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DTSTAMP:20260326T213542Z
UID:7E698BCF-CE67-4A97-BE24-1776A900BB63
DTSTART;TZID=America/Los_Angeles:20260326T120000
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DESCRIPTION:[]Come join us for lunch\, and this important talk - IN-PERSON 
 ONLY\n\nCo-packaged optics (CPO) are heterogeneous integration packaging m
 ethods to integrate the optical engine (OE) which consists of photonic ICs
  (PIC) such as the photodiode laser\, etc. and the electrical engine (EE) 
 which consists of the electronic ICs (EIC) such as the laser driver\, tran
 simpedance amplifier\, etc. as well as the switch ASIC (application specif
 ic IC). The advantages of CPO are: (a) to reduce the length of the electri
 cal interface between the OE/EE (or PIC/EIC) and the ASIC\, (b) to reduce 
 the energy required to drive the signal\, and (c) to cut the latency which
  leads to better electrical performance. In the next few years\, we will s
 ee more implementations of a higher level of heterogeneous integration of 
 switch\, PIC and EIC\, whether it is for performance\, form factor\, power
  consumption or cost. The content of this lecture:\n— Silicon Photonics\
 n— Data Centers\n— Optical Transceivers\n— Optical Engine (OE) and E
 lectrical Engine (EE)\n— OBO (on-board optics)\n— NPO (near-board opti
 cs)\n— CPO (co-packaged optics)\n— 3D Integration of the PIC and EIC\n
 — 3D Heterogeneous Integration of PIC and EIC\n— 3D Heterogeneous Inte
 gration of ASIC Switch\, PIC and EIC\n— 3D Heterogeneous Integration of 
 ASIC Switch\, PIC and EIC with Bridges\n— 3D Heterogeneous Integration o
 f ASIC Switch\, EIC and PIC embedded in Glass-core Substrate\n— Various 
 Forms of CPO\n\nSpeaker(s): John Lau\, \n\n673 So Milpitas Blvd\, Milpitas
 \, California\, United States\, 95035
LOCATION:673 So Milpitas Blvd\, Milpitas\, California\, United States\, 950
 35
ORGANIZER:p.wesling@ieee.org
SEQUENCE:24
SUMMARY:Co-Packaged Optics: Heterogeneous Integration of Chiplets in Switch
 es\, Photonic ICs and Electronic ICs
URL;VALUE=URI:https://events.vtools.ieee.org/m/539468
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/7fdafb88-2ea5-45c2-9c32-0cdc
 b709fea1&quot; alt=&quot;&quot; width=&quot;500&quot; height=&quot;250&quot;&gt;&lt;em&gt;Come join us for lunch\, and
  this important talk - &lt;strong&gt;IN-PERSON ONLY&lt;/strong&gt;&lt;/em&gt;&lt;/p&gt;\n&lt;p&gt;&lt;stron
 g&gt;Co-packaged optics&lt;/strong&gt; (CPO) are heterogeneous integration packagin
 g methods to integrate the optical engine (OE) which consists of photonic 
 ICs (PIC) such as the photodiode laser\, etc. and the electrical engine (E
 E) which consists of the electronic ICs (EIC) such as the laser driver\, t
 ransimpedance amplifier\, etc. as well as the switch ASIC (application spe
 cific IC). The advantages of CPO are: (a) to reduce the length of the elec
 trical interface between the OE/EE (or PIC/EIC) and the ASIC\, (b) to redu
 ce the energy required to drive the signal\, and (c) to cut the latency wh
 ich leads to better electrical performance. In the next few years\, we wil
 l see more implementations of a higher level of heterogeneous integration 
 of switch\, PIC and EIC\, whether it is for performance\, form factor\, po
 wer consumption or cost. The content of this lecture:&lt;br&gt;&amp;mdash\; Silicon 
 Photonics&lt;br&gt;&amp;mdash\; Data Centers&lt;br&gt;&amp;mdash\; Optical Transceivers&lt;br&gt;&amp;md
 ash\; Optical Engine (OE) and Electrical Engine (EE)&lt;br&gt;&amp;mdash\; OBO (on-b
 oard optics)&lt;br&gt;&amp;mdash\; NPO (near-board optics)&lt;br&gt;&amp;mdash\; CPO (co-packa
 ged optics)&lt;br&gt;&amp;mdash\; 3D Integration of the PIC and EIC&lt;br&gt;&amp;mdash\; 3D H
 eterogeneous Integration of PIC and EIC&lt;br&gt;&amp;mdash\; 3D Heterogeneous Integ
 ration of ASIC Switch\, PIC and EIC&lt;br&gt;&amp;mdash\; 3D Heterogeneous Integrati
 on of ASIC Switch\, PIC and EIC with Bridges&lt;br&gt;&amp;mdash\; 3D Heterogeneous 
 Integration of ASIC Switch\, EIC and PIC embedded in Glass-core Substrate&lt;
 br&gt;&amp;mdash\; Various Forms of CPO&lt;/p&gt;
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