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DTSTAMP:20260226T181550Z
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DESCRIPTION:The semiconductor sector continues to expand rapidly\, supporte
 d by growing needs in AI\, automotive electronics\, and consumer devices. 
 As the limits of traditional scaling become increasingly evident with both
  physically and economically\, advanced packaging is taking center stage a
 s a critical driver of higher performance\, tighter integration\, and furt
 her miniaturization. In this context\, next-generation packaging platforms
  such as panel-level packaging (PLP) and glass core substrates are emergin
 g as key technologies shaping the industry's future direction.\n\nPLP is g
 aining industry interest for its potential to reduce manufacturing costs a
 nd support ultra-large form-factor package. Nevertheless\, its adoption in
 troduces several materials and process challenges\, including warpage mana
 gement\, thermal robustness\, and process compatibility. To overcome the w
 arpage issue\, alternative material like glass core substrate is being exp
 lored for its exceptional dimensional stability and favourable electrical 
 characteristics. Despite core cores advantages\, the use of glass raises p
 ractical concerns in handling\, via creation\, and integration within exis
 ting assembly infrastructures.\n\nThis presentation will delve into these 
 evolving technology pathways\, examining market motivations\, supply-chain
  considerations\, and the broader ecosystem shifts surrounding them. It wi
 ll outline both the opportunities these solutions present and the technica
 l barriers that must be overcome as advanced packaging moves into its next
  phase of development.\n\nCo-sponsored by: Benson Chan\n\nSpeaker(s): YY T
 an\, \n\nAgenda: \nSee LOCATION tab for WebEx info\n\nVirtual: https://eve
 nts.vtools.ieee.org/m/541765
LOCATION:Virtual: https://events.vtools.ieee.org/m/541765
ORGANIZER:bchan@ieee.org
SEQUENCE:83
SUMMARY:AI is Accelerating the Shift to Advanced Packaging with PLP and Gla
 ss Cores 
URL;VALUE=URI:https://events.vtools.ieee.org/m/541765
X-ALT-DESC:Description: <br /><p class="MsoNormal">The semiconductor sector
  continues to expand rapidly\, supported by growing needs in AI\, automoti
 ve electronics\, and consumer devices. As the limits of traditional scalin
 g become increasingly evident with both physically and economically\, adva
 nced packaging is taking center stage as a critical driver of higher perfo
 rmance\, tighter integration\, and further miniaturization. In this contex
 t\, next-generation packaging platforms such as panel-level packaging (PLP
 ) and glass core substrates are emerging as key technologies shaping the i
 ndustry's future direction.</p>\n<p class="MsoNormal">PLP is gaining indus
 try interest for its potential to reduce manufacturing costs and support u
 ltra-large form-factor package. Nevertheless\, its adoption introduces sev
 eral materials and process challenges\, including warpage management\, the
 rmal robustness\, and process compatibility. To overcome the warpage issue
 \, alternative material like glass core substrate is being explored for it
 s exceptional dimensional stability and favourable electrical characterist
 ics. Despite core cores advantages\, the use of glass raises practical con
 cerns in handling\, via creation\, and integration within existing assembl
 y infrastructures.</p>\n<p class="MsoNormal" style="margin-right: 13.5pt\;
 ">This presentation will delve into these evolving technology pathways\, e
 xamining market motivations\, supply-chain considerations\, and the broade
 r ecosystem shifts surrounding them. It will outline both the opportunitie
 s these solutions present and the technical barriers that must be overcome
  as advanced packaging moves into its next phase of development.</p>\n<p>&
 nbsp\;</p><br /><br />Agenda: <br /><p><span style="font-size: 18pt\;">See
  LOCATION tab for WebEx info</span></p>
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