BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20260308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20251102T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260406T171251Z UID:A234018D-F6D0-44FF-A812-87B2FBA3B49D DTSTART;TZID=America/New_York:20260128T120000 DTEND;TZID=America/New_York:20260128T130000 DESCRIPTION:This lecture presents the latest innovations in mmWave antenna- in-package (AiP) technologies as a key enabler of high-performance wireles s communication and sensing systems. It covers advancements in high-freque ncy packaging substrates for compact multi-layer AiP integration\, along w ith signal and power integrity challenges and solutions. The lecture also includes heterogeneous integration approaches\, measurement methodologies and results\, as well as an introduction to the emerging Antennas-to-AI pl atform concept.\n\nVirtual: https://events.vtools.ieee.org/m/524672 LOCATION:Virtual: https://events.vtools.ieee.org/m/524672 ORGANIZER:Riasat.Zaman@ll.mit.edu SEQUENCE:21 SUMMARY:IEEE Virtual YP Seminar: The Evolution of mmWave Antenna-in-Package Toward a Connected Intelligent Future URL;VALUE=URI:https://events.vtools.ieee.org/m/524672 X-ALT-DESC:Description: <br /><p>This lecture presents the latest innovatio ns in mmWave antenna-in-package (AiP) technologies as a key enabler of hig h-performance wireless communication and sensing systems. It covers advanc ements in high-frequency packaging substrates for compact multi-layer AiP integration\, along with signal and power integrity challenges and solutio ns. &nbsp\;The lecture also includes heterogeneous integration approaches\ , measurement methodologies and results\, as well as an introduction to th e emerging Antennas-to-AI platform concept.</p> END:VEVENT END:VCALENDAR