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DTSTAMP:20260325T114804Z
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DTSTART;TZID=America/New_York:20260324T183000
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DESCRIPTION:As Moore’s Law reaches its limits\, Copper-to-Copper (Cu-Cu) 
 hybrid bonding is redefining advanced flip-chip assembly with unprecedente
 d interconnect density and electrical performance. This talk explores key 
 hybrid bonding fundamentals\, showcases real-world high-volume manufacturi
 ng products\, and highlights Co-Packaged Optics (CPO) as a breakthrough in
  integrating photonic and electronic ICs for higher efficiency\, lower lat
 ency\, and next-generation data center performance. Join us to glimpse the
  evolving roadmap uniting Cu-Cu bonding and CPO for the future of semicond
 uctor scaling.\n\nCo-sponsored by: ED/SSC Baltimore Chapter\, Photonics Ba
 ltimore Chapter\n\nSpeaker(s): John Lau\, \n\nAgenda: \n6:00 PM - 6:30 PM 
 Networking and Refreshments\n\n6:30 PM Announcements and Introduction\n\n6
 :35 PM - 7:30 PM - Talk and Q &A\n\nBldg: Oakton Library\, 10304 Lynnhaven
  Pl\, Oakton\, Virginia\, United States\, Virtual: https://events.vtools.i
 eee.org/m/539241
LOCATION:Bldg: Oakton Library\, 10304 Lynnhaven Pl\, Oakton\, Virginia\, Un
 ited States\, Virtual: https://events.vtools.ieee.org/m/539241
ORGANIZER:murtyp@ieee.org
SEQUENCE:20
SUMMARY:Advanced Electronic Packaging at Chip Level: Cu-Cu Hybrid Bonding a
 nd Co-Packaged Optics
URL;VALUE=URI:https://events.vtools.ieee.org/m/539241
X-ALT-DESC:Description: <br /><p>As Moore&rsquo\;s Law reaches its limits\,
  Copper-to-Copper (Cu-Cu) hybrid bonding is redefining advanced flip-chip 
 assembly with unprecedented interconnect density and electrical performanc
 e. This talk explores key hybrid bonding fundamentals\, showcases real-wor
 ld high-volume manufacturing products\, and highlights Co-Packaged Optics 
 (CPO) as a breakthrough in integrating photonic and electronic ICs for hig
 her efficiency\, lower latency\, and next-generation data center performan
 ce. Join us to glimpse the evolving roadmap uniting Cu-Cu bonding and CPO 
 for the future of semiconductor scaling.&nbsp\;</p>\n<p>&nbsp\;</p><br /><
 br />Agenda: <br /><p>6:00 PM - 6:30 PM Networking and Refreshments</p>\n<
 p>6:30 PM Announcements and Introduction</p>\n<p>6:35 PM - 7:30 PM - Talk 
 and Q &amp\;A</p>
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