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PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
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TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20260308T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
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DTSTART:20251102T010000
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BEGIN:VEVENT
DTSTAMP:20251208T161218Z
UID:1EF7C7AD-CB6C-48B4-85C4-09E3B5732BB1
DTSTART;TZID=America/Los_Angeles:20251203T123000
DTEND;TZID=America/Los_Angeles:20251203T131500
DESCRIPTION:Due to the high volume data processing nature of AI\, the deman
 d of high speed switches with low latency for data centers surges. In this
  talk\, the high-speed channel design and optimization of HPC switches wil
 l be introduced from signal integrity perspectives. Students are expected 
 to know the function of channel components like DSP equalizer\, PCB traces
 \, copper/ optical cables\, ASIC packages\, modulation techniques etc. and
  their correlation to the classes offered in EE.\n\nSpeaker(s): Dr. Ya-Chi
  Liu\, \n\nRoom: VEC 424\, Bldg: Vivian Engineering Center (VEC)\, 1331 Pa
 lo Verde Avenue\, Electrical Engineering Department\, Long beach\, Califor
 nia\, United States\, 90840\, Virtual: https://events.vtools.ieee.org/m/51
 9735
LOCATION:Room: VEC 424\, Bldg: Vivian Engineering Center (VEC)\, 1331 Palo 
 Verde Avenue\, Electrical Engineering Department\, Long beach\, California
 \, United States\, 90840\, Virtual: https://events.vtools.ieee.org/m/51973
 5
ORGANIZER:ava.hedayatipour@csulb.edu
SEQUENCE:7
SUMMARY:Signal Integrity in High Performance Computer Switch Platform Desig
 n-From Microwave to Optical Engineering
URL;VALUE=URI:https://events.vtools.ieee.org/m/519735
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;Due to the high volume data processing nat
 ure of AI\, the demand of high speed switches with low latency for data ce
 nters surges. In this talk\, the high-speed channel design and optimizatio
 n of HPC switches will be introduced from signal integrity perspectives. S
 tudents are expected to know the function of channel components like DSP e
 qualizer\, PCB traces\, copper/ optical cables\, ASIC packages\, modulatio
 n techniques etc. and their correlation to the classes offered in EE.&lt;/p&gt;
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