BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20260308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260204T035225Z UID:8D1B0D8E-54BB-4139-AAE9-2586899A9A26 DTSTART;TZID=America/New_York:20260127T110000 DTEND;TZID=America/New_York:20260127T120000 DESCRIPTION:IEEE EDS Toronto is proud to invite you to a seminar by Dr. Tan Cher Ming of Chang Gung University.\n\nJoin us Monday\, 26 January 2026 a t 4PM (ET) on University of Toronto. Refreshments will be served.\n\nResch edule to Tuesday\, 27 January 2026 at 11AM (ET) due to snow day closure. U pdated Venue: SF2104\n\nAbstract:\n--------------------------------------- ------------------------\n\nPrinted circuit boards (PCBs) are fundamental to all electronic systems\, providing component integration\, electrical i nterconnection\, mechanical support\, and\n\nthermal management. Despite t heir critical role\, PCB reliability has historically received far less at tention than that of electronic components\, particularly active devices. This gap is partly due to the perception of PCBs as mature\, supporting st ructures rather than primary reliability drivers.\n\nHowever\, PCB technol ogies continue to evolve\, especially for mission‑critical applications operating under high temperature\, high humidity\, or radiation‑intensiv e environments. In these conditions\, PCB failure mechanisms can significa ntly influence overall system reliability\, yet published studies remain l imited.\n\nThis talk will present key PCB failure mechanisms and highlight how PCB‑level degradation can propagate to system‑level failures\, dr awing on insights from my recent research. The goal is to encourage engine ers to treat PCBs as integral elements of system reliability analysis\, pa rticularly in high‑reliability and safety‑critical applications.\n\nSp eaker(s): Dr. Tan Cher Ming\n\nRoom: 2104\, Bldg: Standard Fleming\, 10 Ki ng’s College Rd\, Toronto\, Ontario\, Canada\, M5S 3G4 LOCATION:Room: 2104\, Bldg: Standard Fleming\, 10 King’s College Rd\, Tor onto\, Ontario\, Canada\, M5S 3G4 ORGANIZER:jiupeng.zhang@mail.utoronto.ca SEQUENCE:34 SUMMARY:[IEEE CAS04/ED15/EP21/PHO36 Distinguished Lecture] Reliability of A dvanced Circuit Boards URL;VALUE=URI:https://events.vtools.ieee.org/m/524025 X-ALT-DESC:Description: <br /><p style="language: en-CA\; margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-align: left\; direction: ltr \; unicode-bidi: embed\; mso-line-break-override: none\; word-break: norma l\; punctuation-wrap: hanging\;"><span style="font-size: 14pt\; font-famil y: Aptos\; color: black\;">IEEE EDS Toronto is proud to invite you to a se minar by Dr. Tan Cher Ming of Chang Gung University.</span></p>\n<p style= "language: en-CA\; margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in \; text-align: left\; direction: ltr\; unicode-bidi: embed\; mso-line-brea k-override: none\; word-break: normal\; punctuation-wrap: hanging\;"><span style="font-size: 14pt\; font-family: Aptos\; color: black\;">Join us <s> <strong>Monday\, 26 January 2026 at 4PM</strong> (ET)</s> on University of Toronto. Refreshments will be served.&nbsp\;</span></p>\n<div class="hHq9 Z">\n<div data-hveid="CBUQAA" data-ved="2ahUKEwj77pTTx6mSAxV66skDHVaeFyIQl cAGegQIFRAA">\n<div class="KsRP6">\n<div class="MDY31c Sb9BPb">\n<div clas s="QpPSMb">\n<div class="DoxwDb">\n<div class="PZPZlf ssJ7i B5dxMb" role=" heading" aria-level="2" data-attrid="title"><span style="font-size: 14pt\; font-family: Aptos\; color: black\;">Reschedule to <strong>Tuesday\, 27 J anuary 2026 at 11AM (ET)</strong> due to snow day closure. Updated Venue: SF2104</span></div>\n</div>\n<div class="r2VLS">\n<div>\n<div class="y1yad f">\n<div class="CcNe6e v4Zpbe" tabindex="0" role="button" aria-expanded=" false" aria-haspopup="true"><img style="display: block\; margin-left: auto \; margin-right: auto\;" src="https://events.vtools.ieee.org/vtools_ui/med ia/display/278701a9-68d7-4605-8a03-1c8b8fd7710a" width="706" height="396"> </div>\n</div>\n</div>\n</div>\n</div>\n</div>\n</div>\n</div>\n</div>\n<d iv>\n<div class="wPNfjb" data-sd-cp="wPNfjb">&nbsp\;</div>\n</div>\n<div c lass="GRl5yb a8pxAe">\n<div>\n<div class="wPNfjb" data-sd-cp="wPNfjb">\n<d iv id="JTPWx" role="tablist" data-hveid="CB4QAA"></div>\n</div>\n</div>\n< /div>\n<p style="language: en-CA\; margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-align: left\; direction: ltr\; unicode-bidi: embed \; mso-line-break-override: none\; word-break: normal\; punctuation-wrap: hanging\;"><span style="font-size: 18.0pt\; font-family: Aptos\; mso-ascii -font-family: Aptos\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-fami ly: +mn-cs\; mso-ascii-theme-font: minor-latin\; mso-fareast-theme-font: m inor-fareast\; mso-bidi-theme-font: minor-bidi\; color: black\; mso-color- index: 1\; mso-font-kerning: 12.0pt\; language: en-US\; font-weight: bold\ ; mso-style-textfill-type: solid\; mso-style-textfill-fill-themecolor: tex t1\; mso-style-textfill-fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;">Abstract:</span></p>\n<hr>\n<p style="margin-top: 0pt\; margin- bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed\; wo rd-break: normal\;"><span style="color: rgb(0\, 0\, 0)\;"><span style="fon t-size: 12pt\; font-family: Aptos\;">Printed circuit boards (PCBs) are fun damental to all electronic </span><span style="font-size: 12pt\; font-fami ly: Aptos\;">systems\, </span><span style="font-size: 12pt\; font-family: Aptos\;">providing component integration\, electrical interconnection\, me chanical support\, and</span></span></p>\n<p style="margin-top: 0pt\; marg in-bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed\; word-break: normal\;"><span style="color: rgb(0\, 0\, 0)\;"><span style=" font-size: 12pt\; font-family: Aptos\;">thermal management. Despite their critical role\, PCB reliability has historically received far less attenti on than that of electronic components\, particularly</span><span style="fo nt-family: Aptos\; font-size: 12pt\;"> active devices. This gap is partly due to the perception of PCBs as mature\, supporting structures rather tha n primary reliability drivers.</span></span></p>\n<p style="margin-top: 0p t\; margin-bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed\; word-break: normal\;">&nbsp\;</p>\n<p style="margin-top: 0pt\; ma rgin-bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed \; word-break: normal\;"><span style="font-size: 12pt\; font-family: Aptos \; color: rgb(0\, 0\, 0)\;">However\, PCB technologies continue to evolve\ , especially for mission‑critical applications operating under high temp erature\, high humidity\, or radiation‑intensive environments. In these conditions\, PCB failure mechanisms can significantly influence overall sy stem reliability\, yet published studies remain limited.</span></p>\n<p st yle="margin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed\; word-break: normal\;">&nbsp\;</p>\n<p style="m argin-top: 0pt\; margin-bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed\; word-break: normal\;"><span style="font-size: 12pt\; font-family: Aptos\; color: rgb(0\, 0\, 0)\;">This talk will present key PCB failure mechanisms and highlight how PCB‑level degradation can propa gate to system‑level failures\, drawing on insights from my recent resea rch. The goal is to encourage engineers to treat PCBs as integral elements of system reliability analysis\, particularly in high‑reliability and&n bsp\;safety‑critical applications.</span></p>\n<p style="margin-top: 0pt \; margin-bottom: 0pt\; margin-left: 0in\; direction: ltr\; unicode-bidi: embed\; word-break: normal\;">&nbsp\;</p> END:VEVENT END:VCALENDAR