quot;645&quot; data-is-last-node=&quot;&quot; data-is-only-node=&quot;&quot;&gt;As power density in
  HPC and AI chips increases\, effective thermal management becomes essenti
 al to maintain performance and reliability. Thermal Test Chips (TTCs) and 
 Thermal Test Vehicles (TTVs) enable accurate emulation and measurement of 
 chip thermal behavior across various sizes and configurations. With config
 urable power distribution and high-resolution temperature sensing\, these 
 tools allow early thermal design optimization and material evaluation. TTC
 - and TTV-based platforms are thus vital for developing advanced cooling s
 olutions in modern semiconductor packaging.&lt;/p&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n&lt;/div&gt;\n&lt;
 /div&gt;\n&lt;div class=&quot;z-0 flex min-h-[46px] justify-start&quot;&gt;&amp;nbsp\;&lt;/div&gt;\n&lt;/d
 iv&gt;\n&lt;/div&gt;\n&lt;/article&gt;\n&lt;div class=&quot;pointer-events-none h-px w-px&quot; aria-h
 idden=&quot;true&quot; data-edge=&quot;true&quot;&gt;&amp;nbsp\;&lt;/div&gt;
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