BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Helsinki BEGIN:DAYLIGHT DTSTART:20260329T040000 TZOFFSETFROM:+0200 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:EEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20261025T030000 TZOFFSETFROM:+0300 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:EET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260114T161216Z UID:F3414284-04C2-43E2-9161-0DBE340941B4 DTSTART;TZID=Europe/Helsinki:20260909T210000 DTEND;TZID=Europe/Helsinki:20260911T170000 DESCRIPTION:The IEEE Electronics System-Integration Technology Conference ( ESTC) is a premier biennial international conference focused on the latest advances in electronics packaging and system integration. Established in 2006\, ESTC serves as the flagship European forum for researchers\, engine ers\, and industry professionals to present and discuss cutting-edge resea rch\, development\, and applications spanning advanced packaging\, interco nnects\, manufacturing technologies\, design tools\, reliability\, power e lectronics\, flexible and hybrid systems\, and more. Conference proceeding s are published in IEEE Xplore\, and the event offers opportunities for te chnical exchange\, networking\, and career development\, including student travel awards.\n\n-\nDates: 9 – 11 September 2026\n\n-\nLocation: Helsi nki\, Finland\n\n-\nOrganizer/Sponsors: IEEE Electronics Packaging Society (EPS) and co-sponsored by IMAPS Europe\n\n-\nAbstract/Paper Deadlines: Ab stract submission opens 1 December 2025\; deadline 1 March 2026\n\nESTC is an ideal forum for networking with global experts and staying at the fore front of technological progress in microelectronics and system integration .\n\nAgenda: \nESTC is covering the following topics:\n\nAdvanced Packagin g\n\nChallenges and Solutions in 3D Integration\, Embedded Structures\, Wa fer and Panel Level Packaging\, Hybrid-bonding\, Packaging Solutions for C hiplets\, Advanced Substrates and Interposers Considering Reliability and Quality Aspects\n\nMaterials for Interconnects and Packaging\n\nNew Materi als and Processing – e.g. Phase Change Materials\, Novel Thermal Interfa ce Material\, Low Dimensional Materials\, Metamaterials\, Self-organizing\ , Piezoelectric\, Dielectric and Memory Materials\, Nanomaterials\, Adhesi ves in Advanced Interconnects\, Advanced Interconnection Metallurgical Mat erials and Interconnects\, and Multi-level Interconnects and 3D Stacking M aterials for Heterogeneous Integration\n\nOptoelectronic Systems Packaging \n\nInnovative Packaging Technologies for Quantum Photonic Subsystems\, Hi gh Density Integration Technologies for SiPh (Heterogeneous vs. Hybrids at Wafer-level)\, Glass Substrates\, TGV and Cavities at Wafer-level Suitabl e for Photonic System Integration\, Photonic Polymer Materials and Substra tes\, 2PP and microFAB-3D Systems\, High Precision Assembly Technologies f or Photonic Devices and Subsystems\, Thermal Management Challenges at the System Level\, Reliability Plans for Quantum Photonic Subsystems Working a t Cryogenic Temperatures\, EDA Tools for Packaging\, THz Applications in P hotonics: “Integration of Microwave Photonics with Optoelectronics\, THZ Components“\n\nAssembly and Manufacturing Technologies\n\nAssembly (1) and Manufacturing (2) Technologies: Novel Assembly Technologies\, Manufact uring Aspects to Novel Packaging\, Wafer-level Processing\, D2W Hybrid Ass embly and Integration (1)\, Ultrafine-pitch Assembly of Extremely Small De vices (1)\, Large Component Assembly Challenges (1)\, Massive Parallel Ass embly (1)\, Non-traditional Assembly (e.g. Magnetic\, Fluidic) (1)\, Colle ctive Wiring Technologies (2)\, Quality Assurance for Advanced Manufacturi ng incl. Test (2)\, „Green“ Manufacturing (Strategies and Best Practic e) (2)\n\nDesign Tools and Modeling\n\nDesign and Modelling Techniques Rel ated to Electronics System Integration (This includes but is not limited t o Thermal\, Mechanical\, Electrical\, Multi-physics\, and Multi-scale Mode lling)\, Experimental Validation of Design and Modelling Techniques\, Mach ine Learning and Digital Twins\, Model-order reduction and Stochastic Tech niques\, Co-design for Chip-package Interactions and Heterogeneous Integra tion\, Reliability Models\, Prognostics and Health Management Techniques\n \nPower Electronics System Packaging\n\nHigh Performance Packaging (Low RD S(on)\, Low Rth\, High Temperature\, Fast-switching High-frequency Compati ble)\, Actives and Passives Integration and Miniaturization\, Power Embedd ing\, Very High Voltage Solutions\, Novel Cooling Solutions Incl. Double-s ided Cooling\, Integration Aspects of Wide Bandgap Power Semiconductor Dev ices (e.g. SiC\, GaN\, GaAs)\, Reliability and Prognostics\, Sustainabilit y Aspects (Reduction in the Use of Natural Resources\, Life Cycle Analysis \, Recyclability and Reuse)\n\nAdvanced Technologies for Emerging Systems\ n\nEmerging Packaging Concepts and Technologies for Bio-electronics\, Micr ofluidics\, Wearable Electronics and Sensors/Actuators\, Additive Manufact ering\n\nReliability of Electronic Devices and Systems\n\nNew Results at D ifferent Levels of System Integration (Chip Contacts\, Packages\, Assembli es and Subsystems)\, Characterization and Test\, Failure Diagnostics\, Met hodical and Equipment Developments\, Upcoming Challenges Due to New System Integration Demands\, Innovative Packaging Solutions for Extended Reliabi lity Requirements\n\nFlexible\, Printed and Hybrid Electronics\n\nFlexible Printed and Additive Materials\, Design\, Fabrication Processes\, Compone nts\, Devices and Electronics Systems (e.g. Sensors and Actuators\, PV and Photodetectors\, Signage and Displays\, Energy Harvesting and Storage\, S tructural Electronics\, Lab-on-chip)\, Flexible Hybrid Systems and Process es Integrating Microelectronic Components on Flexible/Stretchable Substrat e in the Broad Range of Applications (e.g. Biotech\, Space\, Automotive\, Consumer Electronic\, Health\, Food & Agriculture\, Environmental Monitori ng)\n\nRF\, mm-wave and THz Systems Packaging\n\nPackaging Technologies fo r RF\, mm-Wave and THz Applications\, Novel SiP Approaches for mm-Wave and THz Array Integration\, High Performance Chip-to-package Interconnects fo r mm-Wave and THz SiPs\, Advanced Modeling and Co-simulation Methodologies of mm-Wave and THz SiPs\, On-chip and On-package Radiating Elements & Ant ennas\, High Accuracy PCB and Assembly Technologies for mm-Wave and THz Si Ps\, Novel Circuits for Built-in-self-test (BIST) of RF\, mm-Wave and THz SiPs\n\nMannerheimintie 13 e\, Helsinki\, Sodra Finlands Lan\, Finland\, 0 0100 LOCATION:Mannerheimintie 13 e\, Helsinki\, Sodra Finlands Lan\, Finland\, 0 0100 ORGANIZER:Toni.Mattila@aalto.fi SEQUENCE:38 SUMMARY:The 11th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026) URL;VALUE=URI:https://events.vtools.ieee.org/m/532884 X-ALT-DESC:Description: <br /><p>The <strong data-start="137" data-end="205 ">IEEE Electronics System-Integration Technology Conference (ESTC)</strong > is a premier biennial international conference focused on the latest adv ances in <strong data-start="287" data-end="335">electronics packaging and system integration</strong>. Established in 2006\, ESTC serves as the fla gship European forum for researchers\, engineers\, and industry profession als to present and discuss cutting-edge <strong data-start="595" data-end= "638">research\, development\, and applications</strong> spanning advanced packaging\, interconnects\, manufacturing technologies\, design tools\, r eliability\, power electronics\, flexible and hybrid systems\, and more. C onference proceedings are published in <strong data-start="836" data-end=" 851">IEEE Xplore</strong>\, and the event offers opportunities for technic al exchange\, networking\, and career development\, including student trav el awards.</p>\n<ul data-start="953" data-end="1378">\n<li data-start="953 " data-end="1027">\n<p data-start="955" data-end="1027"><strong data-start ="955" data-end="965">Dates:</strong> 9 &ndash\; 11 September 2026</p>\n</ li>\n<li data-start="1028" data-end="1101">\n<p data-start="1030" data-end ="1101"><strong data-start="1030" data-end="1043">Location:</strong> Helsi nki\, Finland</p>\n</li>\n<li data-start="1102" data-end="1241">\n<p data- start="1104" data-end="1241"><strong data-start="1104" data-end="1127">Org anizer/Sponsors:</strong> IEEE Electronics Packaging Society (EPS) and co- sponsored by IMAPS Europe</p>\n</li>\n<li data-start="1242" data-end="1378 ">\n<p data-start="1244" data-end="1378"><strong data-start="1244" data-en d="1273">Abstract/Paper Deadlines:</strong> Abstract submission opens 1 De cember 2025\; deadline 1 March 2026</p>\n</li>\n</ul>\n<p data-start="1380 " data-end="1578">ESTC is an ideal forum for networking with global expert s and staying at the forefront of technological progress in <strong data-s tart="1496" data-end="1539">microelectronics and system integration</stron g>.</p><br /><br />Agenda: <br /><p>ESTC is covering the following topics: </p>\n<p><strong>Advanced Packaging</strong></p>\n<p>Challenges and Soluti ons in 3D Integration\, Embedded Structures\, Wafer and Panel Level Packag ing\, Hybrid-bonding\, Packaging Solutions for Chiplets\, Advanced Substra tes and Interposers Considering Reliability and Quality Aspects</p>\n<p><s trong>Materials for Interconnects and Packaging</strong></p>\n<p>New Mater ials and Processing &ndash\; e.g. Phase Change Materials\, Novel Thermal I nterface Material\, Low Dimensional Materials\, Metamaterials\, Self-organ izing\, Piezoelectric\, Dielectric and Memory Materials\, Nanomaterials\, Adhesives in Advanced Interconnects\, Advanced Interconnection Metallurgic al Materials and Interconnects\, and Multi-level Interconnects and 3D Stac king Materials for Heterogeneous Integration</p>\n<p><strong>Optoelectroni c Systems Packaging</strong></p>\n<p>Innovative Packaging Technologies for Quantum Photonic Subsystems\, High Density Integration Technologies for S iPh (Heterogeneous vs. Hybrids at Wafer-level)\, Glass Substrates\, TGV an d Cavities at Wafer-level Suitable for Photonic System Integration\, Photo nic Polymer Materials and Substrates\, 2PP and microFAB-3D Systems\, High Precision Assembly Technologies for Photonic Devices and Subsystems\, Ther mal Management Challenges at the System Level\, Reliability Plans for Quan tum Photonic Subsystems Working at Cryogenic Temperatures\, EDA Tools for Packaging\, THz Applications in Photonics: &ldquo\;Integration of Microwav e Photonics with Optoelectronics\, THZ Components&ldquo\;</p>\n<p><strong> Assembly and Manufacturing Technologies</strong></p>\n<p>Assembly (1) and Manufacturing (2) Technologies: Novel Assembly Technologies\, Manufacturin g Aspects to Novel Packaging\, Wafer-level Processing\, D2W Hybrid Assembl y and Integration (1)\, Ultrafine-pitch Assembly of Extremely Small Device s (1)\, Large Component Assembly Challenges (1)\, Massive Parallel Assembl y (1)\, Non-traditional Assembly (e.g. Magnetic\, Fluidic) (1)\, Collectiv e Wiring Technologies (2)\, Quality Assurance for Advanced Manufacturing i ncl. Test (2)\, &bdquo\;Green&ldquo\; Manufacturing (Strategies and Best P ractice) (2)</p>\n<p><strong>Design Tools and Modeling</strong></p>\n<p>De sign and Modelling Techniques Related to Electronics System Integration (T his includes but is not limited to Thermal\, Mechanical\, Electrical\, Mul ti-physics\, and Multi-scale Modelling)\, Experimental Validation of Desig n and Modelling Techniques\, Machine Learning and Digital Twins\, Model-or der reduction and Stochastic Techniques\, Co-design for Chip-package Inter actions and Heterogeneous Integration\, Reliability Models\, Prognostics a nd Health Management Techniques</p>\n<p><strong>Power Electronics System P ackaging</strong></p>\n<p>High Performance Packaging (Low RDS(on)\, Low Rt h\, High Temperature\, Fast-switching High-frequency Compatible)\, Actives and Passives Integration and Miniaturization\, Power Embedding\, Very Hig h Voltage Solutions\, Novel Cooling Solutions Incl. Double-sided Cooling\, Integration Aspects of Wide Bandgap Power Semiconductor Devices (e.g. SiC \, GaN\, GaAs)\, Reliability and Prognostics\, Sustainability Aspects (Red uction in the Use of Natural Resources\, Life Cycle Analysis\, Recyclabili ty and Reuse)</p>\n<p><strong>Advanced Technologies for Emerging Systems</ strong></p>\n<p>Emerging Packaging Concepts and Technologies for Bio-elect ronics\, Microfluidics\, Wearable Electronics and Sensors/Actuators\, Addi tive Manufactering</p>\n<p><strong>Reliability of Electronic Devices and S ystems</strong></p>\n<p>New Results at Different Levels of System Integrat ion (Chip Contacts\, Packages\, Assemblies and Subsystems)\, Characterizat ion and Test\, Failure Diagnostics\, Methodical and Equipment Developments \, Upcoming Challenges Due to New System Integration Demands\, Innovative Packaging Solutions for Extended Reliability Requirements</p>\n<p><strong> Flexible\, Printed and Hybrid Electronics</strong></p>\n<p>Flexible Printe d and Additive Materials\, Design\, Fabrication Processes\, Components\, D evices and Electronics Systems (e.g. Sensors and Actuators\, PV and Photod etectors\, Signage and Displays\, Energy Harvesting and Storage\, Structur al Electronics\, Lab-on-chip)\, Flexible Hybrid Systems and Processes Inte grating Microelectronic Components on Flexible/Stretchable Substrate in th e Broad Range of Applications (e.g. Biotech\, Space\, Automotive\, Consume r Electronic\, Health\, Food &amp\; Agriculture\, Environmental Monitoring )</p>\n<p><strong>RF\, mm-wave and THz Systems Packaging</strong></p>\n<p> Packaging Technologies for RF\, mm-Wave and THz Applications\, Novel SiP A pproaches for mm-Wave and THz Array Integration\, High Performance Chip-to -package Interconnects for mm-Wave and THz SiPs\, Advanced Modeling and Co -simulation Methodologies of mm-Wave and THz SiPs\, On-chip and On-package Radiating Elements &amp\; Antennas\, High Accuracy PCB and Assembly Techn ologies for mm-Wave and THz SiPs\, Novel Circuits for Built-in-self-test ( BIST) of RF\, mm-Wave and THz SiPs</p> END:VEVENT END:VCALENDAR